A multilayer film having enhanced toughness and optical properties is provided. The multilayer film includes a base layer, an outer layer, and a tie layer between the base layer and the outer layer. The multilayer film can also include additional layers. Methods for making such multilayer films are also provided. Multilayer films according to the present invention are particularly useful packaging applications where rupture resistance and high clarity are desirable.

Provided is a thermosetting adhesive including: a polyurethane; an isocyanate; an epoxy; and a phenoxy resin, in which dynamic viscoelasticity spectrum of a cured product has a peak indicating a softening temperature in an area of 200° C. or higher and has no peak in an area of 160° C. or lower.

Provided is a thermosetting adhesive including: a polyurethane; an isocyanate; an epoxy; and a phenoxy resin, in which dynamic viscoelasticity spectrum of a cured product has a peak indicating a softening temperature in an area of 200° C. or higher and has no peak in an area of 160° C. or lower.

A method for dielectrically heating foamable composition to foam and set the composition is described. In particular, radio frequency (RF) heating is used to heat the foamable composition to provide insulation in the manufacture of an article.

A method for dielectrically heating foamable composition to foam and set the composition is described. In particular, radio frequency (RF) heating is used to heat the foamable composition to provide insulation in the manufacture of an article.

The present invention relates to an adhesive tape of thickness 40 to 300 μm that can be redetached without residue or destruction by stretching essentially in the plane of the bond, comprising at least one carrier of thickness 10 to 150 μm comprising at least one layer based on preferably uncrosslinked thermoplastic polyurethane that has typically been produced by means of extrusion and has a Shore A hardness of not more than 87, where the carrier has a ratio of force at 400% elongation F.sub.400% to breaking force F.sub.break of not more than 45%, and on which a pressure-sensitive adhesive layer is disposed on at least one side, and wherein the adhesive tape has a ratio of stripping force F.sub.strip to breaking force F.sub.break of less than 60%. The invention also relates to an adhesive tape of thickness 40 to 300 μm that can be redetached without residue or destruction by stretching essentially in the plane of the bond, comprising at least one carrier of thickness 10 to 150 μm comprising at least one layer based on preferably uncrosslinked polyurethane that has been produced from a dispersion and has a modulus at 100% elongation of not more than 1.8 MPa, where the carrier has a ratio of force at 400% elongation F.sub.400% to breaking force F.sub.break of not more than 30%, and on which a pressure-sensitive adhesive layer is disposed on at least one side, and wherein the adhesive tape has a ratio of stripping force F.sub.strip to breaking force F.sub.break of less than 60%. The invention also relates to a process for producing the adhesive tapes and to the use thereof for bonding of components in electronic devices.

An adhesive composition including an epoxy resin, an acrylic resin compatibilized with the epoxy resin, a curing agent, and a foaming agent, wherein, as the epoxy resin, the adhesive composition includes a first epoxy resin with a softening temperature of 50° C. or more and an epoxy equivalent of 5000 g/eq or less, and a second epoxy resin with a softening temperature higher than the first epoxy resin and a weight-average molecular weight of 20,000 or more, and a weight-average molecular weight of the acrylic resin is 50,000 or more.

An adhesive composition including an epoxy resin, an acrylic resin compatibilized with the epoxy resin, a curing agent, and a foaming agent, wherein, as the epoxy resin, the adhesive composition includes a first epoxy resin with a softening temperature of 50° C. or more and an epoxy equivalent of 5000 g/eq or less, and a second epoxy resin with a softening temperature higher than the first epoxy resin and a weight-average molecular weight of 20,000 or more, and a weight-average molecular weight of the acrylic resin is 50,000 or more.

A rigid foam-forming composition including (a) at least one isocyanate component; (b) at least one polyol component; (c) at least one blowing agent; (d) at least one catalyst; (e) at least one surfactant; and (f) at least one silane component. The foam-forming composition provides a foam having an increased adhesion when the foam is adhered to a substrate. The foam-forming composition can be particularly suitable for fabricating a panel structure including a foam core disposed in between a first and second facing material.

A rigid foam-forming composition including (a) at least one isocyanate component; (b) at least one polyol component; (c) at least one blowing agent; (d) at least one catalyst; (e) at least one surfactant; and (f) at least one silane component. The foam-forming composition provides a foam having an increased adhesion when the foam is adhered to a substrate. The foam-forming composition can be particularly suitable for fabricating a panel structure including a foam core disposed in between a first and second facing material.