A component comprising a first outer region (11), at least one intermediate region (13) and a second outer region (12). The outer regions (11, 12) have a higher density and/or a higher elastic modulus than the at least one intermediate region (13). A polymer composition (21) can, preferably, be injected into the component (1) such that a mechanical connection (41) is fixed or can be fixed in the polymer composition (21). A method, a kit and the use thereof are also disclosed.

A multilayer conductive tape includes an adhesive layer, an electrically conductive layer positioned on one side of the adhesive layer, an insulating layer positioned on one side of the electrically conductive layer, and a protective layer for protecting an outer surface of the insulating layer.

A welding film includes a phenoxy resin, in which a z average molecular weight of the phenoxy resin is 70,000 or more, and a ratio [Mz/Mn] between the z average molecular weight and a number average molecular weight of the phenoxy resin is 5.0 or more.

A method of assembling a door on a vehicle begins by identifying critical fit areas between the door seal and the door frame. Pressure indicator tape is adhered to the seal in critical fit areas and the door is closed against the seal to produce a marking on the pressure indicator tape. Intensity of the marking is visually compared to a reference pressure intensity scale to establish an observed pressure intensity level. The observed pressure intensity level may be recorded, correlated to a specific critical fit area and analyzed to make operational and design improvements to the door, door frame or seal.

A method of assembling a door on a vehicle begins by identifying critical fit areas between the door seal and the door frame. Pressure indicator tape is adhered to the seal in critical fit areas and the door is closed against the seal to produce a marking on the pressure indicator tape. Intensity of the marking is visually compared to a reference pressure intensity scale to establish an observed pressure intensity level. The observed pressure intensity level may be recorded, correlated to a specific critical fit area and analyzed to make operational and design improvements to the door, door frame or seal.

A flexible chemiresistor (CR) sensor for sensing a molecule of interest in a fluid (liquid or gas) is provided. The flexible CR sensor comprises a flexible chemiresistor (CR) module. The flexible CR module comprises a flexible substrate such polyethylene terephthalate (PET), polyethylene naphthalate (PEN) or polyimide (PI), and a thin film nanoparticle assembly assembled on the flexible substrate. The thin film nanoparticle assembly comprises metal or metal alloy core, ligand-capped nanoparticles and molecular linkers connecting the nanoparticles. The flexible CR sensor and an intelligent pattern recognition engine can be incorporated in a handheld device that can detect a molecule of interest in a fluid (e.g., a liquid or gas) accurately, rapidly, and without false positives. Any sensing array nanomaterial, pattern recognition, and compact/or electronic hardware can be integrated to achieve a desired detection limit and response speed.

A composite comprising adhered components and method of refurbishing such composites are described herein. The composite includes a first component, a second component, and the first component being adhered to the second component using an adhesive stack. The adhesive stack comprises a first adhesive-impregnated scrim layer disposed between the first component and the second component and a bulk adhesive layer disposed between the first component and the second component.

Applying heat activatable adhesive to a substrate, the adhesive is solid at ambient temperature and can be melted at a temperature below its heat activation temperature wherein the adhesive formulation is supplied to a hot melt applicator where it is heated to above its melting point and below its activation temperature and the melt viscosity of the molten adhesive is controlled so that it can be ejected from the hot melt applicator onto a substrate to provide a coherent bead that adheres to the substrate and is dry to the touch on cooling and upon activation the adhesive is capable of expanding with a volume expansion greater than about 250%.

This adhesively joined structure includes a first member having a metal portion and a film portion disposed on at least a part of a surface of the metal portion; a second member; an adhesive layer for joining the first member and the second member to each other via the film portion. The film portion includes an organic resin phase containing one or more of a urethane group, an epoxy group, and an ester group; an organic compound phase formed of an organic silicon compound; and optionally an inorganic compound phase formed of an inorganic silicon compound. The total volume percentage of the organic compound phase and the inorganic compound phase to the total volume of the film portion is 16 vol % to 84 vol %. The volume percentage of the organic compound phase to the total volume of the film portion is 16 vol % to 84 vol %. The volume percentage of the inorganic compound phase to the total volume of the film portion is limited to 10 vol % or less. The organic silicon compound includes a SiC bond; and a SiO bond or a SiOH bond or a a combination thereof.

This adhesively joined structure includes a first member having a metal portion and a film portion disposed on at least a part of a surface of the metal portion; a second member; an adhesive layer for joining the first member and the second member to each other via the film portion. The film portion includes an organic resin phase containing one or more of a urethane group, an epoxy group, and an ester group; an organic compound phase formed of an organic silicon compound; and optionally an inorganic compound phase formed of an inorganic silicon compound. The total volume percentage of the organic compound phase and the inorganic compound phase to the total volume of the film portion is 16 vol % to 84 vol %. The volume percentage of the organic compound phase to the total volume of the film portion is 16 vol % to 84 vol %. The volume percentage of the inorganic compound phase to the total volume of the film portion is limited to 10 vol % or less. The organic silicon compound includes a SiC bond; and a SiO bond or a SiOH bond or a a combination thereof.