The invention relates to a process for producing a vulcanizable composite material, comprising the steps of: a) producing or providing a textile strength member, b) treating the textile strength member with an aqueous dispersion for adhesive activation of the textile strength member and to obtain an adhesion-activated textile strength member and c) introducing the adhesion-activated textile strength member into a crosslinkable rubberization mixture to obtain the vulcanizable composite material, wherein the aqueous dispersion is essentially free of free resorcinol and resorcinol precondensates, especially resorcinol-formaldehyde precondensates, and is free of free formaldehyde and formaldehyde-releasing substances, wherein the crosslinkable rubberization mixture is processible by vulcanization to give a crosslinked rubberization mixture which is at least partly transmissive to visible light at least in sections.

Bonding dissimilar materials of medical device components can be carried out by applying an adhesive on at least one surface of two components which are composed of dissimilar materials and contacting the surfaces and exposing the contacted surfaces to heat and/or irradiate the adhesive to cure the adhesive and bond the surfaces. One medical component, e.g., medical tubing, can be composed of a non-polar, polyvinyl chloride free thermoplastic polymeric material and the other medical component, e.g., a medical connector, can be composed of polyacrylate, polyacrylonitrile, acrylonitrile-butadiene-styrene (ABS), methyl methacrylate-acrylonitrile-butadiene-styrene (mABS), polyester, and/or a polycarbonate material. The adhesive formulation can include: (a) a polyolefin oligomer having reactive acrylate groups and alkenyl groups, (b) an initiator, and optionally (c) a solvent.

Bonding dissimilar materials of medical device components can be carried out by applying an adhesive on at least one surface of two components which are composed of dissimilar materials and contacting the surfaces and exposing the contacted surfaces to heat and/or irradiate the adhesive to cure the adhesive and bond the surfaces. One medical component, e.g., medical tubing, can be composed of a non-polar, polyvinyl chloride free thermoplastic polymeric material and the other medical component, e.g., a medical connector, can be composed of polyacrylate, polyacrylonitrile, acrylonitrile-butadiene-styrene (ABS), methyl methacrylate-acrylonitrile-butadiene-styrene (mABS), polyester, and/or a polycarbonate material. The adhesive formulation can include: (a) a polyolefin oligomer having reactive acrylate groups and alkenyl groups, (b) an initiator, and optionally (c) a solvent.

This adhesively joined structure includes a first member having a metal portion and a film portion disposed on at least a part of a surface of the metal portion; a second member; an adhesive layer for joining the first member and the second member to each other via the film portion. The film portion includes an organic resin phase containing one or more of a urethane group, an epoxy group, and an ester group; an organic compound phase formed of an organic silicon compound; and optionally an inorganic compound phase formed of an inorganic silicon compound. The total volume percentage of the organic compound phase and the inorganic compound phase to the total volume of the film portion is 16 vol % to 84 vol %. The volume percentage of the organic compound phase to the total volume of the film portion is 16 vol % to 84 vol %. The volume percentage of the inorganic compound phase to the total volume of the film portion is limited to 10 vol % or less. The organic silicon compound includes a SiC bond; and a SiO bond or a SiOH bond or a combination thereof.

This adhesively joined structure includes a first member having a metal portion and a film portion disposed on at least a part of a surface of the metal portion; a second member; an adhesive layer for joining the first member and the second member to each other via the film portion. The film portion includes an organic resin phase containing one or more of a urethane group, an epoxy group, and an ester group; an organic compound phase formed of an organic silicon compound; and optionally an inorganic compound phase formed of an inorganic silicon compound. The total volume percentage of the organic compound phase and the inorganic compound phase to the total volume of the film portion is 16 vol % to 84 vol %. The volume percentage of the organic compound phase to the total volume of the film portion is 16 vol % to 84 vol %. The volume percentage of the inorganic compound phase to the total volume of the film portion is limited to 10 vol % or less. The organic silicon compound includes a SiC bond; and a SiO bond or a SiOH bond or a combination thereof.