A composition for a film adhesive, an ink binder, or a coating agent based on a polyurethane resin having excellent heat resistance and surface hardness and good adhesiveness to various substrates. A composition containing a polyurethane resin (X) and a crosslinking agent (Y), in which the polyurethane resin (X) contains a polycarbonate polyol (A), an organic diisocyanate (B), and a chain extender (C) as copolymerization components, characterized in that the glass transition temperature of the polyurethane resin (X) is 50° C. or higher, that the polycarbonate polyol (A) contains 60 mol % or more of a specific structure, and that the composition contains 1 to 30 parts by mass of the crosslinking agent (Y) with respect to 100 parts by mass of the polyurethane resin (X).

A (meth)acrylic adhesive film, an optical member including the same, and an optical display apparatus including the same are provided. The (meth)acrylic adhesive film includes organic particles, and further includes greater than 0 wt % to 5 wt % of inorganic particles. The (meth)acrylic adhesive film has a haze of 1% or less and an initial dent formation height of 4.5 cm or more.

Provided is a multi-layered anisotropic conductive adhesive including an upper conductive adhesive layer, a conductive fabric layer with two sides and a lower conductive adhesive layer, wherein one side of the conductive fabric layer is plated with metal. In the application of a flexible printed circuit, reinforced parts, formed by laminating multi-layered anisotropic conductive adhesive with steel or polyimide-type stiffener, can effectively prevent the deformation of installed parts due to warping, and ensure the good hole filling, good direct grounding effect, and good shielding performance. Therefore, the multi-layered anisotropic conductive adhesive has good electrical properties, good adhesive strength, better tin soldering, reliability and flame resistant. Also provided is a method of producing the multi-layered anisotropic conductive adhesive.

Provided is a multi-layered anisotropic conductive adhesive including an upper conductive adhesive layer, a conductive fabric layer with two sides and a lower conductive adhesive layer, wherein one side of the conductive fabric layer is plated with metal. In the application of a flexible printed circuit, reinforced parts, formed by laminating multi-layered anisotropic conductive adhesive with steel or polyimide-type stiffener, can effectively prevent the deformation of installed parts due to warping, and ensure the good hole filling, good direct grounding effect, and good shielding performance. Therefore, the multi-layered anisotropic conductive adhesive has good electrical properties, good adhesive strength, better tin soldering, reliability and flame resistant. Also provided is a method of producing the multi-layered anisotropic conductive adhesive.

Disclosed are a method of preparing an elastic pressure-sensitive adhesive tape and an elastic pressure-sensitive adhesive tape. Main components of the adhesive include a polyacrylate resin with a carbon-carbon double bond and a diluent monomer with a carbon-carbon double bond. A quasi-microcapsule powder component is adopted, wherein the shell material of the quasi-microcapsule powder selects a cellulose-based water soluble polymer, and the core material selects low boiling point alkane, wherein the preparation method combines UV curing, heating, and shell burst, to obtain an elastic adhesive layer, whereby to prepare a pressure-sensitive adhesive tape product. Compared with conventional elastic pressure-sensitive adhesive tapes, the preparing method as disclosed has a simple manufacturing process. The pressure-sensitive adhesive tape obtained from the disclosed preparing method overcomes the restrictions of conventional foam strips and provide good cushioning and compression properties without using foam as the carrier.

Provided is a resin composition having excellent dielectric characteristics, i.e., low dielectric characteristics, in the high-frequency region, and excellent dielectric characteristics, i.e., low dielectric characteristics, under high humidity, and having practical adhesion to metal and resin substrates. More specifically, provided is a resin composition comprising an acid-modified polyolefin, an epoxy resin, and an inorganic filler, wherein a cured product of the resin composition has a dielectric loss tangent of 0.003 or less at a frequency of 10 GHz at 25° C. after storage for 168 hours under conditions of 85° C. and 85% RH (relative humidity).

Provided is a resin composition having excellent dielectric characteristics, i.e., low dielectric characteristics, in the high-frequency region, and excellent dielectric characteristics, i.e., low dielectric characteristics, under high humidity, and having practical adhesion to metal and resin substrates. More specifically, provided is a resin composition comprising an acid-modified polyolefin, an epoxy resin, and an inorganic filler, wherein a cured product of the resin composition has a dielectric loss tangent of 0.003 or less at a frequency of 10 GHz at 25° C. after storage for 168 hours under conditions of 85° C. and 85% RH (relative humidity).

A spacer for insulating glass units, includes a polymeric hollow profile extending in the longitudinal direction and including a first and second side wall, a glazing interior wall connecting connects the side walls to one another; an outer wall arranged substantially parallel to the glazing interior wall and connects the side walls to one another; a cavity surrounded by the side walls, the glazing interior wall, and the outer wall, a moisture barrier on the first side wall, the outer wall, and the second side wall of the polymeric hollow body, wherein the moisture barrier include a multi-layer system having a barrier function including a polymeric layer and an inorganic barrier layer, a metallic or ceramic outer adhesive layer, wherein the adhesive layer has a thickness d of at least 5 nm, the adhesive layer is interrupted in the transverse direction by uncoated regions.

A spacer for insulating glass units, includes a polymeric hollow profile extending in the longitudinal direction and including a first and second side wall, a glazing interior wall connecting connects the side walls to one another; an outer wall arranged substantially parallel to the glazing interior wall and connects the side walls to one another; a cavity surrounded by the side walls, the glazing interior wall, and the outer wall, a moisture barrier on the first side wall, the outer wall, and the second side wall of the polymeric hollow body, wherein the moisture barrier include a multi-layer system having a barrier function including a polymeric layer and an inorganic barrier layer, a metallic or ceramic outer adhesive layer, wherein the adhesive layer has a thickness d of at least 5 nm, the adhesive layer is interrupted in the transverse direction by uncoated regions.

An adhesive composition is provided and includes the following components (A) to (D): (A) a radically polymerizable compound; (B) (B-1) a polymer consisting of at least one repeat unit derived from a polymerizable compound of formula (I), or (B-2) a polymer consisting of at least one repeat unit derived from a polymerizable compound of formula (I), and at least one repeat unit derived from another radically polymerizable compound; (C) a polymerization initiator; and (D) a reducing agent.

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