The present invention relates to an adhesive tape and to a method for jacketing an elongated item, more particularly cable sets. The adhesive tape must cure within the operational dictates for further processing, e.g. within 6 min, and after curing must exhibit the required dimensional stability properties. However, the adhesive compositions must not cure during storage itself, since otherwise they can no longer be used. Nor may the curing temperatures be too high, since otherwise the lead insulation, which is often made of PVC, may suffer damage. The invention proposes a method for jacketing an elongated item such as more particularly leads or cable sets, where a tape which comprises a moisture-curing binder on a carrier is first impregnated with water and immediately thereafter is guided in a helical line around the elongated item or the elongated item is wrapped in an axial direction by the adhesive tape, the elongated item together with the adhesive tape wrapping is brought into the desired disposition, more particularly into the cable set plan, the elongated item is held in this disposition, while the curable adhesive cures. Alternatively proposed is a method for jacketing an elongated item such as more particularly leads or cable sets, where a tape which comprises a moisture-curing binder on a carrier is guided in a helical line around the elongated item or the elongated item is wrapped in an axial direction by the adhesive tape, the elongated item together with the adhesive tape wrapping is brought into the desired disposition, more particularly into the cable set plan, the elongated item is held in this disposition, and the curable adhesive is brought to cure by the supply of moisture.

A thermosetting adhesive sheet capable of reducing semiconductor wafer warping and chipping and a method for manufacturing a semiconductor device includes a thermosetting adhesive layer formed from a resin composition containing a resin component and a filler, the resin component containing an epoxy compound and a curing agent, a total value obtained by multiplying the reciprocal of epoxy equivalent of the epoxy compound by content of the epoxy compound in the resin component being 1.15E−04 or more, and blending amount of the filler being 50 pts. mass or more with respect to 100 pts. mass of the resin component; the thermosetting adhesive sheet is applied to a ground surface of a semiconductor and cured before dicing.

A thermosetting adhesive sheet capable of reducing semiconductor wafer warping and chipping and a method for manufacturing a semiconductor device includes a thermosetting adhesive layer formed from a resin composition containing a resin component and a filler, the resin component containing an epoxy compound and a curing agent, a total value obtained by multiplying the reciprocal of epoxy equivalent of the epoxy compound by content of the epoxy compound in the resin component being 1.15E−04 or more, and blending amount of the filler being 50 pts. mass or more with respect to 100 pts. mass of the resin component; the thermosetting adhesive sheet is applied to a ground surface of a semiconductor and cured before dicing.

The present invention provides an electrical debonding type adhesive sheet capable of producing a joined body in which a voltage can be stably applied to an electrical debonding type adhesive layer. An electrical debonding type adhesive sheet according to a first embodiment of the present invention includes a first adhesive layer, a substrate for voltage application including an electroconductive layer and a base layer, and a second adhesive layer in this order, and has a first protrudent part, in which the first adhesive layer and the substrate for voltage application extend and protrude with respect to the second adhesive layer, and a second protrudent part, in which the substrate for voltage application extends from the first protrudent part and protrudes with respect to the first adhesive layer.

The invention provides a laminated body having an excellent adhesive force with respect to a low-polarity metal member in the presence of hot water. The laminated body contains a resin substrate; an easily adhesive layer provided on at least one surface of the resin substrate; and an adhesive resin layer provided on a surface of the easily adhesive layer on a side opposite to the resin substrate, wherein the adhesive resin layer contains a polyolefin having at least one group selected from the group consisting of an acidic group and an acid anhydride group and having an acid value of 0.01 mgKOH/g to 6.5 mgKOH/g; and the laminated body is used for bonding a metal member having a ratio of a dipole term in surface free energy of 0.01% to 5.0%.

The invention provides a laminated body having an excellent adhesive force with respect to a low-polarity metal member in the presence of hot water. The laminated body contains a resin substrate; an easily adhesive layer provided on at least one surface of the resin substrate; and an adhesive resin layer provided on a surface of the easily adhesive layer on a side opposite to the resin substrate, wherein the adhesive resin layer contains a polyolefin having at least one group selected from the group consisting of an acidic group and an acid anhydride group and having an acid value of 0.01 mgKOH/g to 6.5 mgKOH/g; and the laminated body is used for bonding a metal member having a ratio of a dipole term in surface free energy of 0.01% to 5.0%.

A polyurethane foam may include an isocyanate polymer component and a polyol component. The polyol component may include a polyol having a molecular weight of at least about 500 kg/mol and not greater than about 6000 kg/mol. The polyurethane foam may have an elongation of at least about 500%. The polyurethane foam may further have a density of at least about 250 g/L and a tensile strength of not greater than about 1000 kPa.

A polyurethane foam may include an isocyanate polymer component and a polyol component. The polyol component may include a polyol having a molecular weight of at least about 500 kg/mol and not greater than about 6000 kg/mol. The polyurethane foam may have an elongation of at least about 500%. The polyurethane foam may further have a density of at least about 250 g/L and a tensile strength of not greater than about 1000 kPa.

A friction pad (12) for inhibiting movement of a device (10) relative to an engagement surface (16) includes a pad body (18) and an adhesive material (232). The pad body (18) has a first body surface (20) and an opposed second body surface (22). The first body surface (20) is configured to be coupled to an outer surface (14) of the device (10). The second body surface (22) is configured to engage the engagement surface (16). The pad body (18) is formed at least in part from a body material (18A) including high-density polyethylene. The second body surface (22) of the pad body (18) has a static coefficient of friction of at least approximately 1.0. The second body surface (22) includes a plurality of spaced apart surface features (234), each of the plurality of surface features (234) having a feature height (358) of between approximately 0.15 millimeters and 1.00 millimeters. The adhesive material (232) is positioned on the first body surface (20) such that the first body surface (20) is configured to be fixedly coupled to the outer surface (14) of the device (10).

A friction pad (12) for inhibiting movement of a device (10) relative to an engagement surface (16) includes a pad body (18) and an adhesive material (232). The pad body (18) has a first body surface (20) and an opposed second body surface (22). The first body surface (20) is configured to be coupled to an outer surface (14) of the device (10). The second body surface (22) is configured to engage the engagement surface (16). The pad body (18) is formed at least in part from a body material (18A) including high-density polyethylene. The second body surface (22) of the pad body (18) has a static coefficient of friction of at least approximately 1.0. The second body surface (22) includes a plurality of spaced apart surface features (234), each of the plurality of surface features (234) having a feature height (358) of between approximately 0.15 millimeters and 1.00 millimeters. The adhesive material (232) is positioned on the first body surface (20) such that the first body surface (20) is configured to be fixedly coupled to the outer surface (14) of the device (10).