Patent classifications
C09J7/30
ADHESIVE SHEET LAMINATE AND METHOD FOR MANUFACTURING SAME
The present invention relates to an adhesive sheet laminate which comprises a substrate layer composed of a thermoplastic resin composition (A) containing a polypropylene-based resin as a main component, an adhesive layer composed of a thermoplastic resin composition (B) containing a specific thermoplastic resin (b) as a main component and having a melt flow rate of 0.1 to 30 g/10 min, and a release layer composed of a thermoplastic resin composition (C) containing a specific thermoplastic resin (c) as a main component and having a melt flow rate of 0.1 to 30 g/10 min, and which has a tensile elastic modulus of 2000 MPa or more.
POLYURETHANE-BASED ADHESIVE COMPOSITION, SURFACE PROTECTION FILM COMPRISING SAME, METHOD FOR MANUFACTURING SURFACE PROTECTION FILM, AND METHOD FOR MANUFACTURING ORGANIC LIGHT-EMITTING ELECTRONIC DEVICE
The present specification relates to a polyurethane-based adhesive composition, a surface protective film comprising the same, a method for preparing a surface protective film, and a method for manufacturing an organic light emitting electronic device.
BANDAGE, HOT-MELT ADHESIVE FOR PRODUCING A BANDAGE,USE AND METHOD FOR THE PRODUCTION OF A HOT-MELT ADHESIVE
The invention relates to the technical field of cohesive bandages. The invention relates to a bandage comprising a flat web material as a substrate, both main sides of the substrate being coated at least partially with a hot-melt adhesive. The invention also relates to a hot-melt adhesive for producing a bandage, to the use of a hot-melt adhesive for producing bandages, and to a method for producing a bandage. The hot-melt adhesive is based on a first polyolefin having—a proportion of 1-butene-derived monomer units; a proportion of ethylene-derived monomer units; and the hot-melt adhesive further comprises: at least one tackifier consisting of hydrocarbon resin and/or of hydrogenated hydrocarbon resin. The hot-melt adhesive can also contain a second polyolefin, preferably an amorphous polypropylene homo- or copolymer.
FOAMING ADHESIVE SHEET AND METHOD FOR PRODUCING PRODUCT
A foaming adhesive sheet comprising a substrate and an adhesive layer placed on at least one surface side of the substrate; wherein the adhesive layer includes a curable adhesive, and a foaming agent; and a peeling force of a surface side where the adhesive layer is placed, measured by SAICAS (Surface And Interfacial Cutting Analysis System) method is 2.0 N or more.
FOAMING ADHESIVE SHEET AND METHOD FOR PRODUCING PRODUCT
A foaming adhesive sheet comprising a substrate and an adhesive layer placed on at least one surface side of the substrate; wherein the adhesive layer includes a curable adhesive, and a foaming agent; and a peeling force of a surface side where the adhesive layer is placed, measured by SAICAS (Surface And Interfacial Cutting Analysis System) method is 2.0 N or more.
AUXILIARY TAPE FOR FIBER-REINFORCED COMPOSITE MATERIAL PROCESSING AND MACHINING METHOD
An auxiliary tape for fiber-reinforced composite material processing, having a first adhesive layer having an adhesive force A.sub.1 at 23° C. to a fiber-reinforced composite material of 0.5 N/20 mm or more and an adhesive force A.sub.2 at 90° C. to the fiber-reinforced composite material of 0.1 N/20 mm or more.
HIGH-FREQUENCY DIELECTRIC HEATING ADHESIVE SHEET
A high-frequency-dielectric-heating-adhesive-sheet includes: a first adhesive layer containing a first thermoplastic resin; a second adhesive layer containing a second thermoplastic resin; and an intermediate layer, a ratio DPM/DP1 of dielectric property DPM of the intermediate layer to dielectric property DP1 of the first adhesive layer and a ratio DPM/DP2 of the dielectric property DPM of the intermediate layer to dielectric property DP2 of the second adhesive layer are each less than one, and the dielectric property DP1, the dielectric property DP2, and the dielectric property DPM are values of dielectric property (tanδ/ε’r) of the first adhesive layer, the second adhesive layer, and the intermediate layer, respectively. tanδ denotes a dielectric dissipation factor at 23° C. and a frequency of 40.68 MHz and ε‘r denotes a relative permittivity at 23° C. and the frequency of 40.68 MHz.
ELECTROCONDUCTIVE FILM, ROLL, CONNECTED STRUCTURE, AND PROCESS FOR PRODUCING CONNECTED STRUCTURE
A conductive film includes an elongated release film and a plurality of conductive adhesive film pieces provided on the release film. Then, the plurality of adhesive film pieces are arranged in a longitudinal direction X of the release film. For this reason, the adhesive film piece can be set to an arbitrary shape. Accordingly, it is possible to attach the adhesive film piece to adhesive surfaces having various shapes and to efficiently use the adhesive film piece.
ELECTROCONDUCTIVE FILM, ROLL, CONNECTED STRUCTURE, AND PROCESS FOR PRODUCING CONNECTED STRUCTURE
A conductive film includes an elongated release film and a plurality of conductive adhesive film pieces provided on the release film. Then, the plurality of adhesive film pieces are arranged in a longitudinal direction X of the release film. For this reason, the adhesive film piece can be set to an arbitrary shape. Accordingly, it is possible to attach the adhesive film piece to adhesive surfaces having various shapes and to efficiently use the adhesive film piece.
ADHESIVE COMPOSITION, AND COVERLAY FILM AND PRINTED CIRCUIT BOARD THAT INCLUDE THE SAME
An adhesive composition, and a coverlay film and a printed circuit board that include the adhesive composition are disclosed. The adhesive composition includes: (a) an epoxy resin; and (b) a binder resin including epoxidized polybutadiene rubber and at least two kinds of rubber. The adhesive composition can form an adhesive layer superb in terms of adhesiveness, fluidity, filling properties (landfilling), migration resistance, heat resistance, flame retardancy, low elongation, and flexibility.