A multilayer tape according to an embodiment of the present disclosure includes: an adhesive layer including an epoxy; and an electromagnetic interference (EMI) absorption layer disposed on the adhesive layer and including a thermoset epoxy resin and a plurality of magnetic metal particles which are distributed in the thermoset epoxy resin, and the magnetic metal particles include iron, and a ratio of a gross weight of the plurality of magnetic metal particles to a gross weight of the EMI absorption layer is higher than bout 40%, and a peel strength of the adhesive layer and the EMI absorption layer after the adhesive layer is cured is about 5 times or more greater than a peel strength of the adhesive layer and the EMI absorption layer before the adhesive layer is cured.

A multilayer tape according to an embodiment of the present disclosure includes: an adhesive layer including an epoxy; and an electromagnetic interference (EMI) absorption layer disposed on the adhesive layer and including a thermoset epoxy resin and a plurality of magnetic metal particles which are distributed in the thermoset epoxy resin, and the magnetic metal particles include iron, and a ratio of a gross weight of the plurality of magnetic metal particles to a gross weight of the EMI absorption layer is higher than bout 40%, and a peel strength of the adhesive layer and the EMI absorption layer after the adhesive layer is cured is about 5 times or more greater than a peel strength of the adhesive layer and the EMI absorption layer before the adhesive layer is cured.

Disclosed herein are improved waterproof seam tapes and methods of producing the same.

Disclosed herein are improved waterproof seam tapes and methods of producing the same.

A sealing patch for a polymeric bag includes a carrier, a pressure sensitive adhesive on the carrier and a heat-activated material on the pressure sensitive adhesive. A high-strength polymeric bag is formed from woven tapes and is coated with a polymer material. The sealing patch is positioned on the bag for sealing the bag. A method for sealing a high-strength polymeric bag with a sealing patch and a device for sealing a polymeric bag with a sealing patch are disclosed.

An aqueous adhesive composition includes: a phenol/aldehyde resin; and an unsaturated elastomer latex. The phenol/aldehyde resin is based on: an aromatic polyaldehyde bearing at least two aldehyde functional groups and including at least one aromatic nucleus; and a polyphenol including at least one aromatic nucleus. If there is just one aromatic nucleus, the nucleus bears two or three hydroxyl functional groups in a meta position with respect to each other or with respect to one another, with a remainder of the nucleus being unsubstituted. If there are plural aromatic nuclei, at least two of the nuclei each bear two or three hydroxyl functional groups in the meta position with respect to each other or with respect to one another, with two positions ortho to at least one of these hydroxyl functional groups being unsubstituted. The adhesive composition is useable to adhere a textile material to a crosslinkable rubber composition.

The invention relates to a polymer obtainable by the radical polymerization of at least one monomer, namely one or more (meth)acrylate monomers and optionally, in addition, vinylic comonomers, wherein the polymer has a molar mass M.sub.W of at least 5,000 g/mol and at most 200,000 g/mol and at least one of the monomers is functionalized with at least one epoxy group, wherein the proportion of the epoxide-functionalized monomer(s) (a) is more than 30 wt %.

Provided is a solder transfer sheet which is capable of increasing the amount of solder to be transferred without the occurrence of bridging. A solder transfer sheet 1A includes a base material 5, an adhesive layer 4 formed on the surface of the base material 5, a solder powder-containing adhesive layer 3 formed on the surface of the adhesive layer 4, and a solder powder layer 2 formed on the surface of the solder powder-containing adhesive layer 3. In the solder powder layer 2, particles of solder powder 20 are arranged in a one-layer sheet form. In the solder powder-containing adhesive layer 3, solder powder 30 and an adhesive component 31 are mixed so as to have such a thickness that two or more layers of the solder powder 30 are stacked.

An encapsulant sheet suitable for encapsulating a light-emitting element in, for example, a self-luminous display or for direct backlights. The encapsulant sheet is a single-layer or multi-layer resin sheet that includes an adhesive layer exposed at a topmost surface. The Vicat softening point is greater than 60° C. and no higher than 100° C. The melt viscosity of the encapsulant sheet, at a shear velocity of 2.43×10 sec.sup.−1 and measured at a temperature of 120° C. is at least 5.0×10.sup.4 poise and no more than 1.0×10.sup.5 poise. The adhesive layer contains a polyolefin and a silane component, and a content of the silane component relative to the resin component of the adhesive layer is at least 0.03% by mass and less than 10% by mass.

Poly(tetramethyl-p-silphenylenesiloxane) (PTMPS) membranes and porous articles made therefrom that have a matrix tensile strength in at least one direction from about 1 MPa to about 50 MPa, a matrix modulus greater than about 100 MPa in at least one direction, a porosity greater than about 30%, and a microstructure of nodes interconnected by fibrils are provided. The PTMPS polymer forming the PTMPS membranes and porous articles has a crystallinity of at least about 70%, a polydispersity from 1 to 5, and a weight average molecular weight from about 350 kDa to about 5 MDa. The PTMPS membranes may be asymmetric, meaning that the observed pore structure on one side of the PTMPS membrane is different than the pore structure on the opposing side of the PTMPS membrane. Methods of forming porous PTMPS articles are provided. Dense PTMPS articles and methods of making the same are also provided.