An adhesive film for a display includes a first adhesive layer including an adhesive resin; a water-vapor barrier layer disposed on the first adhesive layer; a second adhesive layer disposed on the water-vapor barrier layer and including an adhesive resin; and an optical film disposed on the second adhesive layer, wherein at least one layer of the first adhesive layer or the water-vapor barrier layer contains at least one tungsten oxide selected from a group consisting of cesium-doped tungsten oxide (CWO; cesium-doped WO.sub.3) and tungsten oxide (WO.sub.3).

Provided is a film for manufacturing a semiconductor part in which an evaluation step accompanied with a temperature change, a segmenting step, and a pickup step can be commonly performed, a method for manufacturing a semiconductor part, a semiconductor part, and an evaluation method. The film includes a base layer, and an adhesive layer disposed on one surface side of the base layer, wherein the ratio RE (=E′(160)/E′(−40)) of the elastic modulus of the base layer at 160° C. to the elastic modulus of the base layer at −40° C. is RE≥0.01, and the elastic modulus E′(−40) is 10 MPa to less than 1000 MPa. The method includes bonding the adhesive layer to a back surface of a semiconductor wafer, separating the semiconductor wafer into segments to obtain semiconductor parts, and separating the semiconductor parts from the adhesive layer, and includes a step of evaluating.

Provided is a film for manufacturing a semiconductor part in which an evaluation step accompanied with a temperature change, a segmenting step, and a pickup step can be commonly performed, a method for manufacturing a semiconductor part, a semiconductor part, and an evaluation method. The film includes a base layer, and an adhesive layer disposed on one surface side of the base layer, wherein the ratio RE (=E′(160)/E′(−40)) of the elastic modulus of the base layer at 160° C. to the elastic modulus of the base layer at −40° C. is RE≥0.01, and the elastic modulus E′(−40) is 10 MPa to less than 1000 MPa. The method includes bonding the adhesive layer to a back surface of a semiconductor wafer, separating the semiconductor wafer into segments to obtain semiconductor parts, and separating the semiconductor parts from the adhesive layer, and includes a step of evaluating.

An addition reaction curing type polyorganosiloxane composition for bonding poly(phenylene sulfide) resins includes (A) a polyorganosiloxane containing two or more alkenyl groups in the molecule, (B) a polyorganohydrogensiloxane having, in the molecule, three or more silicon-atom-bonded hydrogen atoms, (C) a platinum-based catalyst, (D) an oxide or carbonate of a metal selected from among the metals in Groups 2 and 12 of the periodic table, and (E) an adhesion promoter, the content of the ingredient (D) being 0.1-20 wt % with respect to the whole composition.

An addition reaction curing type polyorganosiloxane composition for bonding poly(phenylene sulfide) resins includes (A) a polyorganosiloxane containing two or more alkenyl groups in the molecule, (B) a polyorganohydrogensiloxane having, in the molecule, three or more silicon-atom-bonded hydrogen atoms, (C) a platinum-based catalyst, (D) an oxide or carbonate of a metal selected from among the metals in Groups 2 and 12 of the periodic table, and (E) an adhesion promoter, the content of the ingredient (D) being 0.1-20 wt % with respect to the whole composition.

The present disclosure generally relates to a stretchable anti-fogging tape (SAT) that can be applied to diverse transparent materials with varied curvatures for persistent fogging prevention. The SAT comprises three synergistically-combined transparent layers: i) a stretchable middle layer with high elastic recovery to keep transparent materials tightly bound; ii) an anti-fogging top layer to impart hydrophilicity to transparent materials; and iii) an adhesive bottom layer to form robust yet reversible adhesion between transparent materials and SATs. The SAT can be configured to have water condensate form a predominantly continuous film thereon in response to a high humidity environment At least two applications are demonstrated, including the SAT-adhered eyeglasses and goggles for clear fog-free vision, and the SAT-adhered condensation cover for efficient solar-powered freshwater production.

The present disclosure generally relates to a stretchable anti-fogging tape (SAT) that can be applied to diverse transparent materials with varied curvatures for persistent fogging prevention. The SAT comprises three synergistically-combined transparent layers: i) a stretchable middle layer with high elastic recovery to keep transparent materials tightly bound; ii) an anti-fogging top layer to impart hydrophilicity to transparent materials; and iii) an adhesive bottom layer to form robust yet reversible adhesion between transparent materials and SATs. The SAT can be configured to have water condensate form a predominantly continuous film thereon in response to a high humidity environment At least two applications are demonstrated, including the SAT-adhered eyeglasses and goggles for clear fog-free vision, and the SAT-adhered condensation cover for efficient solar-powered freshwater production.

The adhesive faces outwardly in a temporary vehicle wrapping film, dramatically improving the process of application. The film may be a durable 3-mil, puncture-resistant plastic film with a UV inhibitor, and the adhesive may be a reduced-tack or “low-tack” adhesive. The base layer and the adhesive are preferably transparent or translucent, and the width of the roll may be in the range of 1 to several feet. A portion of the outwardly facing adhesive is applied to a surface to be protected, enabling the film to be unrolled with the outwardly facing adhesive surface at all times being applied to the surface. The film is cut when the surface to be protected is sufficiently covered. In contrast to existing solutions, the film may be applied by a single user, with one hand grasping one end of the roll and the other hand grasping the other end of the roll.

There is a method of manufacturing a multilayer wiring board including: alternately stacking wiring layers and insulating layers; stacking a reinforcing sheet on one surface of the resulting multilayer laminate with a soluble adhesive layer therebetween, wherein an unoccupied region without the soluble adhesive layer is provided within a facing area where the reinforcing sheet faces the multilayer laminate; allowing a liquid capable of dissolving the soluble adhesive layer to infiltrate the unoccupied region to dissolve or soften the soluble adhesive layer; and releasing the reinforcing sheet from the multilayer laminate at the soluble adhesive layer. This method enables the multilayer wiring layer to be reinforced to generate no large local warpage, thereby improving the reliable connection and the surface flatness (coplanarity) of the multilayer wiring layer. The used reinforcing sheet can be released in a significantly short time, while minimizing the stress applied to the multilayer laminate.

An adhesion structure and an electronic device are provided. The adhesion structure includes a substrate and an adhesive layer. The adhesive layer is disposed on the substrate, and the adhesive layer includes a plurality of graphene microplates. A part of the graphene microplates protrude from two opposite surfaces of the adhesive layer. The thickness of the graphene microplates is greater than or equal to 0.3 nanometers and is less than or equal to 3 nanometers. The flake diameter of the graphene microplates is greater than or equal to 1 micrometer and is less than or equal to 30 micrometers. The adhesion structure can not only provide the adhesive function, but also improve the heat dissipation efficiency of electronic device.