The invention relates to a device that includes a substrate and a thin film of a photo-switchable adhesive layer applied to at least one surface of the substrate. A method of releasably supporting a product that includes adhering a product onto the thin film of the device and exposing the thin film to light sufficient to cause a change in the adhesive strength of the thin film. A method of making the device is also disclosed.

A radiation-curable organopolysiloxane composition comprising the components (A), (B) and (C): (A) organopolysiloxane represented by the formula (1), wherein at least one of R.sup.1 is a (meth)acryloyl group-containing organic group, a is an integer of 2 or more, a, b, c and d satisfy an equation, 2≤a+b+c+d≤1,000, and a ratio of the total number of the hydroxyl group and the hydroxyl group-containing organic group to the total number of the (meth)acryloyl group-containing organic group, the hydroxyl group and the hydroxyl group-containing organic group is 0.4 or less; (B) compound having two or more acrylic groups in one molecule in an amount of 0.1 to 50 parts by mass, relative to 100 parts by mass of component (A); and (C) radical polymerization initiator in an amount of 0.1 to 15 parts by mass, relative to 100 parts by mass of component (A).

Provided are a transparent conducting film laminate to which a curl generated during a heating step and after the heating step can be controlled, and a method for processing the same. A transparent conducting film laminate comprises a transparent conducting film 20 and a carrier film 10 stacked thereon, wherein the transparent conducting film 20 comprises a transparent resin film 3, transparent conducting layer 4, and an overcoat layer 5 stacked in this order, the transparent resin film 3 having a thickness T.sub.1 of 5 to 25 μm and being made of an amorphous cycloolefin-based resin, the carrier film 10 is releasably stacked on the other main face, the face opposite to the face having the transparent conducting layer 4, of the transparent resin film 3 with an adhesive agent layer 2 therebetween, and a protection film 1 has a thickness T.sub.2 which is 5 times or more of the thickness T.sub.1 of the transparent resin film 3 and is 150 μm or less, and is made of polyester having an aromatic ring in its molecular backbone.

A transfer foil for a touch sensor includes a temporary support, a conductive layer, and a layer to be bonded to a support. The peel adhesion between the temporary support and the conductive layer is 0.20 N/mm or less. The layer to be bonded to a support has a thickness of 20 μm or less, and a modulus of elasticity of 0.10 MPa or more at a temperature of 130° C. The conductive layer includes a detection electrode that has a mesh pattern formed of a thin wire consisting of a conductive member and an external connection terminal that consists of a conductive member and is drawn from the detection electrode. The thin wire forming the mesh pattern of the detection electrode has a line width of 1 μm or more and 4.5 μm or less.

An adhesion method including: a step (1), disposing a stickable-curable adhesive layer on a first adherend; a step (2), disposing a curing agent layer on a second adherend, the curing agent layer being able to cure the stickable-curable adhesive layer by contacting and reacting with the stickable-curable adhesive layer; and a step (3), bringing the stickable-curable adhesive layer into contact with the curing agent layer so that they are sandwiched by the first adherend and the second adherend.

A wrappable protective sleeve for providing protection to at least one elongate member contained therein and methods of construction and use thereof are provided. The sleeve includes a flexible textile wall having opposite inner and outer faces bounded by opposite edges and opposite ends. The opposite edges extend generally parallel to one another between the opposite ends. A pair of adhesive layers is bonded to the inner face, with each of the adhesive layers being spaced from one another. The adhesive layers extend between the opposite ends adjacent the opposite edges. Further, a release paper is releasably adhered to the pair of adhesive layers for subsequent removal and use of the sleeve.

Provided herein are stabilized underfill film-containing assemblies which extend the work-life of underfill films. In accordance with certain aspects of the present invention, there are also provided stabilized underfill film-containing assemblies which extend the shelf-life of underfill films. In certain aspects of the present invention, there are also provided methods for extending the work-life of underfill films. In another aspect of the present invention, there are also provided methods for extending the shelf-life of underfill films.

The present disclosure relates to a non-conductive film comprising an adhesive layer containing a low molecular weight epoxy resin; and a tacky layer containing a predetermined composition, and a method for manufacturing a semiconductor laminate using the non-conductive film.

An acrylic emulsion pressure sensitive adhesive composition is provided. The acrylic emulsion pressure sensitive adhesive composition, due to pH-dependent properties, exhibits stable adhesion when attached to an adherend, but when it needs to be removed, it can be easily removed without residue using an alkaline solution. Thus, if the acrylic emulsion pressure sensitive adhesive composition is used as a pressure sensitive adhesive for a label of a plastic packaging article, the label can be easily removed during a recycling process, thus improving recycling efficiency.

Disclosed is a composition for reactive hot melt resin and a reactive hot melt film prepared from the resin, which resin composition includes a polyurethane resin having a linear structure, an isocyanate blocking agent having a plurality of functional groups, a reaction catalyst, a reaction retardant, etc. Preferably, the resin composition includes a polyurethane resin and an isocyanate blocking agent used as a latent curing agent, which are main components; a catalyst for accelerating the reaction; and a reaction retardant for securing long-term storability. Particularly, the composition for reactive hot melt resin further includes a heat-resistance enhancer, preferably nanosilica, for preventing the resin from melting down during no-sew press treatment to provide a performance to help maintenance of adhesion.