A variety of adhesive laminates are described, many of which perform functions such as liquid indication, outgassing, liquid retention, electrical conducting, and sound channeling. Also described are adhesive regions on face materials in which the regions exhibit particular dimensional proportions. Methods involving direct and transfer coating of adhesives are also described. In a particular version, a method of roll to roll transfer coating of sprayed pressure sensitive adhesives is described. Also described are various adhesive films and laminates many of which can be produced using the methods.

A variety of adhesive laminates are described, many of which perform functions such as liquid indication, outgassing, liquid retention, electrical conducting, and sound channeling. Also described are adhesive regions on face materials in which the regions exhibit particular dimensional proportions. Methods involving direct and transfer coating of adhesives are also described. In a particular version, a method of roll to roll transfer coating of sprayed pressure sensitive adhesives is described. Also described are various adhesive films and laminates many of which can be produced using the methods.

A self-adhesive multi-layer item comprising:

1) a dorsal support DO having a top face SI1 and a bottom face SI2,
2) at least one layer of silicone release coating RC applied to the top face SI1 of the dorsal support DO and which is prepared by irradiation of a curable silicone composition C not containing any solvent and comprising, as constituents:
a) at least one functionalized organopolysiloxane A
b) an effective amount of at least one type I photoinitiator P of the family of acylphosphine oxide derivatives of formula (III)
3) at least one adhesive PSA, preferably at least one pressure-sensitive adhesive PSA, applied on the layer of silicone release coating,
4) a frontal support FR applied on the adhesive PSA of the component 3), and 5) optionally at least one layer of silicone release coating RC applied on the bottom face SI2 of the dorsal support DO and which is prepared by application and irradiation of said curable silicone composition C, and on this same layer, there is at least one adhesive PSA, preferably at least one pressure-sensitive adhesive PSA.

The present invention relates to a release liner-attached adhesive body including a linear adhesive body and a release liner, in which the release liner has a compression elastic modulus of 1.5 MPa or less, and a release liner-attached adhesive body including a linear adhesive body and a release liner, in which a slit is formed in the release liner, and at least a part of the adhesive body is disposed in the slit.

Release layers that include an oligomeric component comprising a unit of the Formula (I) are useful for releasably transferring components from one surface to another during manufacturing of microelectronic devices.

A curable polysiloxane release coating composition comprises (A) an organopolysiloxane containing ethylenically unsaturated groups. Component (A) is selected from: (A1) a branched organopolysiloxane containing at least three (3) organopolysiloxane branch chains linked through a central core including at least two (2) organopolysiloxane branch chains each of which contain an ethylenically unsaturated group; and/or (A2) a linear organopolysiloxane containing at least 2 ethylenically unsaturated groups having at least six (6) carbon atoms. The composition further comprises (B) an organopolysiloxane containing at least 2 Si—H groups, and (C) a hydrosilylation catalyst. The composition yet further comprises (D) a hydrosilylation inhibitor comprising a maleimide of the general formula (I):

##STR00001##

In formula (I), A.sup.3 represents a hydrogen atom or a hydrocarbyl or substituted hydrocarbyl group having 1 to 18 carbon atoms, and A.sup.1 and A.sup.2 each represent a hydrogen atom or a hydrocarbyl or substituted hydrocarbyl group having 1 to 18 carbon atoms.

Provided is a multi-layered anisotropic conductive adhesive including an upper conductive adhesive layer, a conductive fabric layer with two sides and a lower conductive adhesive layer, wherein one side of the conductive fabric layer is plated with metal. In the application of a flexible printed circuit, reinforced parts, formed by laminating multi-layered anisotropic conductive adhesive with steel or polyimide-type stiffener, can effectively prevent the deformation of installed parts due to warping, and ensure the good hole filling, good direct grounding effect, and good shielding performance. Therefore, the multi-layered anisotropic conductive adhesive has good electrical properties, good adhesive strength, better tin soldering, reliability and flame resistant. Also provided is a method of producing the multi-layered anisotropic conductive adhesive.

Disclosed are a method of preparing an elastic pressure-sensitive adhesive tape and an elastic pressure-sensitive adhesive tape. Main components of the adhesive include a polyacrylate resin with a carbon-carbon double bond and a diluent monomer with a carbon-carbon double bond. A quasi-microcapsule powder component is adopted, wherein the shell material of the quasi-microcapsule powder selects a cellulose-based water soluble polymer, and the core material selects low boiling point alkane, wherein the preparation method combines UV curing, heating, and shell burst, to obtain an elastic adhesive layer, whereby to prepare a pressure-sensitive adhesive tape product. Compared with conventional elastic pressure-sensitive adhesive tapes, the preparing method as disclosed has a simple manufacturing process. The pressure-sensitive adhesive tape obtained from the disclosed preparing method overcomes the restrictions of conventional foam strips and provide good cushioning and compression properties without using foam as the carrier.

Disclosed are a method of preparing an elastic pressure-sensitive adhesive tape and an elastic pressure-sensitive adhesive tape. Main components of the adhesive include a polyacrylate resin with a carbon-carbon double bond and a diluent monomer with a carbon-carbon double bond. A quasi-microcapsule powder component is adopted, wherein the shell material of the quasi-microcapsule powder selects a cellulose-based water soluble polymer, and the core material selects low boiling point alkane, wherein the preparation method combines UV curing, heating, and shell burst, to obtain an elastic adhesive layer, whereby to prepare a pressure-sensitive adhesive tape product. Compared with conventional elastic pressure-sensitive adhesive tapes, the preparing method as disclosed has a simple manufacturing process. The pressure-sensitive adhesive tape obtained from the disclosed preparing method overcomes the restrictions of conventional foam strips and provide good cushioning and compression properties without using foam as the carrier.

A method for manufacturing a semiconductor device according to an aspect of the present disclosure includes a step of preparing a dicing/die-bonding integrated film including an adhesive layer formed of a heat-curable resin composition having a melt viscosity of 3100 Pa.Math.s or higher at 120° C., a tacky adhesive layer, and a base material film; a step of sticking a surface on the adhesive layer side of the dicing/die-bonding integrated film and a semiconductor wafer together; a step of dicing the semiconductor wafer; a step of expanding the base material film and thereby obtaining adhesive-attached semiconductor elements; a step of picking up the adhesive-attached semiconductor element from the tacky adhesive layer; a step of laminating this semiconductor element to another semiconductor element, with the adhesive interposed therebetween; and a step of heat-curing the adhesive.