The electrically conductive adhesive film comprises a metal particle (Q), a resin (M), and a prescribed organophosphorus compound (A), the resin (M) comprises a thermosetting resin (M1), and the metal particle (Q) has an average particle size (d50) of 20 μm or less and comprise 10% by mass or more of a first metal particle (Q1) having a fractal dimension of 1.1 or more when viewed in a projection drawing in a primary particle state.

The electrically conductive adhesive film comprises a metal particle (Q), a resin (M), and a prescribed organophosphorus compound (A), the resin (M) comprises a thermosetting resin (M1), and the metal particle (Q) has an average particle size (d50) of 20 μm or less and comprise 10% by mass or more of a first metal particle (Q1) having a fractal dimension of 1.1 or more when viewed in a projection drawing in a primary particle state.

The present invention relates to a pressure-sensitive adhesive composition and a pressure-sensitive adhesive film including the same, and provides a pressure-sensitive adhesive composition and a pressure-sensitive adhesive film which may prevent damage to an element from moisture contained in the composition, ionic substances, and other foreign substances, and effectively block electrochemical corrosion, thereby improving a lifetime and durability of an organic electronic device.

The present invention relates to a pressure-sensitive adhesive composition and a pressure-sensitive adhesive film including the same, and provides a pressure-sensitive adhesive composition and a pressure-sensitive adhesive film which may prevent damage to an element from moisture contained in the composition, ionic substances, and other foreign substances, and effectively block electrochemical corrosion, thereby improving a lifetime and durability of an organic electronic device.

The present invention provides an adhesive composition for a dicing tape, which may prevent the success rate of chip pick-up from decreasing due to an oxygen inhibition phenomenon occurring in a dicing process, and a dicing tape including the same. The adhesive composition for a dicing tape includes an adhesive binder, a singlet oxygen scavenger, a photosensitizer, and a photoinitiator.

The intention is to provide an adhesive system which is stable in storage and which when used permits precise positioning of the adhesive, and which can be crosslinked without exceeding moderate temperatures. The said system is moreover intended to provide strong adhesive bonds that attain high performance levels. This is achieved via a kit containing at least two pressure-sensitive adhesive layers A and B, where the two pressure-sensitive adhesive layers A and B mutually independently respectively comprise at least one polymer containing a multiplicity of carboxy groups; in the pressure-sensitive adhesive layer A a portion of the carboxy groups of the polymer containing these has been activated by reaction with an activator AA; and—the pressure-sensitive adhesive layer A—at least one crosslinking agent V.sub.A which can enter into a crosslinking reaction with the carboxy groups of the polymer containing these of the pressure-sensitive adhesive layers A and B, but which in the pressure-sensitive adhesive layer A is not significantly reactive; —the pressure-sensitive adhesive layer B—at least one crosslinking agent V.sub.B which can accelerate the crosslinking reaction of the carboxy groups of the polymer containing these of the pressure-sensitive adhesive layer B with the crosslinking agent V.sub.A and which can permit and accelerate the crosslinking reaction of the carboxy groups of the polymer containing these of the pressure-sensitive adhesive layer A with the crosslinking agent V.sub.A and can enter into a crosslinking reaction with the activated carboxy groups of the polymer containing these of the pressure-sensitive adhesive layer A. The invention moreover also relates to an adhesive tape which is obtainable via contact between the pressure-sensitive adhesive layers of the kit, and to a process for producing said adhesive tape.

The intention is to provide an adhesive system which is stable in storage and which when used permits precise positioning of the adhesive, and which can be crosslinked without exceeding moderate temperatures. The said system is moreover intended to provide strong adhesive bonds that attain high performance levels. This is achieved via a kit containing at least two pressure-sensitive adhesive layers A and B, where the two pressure-sensitive adhesive layers A and B mutually independently respectively comprise at least one polymer containing a multiplicity of carboxy groups; in the pressure-sensitive adhesive layer A a portion of the carboxy groups of the polymer containing these has been activated by reaction with an activator AA; and—the pressure-sensitive adhesive layer A—at least one crosslinking agent V.sub.A which can enter into a crosslinking reaction with the carboxy groups of the polymer containing these of the pressure-sensitive adhesive layers A and B, but which in the pressure-sensitive adhesive layer A is not significantly reactive; —the pressure-sensitive adhesive layer B—at least one crosslinking agent V.sub.B which can accelerate the crosslinking reaction of the carboxy groups of the polymer containing these of the pressure-sensitive adhesive layer B with the crosslinking agent V.sub.A and which can permit and accelerate the crosslinking reaction of the carboxy groups of the polymer containing these of the pressure-sensitive adhesive layer A with the crosslinking agent V.sub.A and can enter into a crosslinking reaction with the activated carboxy groups of the polymer containing these of the pressure-sensitive adhesive layer A. The invention moreover also relates to an adhesive tape which is obtainable via contact between the pressure-sensitive adhesive layers of the kit, and to a process for producing said adhesive tape.

Provided are a chemical polymerization initiator including (a) a thiourea compound, (b) a peroxyester, (c) a divalent copper compound, and (d) an aryl borate compound, an adhesive composition, an adhesive composition kit, a dental material, and a dental material kit each using the chemical polymerization initiator, and a method of storing the adhesive composition.

An emission enhancement structure having at least one energy augmentation structure; and an energy converter capable of receiving energy from an energy source, converting the energy and emitting therefrom a light of a different energy than the received energy. The energy converter is disposed in a vicinity of the at least one energy augmentation structure such that the emitted light is emitted with an intensity larger than if the converter were remote from the at least one energy augmentation structure. Also described are various uses for the energy emitters, energy augmentation structures and energy collectors in a wide array of fields.

The electrically conductive adhesive agent composition comprises a metal particle (Q) and a prescribed organophosphorus compound (A), and the metal particle (Q) comprises a first metal particle (Q1) made of a single metal selected from the group of copper, nickel, aluminum and tin or an alloy comprising two or more metals selected from said group.