C09J11/02

Adhesive tape cartridge, adhesive tape roll, and manufacturing method of adhesive tape roll
10464767 · 2019-11-05 · ·

An adhesive tape cartridge including a housing and an adhesive tape roll is provided. The adhesive tape roll is disposed in the housing and winds an adhesive tape. The adhesive tape includes a first adhesive layer, a second adhesive layer, and a separation material layer. The first adhesive layer comprises an adhesive with a first pigment added. The second adhesive layer is disposed on one side of the first adhesive layer in a thickness direction and comprises an adhesive with a second pigment added. The separation material layer is disposed on the one side of the second adhesive layer in the thickness direction. A volume ratio of the second pigment in the second adhesive layer is smaller than a volume ratio of the first pigment in the first adhesive layer.

Adhesive tape cartridge, adhesive tape roll, and manufacturing method of adhesive tape roll
10464767 · 2019-11-05 · ·

An adhesive tape cartridge including a housing and an adhesive tape roll is provided. The adhesive tape roll is disposed in the housing and winds an adhesive tape. The adhesive tape includes a first adhesive layer, a second adhesive layer, and a separation material layer. The first adhesive layer comprises an adhesive with a first pigment added. The second adhesive layer is disposed on one side of the first adhesive layer in a thickness direction and comprises an adhesive with a second pigment added. The separation material layer is disposed on the one side of the second adhesive layer in the thickness direction. A volume ratio of the second pigment in the second adhesive layer is smaller than a volume ratio of the first pigment in the first adhesive layer.

ADHESIVE ARTICLE AND METHOD OF MAKING THE SAME

A method of making an adhesive article includes providing a liner having first and second silicone release layer disposed on opposite sides thereof, applying the onium salt photoacid generator onto at least a portion of the first silicone release layer to provide a modified silicone release layer, disposing an adhesive layer onto the second silicone release layer, and and exposing at least the adhesive layer to electron beam radiation within a process chamber thereby providing a crosslinked adhesive layer, wherein the process chamber contains oxygen, wherein the modified silicone release layer is exposed to the oxygen during crosslinking of the adhesive layer. The first silicone release layer does not contain an onium salt photoacid generator. An adhesive article made by the method is also disclosed.

ADHESIVE ARTICLE AND METHOD OF MAKING THE SAME

A method of making an adhesive article includes providing a liner having first and second silicone release layer disposed on opposite sides thereof, applying the onium salt photoacid generator onto at least a portion of the first silicone release layer to provide a modified silicone release layer, disposing an adhesive layer onto the second silicone release layer, and and exposing at least the adhesive layer to electron beam radiation within a process chamber thereby providing a crosslinked adhesive layer, wherein the process chamber contains oxygen, wherein the modified silicone release layer is exposed to the oxygen during crosslinking of the adhesive layer. The first silicone release layer does not contain an onium salt photoacid generator. An adhesive article made by the method is also disclosed.

DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE TAPE

The present invention relates to a double-sided pressure-sensitive adhesive tape excellent in good balance of both flame retardance and pressure-sensitive adhesive properties, comprising a layer structure of a pressure-sensitive adhesive layer (I), a substrate, and a pressure-sensitive adhesive layer (II) in this order, in which a proportion (Y/X) of a thickness (X) of the pressure-sensitive adhesive layer (I) and a thickness (Y) of the pressure-sensitive adhesive layer (II) is more than 1.00 and less than 2.00.

Anisotropic conductive film and production method of the same
10442958 · 2019-10-15 · ·

An anisotropic conductive film contains conductive particles and spacers. The spacers are arranged at a central part of the film in a width direction. The central part of the film in the width direction represents 20 to 80% of the overall width of the film. The height of the spacers in the thickness direction of the anisotropic conductive film is larger than 5 m and less than 75 m. Such an anisotropic conductive film has a layered structure having a first insulating adhesion layer and a second insulating adhesion layer, wherein the conductive particles are dispersed in the first insulating adhesion layer, and the spacers are regularly arranged on a surface of the first insulating adhesion layer on a side of the second insulating adhesion layer.

Anisotropic conductive film and production method of the same
10442958 · 2019-10-15 · ·

An anisotropic conductive film contains conductive particles and spacers. The spacers are arranged at a central part of the film in a width direction. The central part of the film in the width direction represents 20 to 80% of the overall width of the film. The height of the spacers in the thickness direction of the anisotropic conductive film is larger than 5 m and less than 75 m. Such an anisotropic conductive film has a layered structure having a first insulating adhesion layer and a second insulating adhesion layer, wherein the conductive particles are dispersed in the first insulating adhesion layer, and the spacers are regularly arranged on a surface of the first insulating adhesion layer on a side of the second insulating adhesion layer.

Resin fluxed solder paste, and mount structure

Provided herein is a resin fluxed solder paste that exhibits a desirable solder bump reinforcement effect without requiring an underfill process. The disclosure also provides a mount structure. The resin fluxed solder paste includes a non-resinic powder containing a solder powder and an inorganic powder; and a flux containing a first epoxy resin, a curing agent, and an organic acid. The non-resinic powder accounts for 30 to 90 wt % of the total, and the surface of the inorganic powder is covered with an organic resin.

Pressure-sensitive adhesive composition

The present invention relates to a pressure-sensitive adhesive composition and a pressure-sensitive adhesive film including the same, and provides a pressure-sensitive adhesive composition and a pressure-sensitive adhesive film which may prevent damage to an element from moisture contained in the composition, ionic substances, and other foreign substances, and effectively block electrochemical corrosion, thereby improving a lifetime and durability of an organic electronic device.

Pressure-sensitive adhesive composition

The present invention relates to a pressure-sensitive adhesive composition and a pressure-sensitive adhesive film including the same, and provides a pressure-sensitive adhesive composition and a pressure-sensitive adhesive film which may prevent damage to an element from moisture contained in the composition, ionic substances, and other foreign substances, and effectively block electrochemical corrosion, thereby improving a lifetime and durability of an organic electronic device.