A method of preparing a light-curable artificial nail includes extracting from an adhesive film in a semi-cured state a portion of the adhesive film in a shape of a human nail. The portion of the adhesive film includes a light-curable composition in the semi-cured state. A portion of the polish film in the shape of the human nail is extracted from a polish film. The portion of the adhesive film and the portion of the polish film are combined to form layers of the light-curable artificial nail.

A method of preparing a light-curable artificial nail includes extracting from an adhesive film in a semi-cured state a portion of the adhesive film in a shape of a human nail. The portion of the adhesive film includes a light-curable composition in the semi-cured state. A portion of the polish film in the shape of the human nail is extracted from a polish film. The portion of the adhesive film and the portion of the polish film are combined to form layers of the light-curable artificial nail.

An adhesive composition comprises about 2.5 to about 12% by weight of a biodegradable polymer; about 0.5 to about 1.5% by weight of a preservative; and at least 10% by weight of water.

An adhesive composition comprises about 2.5 to about 12% by weight of a biodegradable polymer; about 0.5 to about 1.5% by weight of a preservative; and at least 10% by weight of water.

The present disclosure relates to a curing agent, an adhesive composition for a semiconductor device containing the curing agent, the adhesive composition exhibiting excellent adhesive strength and having excellent reliability because of being inhibited from cracking, an adhesive film for a semiconductor device, and a semiconductor package including the same.

The present disclosure relates to a curing agent, an adhesive composition for a semiconductor device containing the curing agent, the adhesive composition exhibiting excellent adhesive strength and having excellent reliability because of being inhibited from cracking, an adhesive film for a semiconductor device, and a semiconductor package including the same.

The purpose of the present invention is to provide a double-sided adhesive film which has a generally equal elongation in the XY (longitudinal and transverse) directions, more preferably in the thickness direction, while being prevented from the occurrence of adhesive protrusion or glue burr, and which has higher adhesive force and higher holding power in comparison to similar single-layer adhesive articles, while being applicable to a stretchable or flexible adherend. A double-sided adhesive film according to the present invention is a substrate-less double-sided adhesive film which is composed of a center layer that is formed of a resin adhesive, and adhesive layers that are superposed on the front surface and the back surface of the center layer, said adhesive layers being formed of a resin that is the same as or similar to the resin that constitutes the center layer, wherein the weight average molecular weight or the crosslinking degree of the resin that constitutes the center layer is higher than the weight average molecular weight or the crosslinking degree of the resin that constitutes the adhesive layers. This double-sided adhesive film is characterized in that the tolerance between the elongation in the longitudinal direction and the elongation in the transverse direction is ±20% or less relative to one of the elongations, more preferably, the elongation in the longitudinal direction and the elongation in the transverse direction are equal to each other.

A sealant material for sealing joints between male and female mating parts comprising: (a) an elongate flexible thread suitable for wrapping around at least one of the parts, and (b) a joint sealing composition comprising an anaerobically curable composition in solid form,
the flexible thread being coated with the anaerobically curable composition. This provides a reactive composition on the thread for sealing joints.

A sealant material for sealing joints between male and female mating parts comprising: (a) an elongate flexible thread suitable for wrapping around at least one of the parts, and (b) a joint sealing composition comprising an anaerobically curable composition in solid form,
the flexible thread being coated with the anaerobically curable composition. This provides a reactive composition on the thread for sealing joints.

The invention relates to a surfactant comprising a grafted rosin ester which is a rosin ester grafted with a capped polyalkylene glycol, wherein the capped polyalkylene glycol is a polyalkylene glycol capped by an alkyl ether and an aqueous dispersion consisting of an aqueous phase and resin particles dispersed in the aqueous phase, wherein the dispersion comprises the surfactant according to the invention.