C09J101/02

ALL-SOLID-STATE SECONDARY BATTERY, SOLID ELECTROLYTE COMPOSITION AND ELECTRODE SHEET FOR BATTERIES USED IN THE SAME, AND MANUFACTURING METHOD OF ELECTRODE SHEET FOR BATTERIES AND ALL-SOLID-STATE SECONDARY BATTERY

An all-solid-state secondary battery includes a positive electrode active substance layer; a negative electrode active substance layer; and an inorganic solid electrolyte layer, in which at least one of the positive electrode active substance layer, the negative electrode active substance layer, or the inorganic solid electrolyte layer contains an inorganic solid electrolyte having conductivity of ions of metal belonging to Group 1 or 2 of the periodic table and a cellulose polymer.

INORGANIC ADHESIVE FOR PREVENTING CRACKS OF BAMBOO PRODUCTS, PREPARATION METHOD OF INORGANIC ADHESIVE, AND PREPARATION METHOD OF BAMBOO SCRIMBER
20210395570 · 2021-12-23 ·

An inorganic adhesive includes magnesium oxide, magnesium sulfate heptahydrate, silica fume, silica sol, lithium silicate, sodium silicate, citric acid, microcrystalline cellulose, cellulose nanowhiskers, amino trimethylene phosphonic acid, and water.

Microfibrillated cellulose as rheology modifier in adhesives
11332647 · 2022-05-17 · ·

The present invention relates to starch-based adhesive compositions comprising microfibrillatedcellulose (“MFC”). In addition to microfibrillated cellulose, these adhesive compositions comprise at least one starch and/or at least one starch derivative.

Microfibrillated cellulose as rheology modifier in adhesives
11332647 · 2022-05-17 · ·

The present invention relates to starch-based adhesive compositions comprising microfibrillatedcellulose (“MFC”). In addition to microfibrillated cellulose, these adhesive compositions comprise at least one starch and/or at least one starch derivative.

PRODUCTION OF CORRUGATED PAPERBOARDS AND CARDBOARDS COMPRISING CHEMICALLY TREATED PAPER

The present invention relates to a high speed process for making corrugated paperboards and cardboards, said paperboards and cardboards comprising chemically treated paper, and said process using a starch-based adhesive that comprises microfibrillated cellulose. The present invention also relates to corrugated paperboards and cardboards comprising said starch-based adhesive composition comprising microfibrillated cellulose and said chemically treated paper.

PRODUCTION OF CORRUGATED PAPERBOARDS AND CARDBOARDS COMPRISING CHEMICALLY TREATED PAPER

The present invention relates to a high speed process for making corrugated paperboards and cardboards, said paperboards and cardboards comprising chemically treated paper, and said process using a starch-based adhesive that comprises microfibrillated cellulose. The present invention also relates to corrugated paperboards and cardboards comprising said starch-based adhesive composition comprising microfibrillated cellulose and said chemically treated paper.

BONDING FILM, TAPE FOR WAFER PROCESSING, METHOD FOR PRODUCING BONDED BODY, AND BONDED BODY AND PASTED BODY

A bonding film for bonding a semiconductor element and a substrate. The bonding film has an electroconductive bonding layer formed by molding an electroconductive paste including metal fine particles (P) into a film form, and a tack layer having tackiness and laminated on the electroconductive bonding layer. The tack layer includes 0.1% to 1.0% by mass of metal fine particles (M) with respect to the metal fine particles (P) in the electroconductive bonding layer, and the metal fine particles (M) have a melting point of 250° C. or lower.

BONDING FILM, TAPE FOR WAFER PROCESSING, METHOD FOR PRODUCING BONDED BODY, AND BONDED BODY AND PASTED BODY

A bonding film for bonding a semiconductor element and a substrate. The bonding film has an electroconductive bonding layer formed by molding an electroconductive paste including metal fine particles (P) into a film form, and a tack layer having tackiness and laminated on the electroconductive bonding layer. The tack layer includes 0.1% to 1.0% by mass of metal fine particles (M) with respect to the metal fine particles (P) in the electroconductive bonding layer, and the metal fine particles (M) have a melting point of 250° C. or lower.

Cellulose-containing compositions and methods of making same

Cellulose-containing compositions and method of making same are disclosed. The compositions comprise a cellulose product comprising a type-I cellulose, a type-II cellulose, amorphous cellulose, or a combination thereof. Further, methods are disclosed for making these compositions and for further hydrolyzing these compositions. Additionally, uses for the cellulose-containing compositions are disclosed.

Cellulose-containing compositions and methods of making same

Cellulose-containing compositions and method of making same are disclosed. The compositions comprise a cellulose product comprising a type-I cellulose, a type-II cellulose, amorphous cellulose, or a combination thereof. Further, methods are disclosed for making these compositions and for further hydrolyzing these compositions. Additionally, uses for the cellulose-containing compositions are disclosed.