The present application relates to a vulcanization label that can be used to label tires. The label comprises a facestock layer, a first primer layer, a second primer layer comprising a zinc oxide, and a reactive adhesive layer. The two primer layers have different compositions. The second primer layer has a coating weight that is greater than 3 gsm. At least a portion of the second primer is in contact with at least a portion of the reactive adhesive layer.

The present invention relates to an adhesive composition comprising: at least one phosphate salt chosen from sodium phosphate, potassium phosphate and mixtures of these phosphates; and at least one resin based on: at least one compound A1, compound A1 being chosen from a compound A11 comprising at least two functions, one of these functions being a hydroxymethyl function and the other being an aldehyde function or a hydroxymethyl function, or a compound A12 comprising at least one aldehyde function, or a mixture of a compound A11 and of a compound A12; and at least one phenol A21.

The present invention relates to an adhesive composition comprising: at least one phosphate salt chosen from sodium phosphate, potassium phosphate and mixtures of these phosphates; and at least one resin based on: at least one compound A1, compound A1 being chosen from a compound A11 comprising at least two functions, one of these functions being a hydroxymethyl function and the other being an aldehyde function or a hydroxymethyl function, or a compound A12 comprising at least one aldehyde function, or a mixture of a compound A11 and of a compound A12; and at least one phenol A21.

A resin composition for a PCB includes a styrene-butadiene-styrene block copolymer in an amount from 95 to 100 parts by weight, a modified porous spheres of silicon oxide in an amount from 1 to 50 parts by weight, and a liquid polybutadiene in an amount from 5 to 50 parts by weight. The styrene-butadiene-styrene block copolymer and the liquid polybutadiene both include vinyl groups on the molecular side chains. The modified porous spheres of silicon oxide also include vinyl groups. An adhesive film and a circuit board using the resin composition are also provided.

A resin composition for a PCB includes a styrene-butadiene-styrene block copolymer in an amount from 95 to 100 parts by weight, a modified porous spheres of silicon oxide in an amount from 1 to 50 parts by weight, and a liquid polybutadiene in an amount from 5 to 50 parts by weight. The styrene-butadiene-styrene block copolymer and the liquid polybutadiene both include vinyl groups on the molecular side chains. The modified porous spheres of silicon oxide also include vinyl groups. An adhesive film and a circuit board using the resin composition are also provided.

An adhesive composition that improves structural integrity and insulative properties when applied to a cellulosic substrate is provided. The adhesive composition includes a plurality of microspheres and an emulsion-based polymer that has (i) an elastic modulus greater than 0.5 MPa in the range temperature range of 70° C. to 110° C.; (ii) an absolute log(E)/T slope of less than 0.05 in the range temperature range of 70° C. to 110° C.; and (iii) a tan d value less than 0.6 at 90° C.

An adhesive composition that improves structural integrity and insulative properties when applied to a cellulosic substrate is provided. The adhesive composition includes a plurality of microspheres and an emulsion-based polymer that has (i) an elastic modulus greater than 0.5 MPa in the range temperature range of 70° C. to 110° C.; (ii) an absolute log(E)/T slope of less than 0.05 in the range temperature range of 70° C. to 110° C.; and (iii) a tan d value less than 0.6 at 90° C.

The present disclosure is directed to a curable precursor of a pressure sensitive adhesive comprising a) a (co)polymeric material comprising a rubber-based elastomeric material; b) a polyfunctional aziridine curing agent; and c) an acid generating agent. The present disclosure is also directed to a method of manufacturing such pressure sensitive adhesives and uses thereof.

The present disclosure is directed to a curable precursor of a pressure sensitive adhesive comprising a) a (co)polymeric material comprising a rubber-based elastomeric material; b) a polyfunctional aziridine curing agent; and c) an acid generating agent. The present disclosure is also directed to a method of manufacturing such pressure sensitive adhesives and uses thereof.

A sealing patch for a polymeric bag includes a carrier, a pressure sensitive adhesive on the carrier and a heat-activated material on the pressure sensitive adhesive. A high-strength polymeric bag is formed from woven tapes and is coated with a polymer material. The sealing patch is positioned on the bag for sealing the bag. A method for sealing a high-strength polymeric bag with a sealing patch and a device for sealing a polymeric bag with a sealing patch are disclosed.