The present invention provides a binder composition comprising a first binder comprising by dry weight based on total dry weight of the first binder, from 5% to 98% of polymer particles, from 0.3% to 10% of a first polysaccharide, from 0.01% to 5% of a crosslinker, from 0.3% to 6% of a water-soluble metal cation, and from 0.05% to 3% of a cationic polyelectrolyte. The binder composition may further comprise a second binder comprising by dry weight based on total dry weight of the second binder, from 0.3% to 20% of the first polysaccharide, from 0.5% to 20% of a second polysaccharide. And in that case, the wet weight ratio of the first binder to the second binder is from 1:20 to 20:1. The present invention further provides a paint formulation comprising the binder composition.

The pressure sensitive adhesive tape is superior in moisture resistance because of its high peel strength and is easy to peel from an adherend by including a filler in the adhesive layers.

An electronic device, a method and apparatus for producing an electronic device, and a composition therefor are disclosed. An adhesive material is applied in a first pattern on a surface of a receiver substrate. A carrier having a metal foil disposed thereon is brought into contact with the first substrate such that a portion of the metal foil contacts the adhesive material. The adhesive material includes a first polymer, a second polymer, and a conductive carbon black dispersion, and is activated using at least one of mechanical pressure and heat while the portion of the metal foil is in contact with the adhesive material. The first substrate and the second substrate are separated, whereby the portion of the metal foil is transferred to the first substrate. The adhesive is electrically conductive to maximize the possibility of maintaining electrical connectivity even when there is a break in the metal foil.

An electronic device, a method and apparatus for producing an electronic device, and a composition therefor are disclosed. An adhesive material is applied in a first pattern on a surface of a receiver substrate. A carrier having a metal foil disposed thereon is brought into contact with the first substrate such that a portion of the metal foil contacts the adhesive material. The adhesive material includes a first polymer, a second polymer, and a conductive carbon black dispersion, and is activated using at least one of mechanical pressure and heat while the portion of the metal foil is in contact with the adhesive material. The first substrate and the second substrate are separated, whereby the portion of the metal foil is transferred to the first substrate. The adhesive is electrically conductive to maximize the possibility of maintaining electrical connectivity even when there is a break in the metal foil.

Provided is a resin acid ester-based tackifier having a good compatibility with a synthetic rubber elastomer, being capable of reducing the melt viscosity of the elastomer, and being capable of imparting excellent adhesive properties and/or pressure-sensitive adhesive properties to the elastomer. ##STR00001##

Provided is a resin acid ester-based tackifier having a good compatibility with a synthetic rubber elastomer, being capable of reducing the melt viscosity of the elastomer, and being capable of imparting excellent adhesive properties and/or pressure-sensitive adhesive properties to the elastomer. ##STR00001##

Some embodiments of the present disclosure relate to roofing systems including a substrate and adhesive formulations that are free of asphalt or substantially free of asphalt. Some embodiments of the present disclosure relate to methods of making one or more adhesive formulations that are free of asphalt or substantially free of asphalt. Some embodiments of the present disclosure relate to systems utilizing one or more adhesive formulations that are free of asphalt or substantially free of asphalt.

Some embodiments of the present disclosure relate to roofing systems including a substrate and adhesive formulations that are free of asphalt or substantially free of asphalt. Some embodiments of the present disclosure relate to methods of making one or more adhesive formulations that are free of asphalt or substantially free of asphalt. Some embodiments of the present disclosure relate to systems utilizing one or more adhesive formulations that are free of asphalt or substantially free of asphalt.

One aspect of the present invention is a hot melt composition containing a silane coupling agent, a thermoplastic polymer, a softener, and a catalyst, wherein the silane coupling agent is hydrolyzed to a compound having a boiling point of 70 to 180° C.

One aspect of the present invention is a hot melt composition containing a silane coupling agent, a thermoplastic polymer, a softener, and a catalyst, wherein the silane coupling agent is hydrolyzed to a compound having a boiling point of 70 to 180° C.