Embodiments of the present disclosure are directed to an adhesive layer, bearing including the adhesive layer, and methods of forming. The adhesive layer can include a mixture of a first polymer, a second polymer, and a third polymer, wherein the second polymer includes ethylene tetrafluoroethylene, and the third polymer includes a modified ethylene tetrafluoroethylene, ethylene tetrafluoroethylene hexafluoropropylene, or a combination thereof. In a particular embodiment, the first polymer can include an aromatic polymer. In another embodiment, the adhesive layer can have a tensile stress in an extrusion direction of at least 30 MPa.

A composition of matter includes a mixture of styrene derivative monomers and methacrylate/acrylate derivative monomers, which form hydrogen bonds between/among different precursors, and initiators, and the compositions are used to achieve composition control of the forming polymer, with the mole fraction of acrylate/methacrylate and styrene moieties in the forming polymer determined preferably by the monomer reactivity and monomer composition rather than the viscosity of the monomers.

According to one aspect, the present disclosure relates to a curable precursor of a structural adhesive composition, comprising: a) a thermally curable resin; b) a thermal curing initiator for the thermally curable resin; c) a radiation self-polymerizable multi-functional compound comprising a polyether oligomeric backbone and at least one free-radical (co)polymerizable reactive group at each terminal position of the oligomer backbone; and d) a free-radical polymerization initiator for the radiation self-polymerizable multi-functional compound; wherein the free-radical polymerization initiator is activated by visible light.

According to one aspect, the present disclosure relates to a curable precursor of a structural adhesive composition, comprising: a) a thermally curable resin; b) a thermal curing initiator for the thermally curable resin; c) a radiation self-polymerizable multi-functional compound comprising a polyether oligomeric backbone and at least one free-radical (co)polymerizable reactive group at each terminal position of the oligomer backbone; and d) a free-radical polymerization initiator for the radiation self-polymerizable multi-functional compound; wherein the free-radical polymerization initiator is activated by visible light.

A material for a printed circuit board, which is a film composed of a fluorinated resin layer, where the fluorinated resin layer contains a composition containing a fluorinated copolymer having at least one functional group selected from a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, has a melt flow rate of at most 15 g/10 min measured at 372 C. under a load of 49N, and has a storage elastic modulus of at least 650 MPa.

Provided is an adhesive as follows. The adhesive can bond/secure an adherend to a support with maintaining high adhesiveness during the existence of the need for securing of the adherend to the support, even in a high-temperature environment or in an environment with abrupt temperature change. The adhesive enables debonding of the adherend from the support without breakage of the adherend when the securing becomes unnecessary. The adhesive can be easily removed when remained on the adherend after debonding. The adhesive according to the present invention contains (A) a multivalent vinyl ether compound, (B) a compound including two or more of a constitutional unit represented by Formula (b), and (C) a thermoplastic resin. In the formula, X is selected from hydroxy and carboxy. ##STR00001##

Provided is an adhesive as follows. The adhesive can bond/secure an adherend to a support with maintaining high adhesiveness during the existence of the need for securing of the adherend to the support, even in a high-temperature environment or in an environment with abrupt temperature change. The adhesive enables debonding of the adherend from the support without breakage of the adherend when the securing becomes unnecessary. The adhesive can be easily removed when remained on the adherend after debonding. The adhesive according to the present invention contains (A) a multivalent vinyl ether compound, (B) a compound including two or more of a constitutional unit represented by Formula (b), and (C) a thermoplastic resin. In the formula, X is selected from hydroxy and carboxy. ##STR00001##

Embodiments of the present disclosure are directed to an adhesive layer, bearing including the adhesive layer, and methods of forming. The adhesive layer can include a mixture of a first polymer, a second polymer, and a third polymer, wherein the second polymer includes ethylene tetrafluoroethylene, and the third polymer includes a modified ethylene tetrafluoroethylene, ethylene tetrafluoroethylene hexafluoropropylene, or a combination thereof. In a particular embodiment, the first polymer can include an aromatic polymer. In another embodiment, the adhesive layer can have a tensile stress in an extrusion direction of at least 30 MPa.

Embodiments of the present disclosure are directed to an adhesive layer, bearing including the adhesive layer, and methods of forming. The adhesive layer can include a mixture of a first polymer, a second polymer, and a third polymer, wherein the second polymer includes ethylene tetrafluoroethylene, and the third polymer includes a modified ethylene tetrafluoroethylene, ethylene tetrafluoroethylene hexafluoropropylene, or a combination thereof. In a particular embodiment, the first polymer can include an aromatic polymer. In another embodiment, the adhesive layer can have a tensile stress in an extrusion direction of at least 30 MPa.

A material having a fluorinated resin layer is subjected to heat treatment. The fluorinated resin layer is composed of a composition containing a fluorinated copolymer (a) having at least one type of functional group selected from a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, having a melting point of from 280 to 320 C. and a melt flow rate of at least 2 g/10 min measured at 372 C. under a load of 49 N. The heat treatment is carried out at a temperature of at least 250 C. and lower by at least 5 C. than the melting point of the fluorinated copolymer (a) so that the ratio of the melt flow rate of the fluorinated resin layer after the heat treatment to that before the heat treatment, and the melt flow rate of the fluorinated resin layer after the heat treatment, are respectively within specific ranges.