A pressure-sensitive adhesive composition comprises a polyvinyl ether polymer. The polyvinyl ether polymer comprises 2-alkylalkoxyethylene monomeric units independently represented by the formula wherein R.sup.1 and R.sup.2 represent alkyl groups, and wherein taken together R.sup.1 and R.sup.2 have from 8 to 30 carbon atoms. An adhesive article comprises a layer of the pressure-sensitive adhesive composition on a substrate. ##STR00001##

An adhesive bonding method that includes bonding a handling wafer to a front side surface of a device wafer with an adhesive comprising N-substituted maleimide copolymers. The device wafer may then be thinned from the backside surface of the device wafer while the device wafer is adhesively engaged to the handling wafer. The adhesive can then be removed by laser debonding, wherein the device wafer is separated from the handling wafer.

An adhesive bonding method that includes bonding a handling wafer to a front side surface of a device wafer with an adhesive comprising N-substituted maleimide copolymers. The device wafer may then be thinned from the backside surface of the device wafer while the device wafer is adhesively engaged to the handling wafer. The adhesive can then be removed by laser debonding, wherein the device wafer is separated from the handling wafer.

To provide a material for a printed circuit board which is less likely to be warped in a high temperature region (from 150 to 200 C.) while maintaining electrical properties, a metal laminate, methods for producing them, and a method for producing a printed circuit board.

A material having a fluorinated resin layer is subjected to a heat treatment. The fluorinated resin layer is composed of a composition containing a fluorinated copolymer (a) having at least one type of functional group selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, having a melting point of from 280 to 320 C. and a melt flow rate of at least 2 g/10 min measured at 372 C. under a load of 49 N. The heat treatment is carried out at a temperature of at least 250 C. and lower by at least 5 C. than the melting point of the fluorinated copolymer (a) so that the ratio of the melt flow rate of the fluorinated resin layer after the heat treatment to that before the heat treatment, and the melt flow rate of the fluorinated resin layer after the heat treatment, are respectively within specific ranges.

An object of the present disclosure is to provide a thermosetting composition having an excellent thermosetting property, a photocurable property allowing for temporary bonding, and a long pot life. A thermosetting composition contains: a resin (A) including at least one type of group selected from the group consisting of epoxy group, oxetane group, and vinyl ether group; a cationic thermal polymerization initiator (B); a cationic photopolymerization initiator (C); and a stabilizer (D). The stabilizer (D) includes at least one of a surfactant (D1), an antioxidant (D2), or a resin modifier (D3). When the stabilizer (D) includes the surfactant (D1) in a proportion of X % by mass, the antioxidant (D2) in a proportion of Y % by mass, and the resin modifier (D3) in a proportion of Z % by mass, with respect to a total mass of the stabilizer (D), the proportion of the stabilizer (D) to 100 parts by mass of the resin (A) is less than or equal to (5.0X+1.5Y+20.0Z)/100 parts by mass.

Provided is an adhesive for use in an ultraviolet-light-emitting device using ultraviolet light having a wavelength of from 200 to 400 nm as a light source, which can attach adherends made of a polymer having a fluorine-containing alicyclic structure with excellent adhesiveness which is unlikely to be impaired by exposure to such ultraviolet light or heat.

An adhesive for forming an adhesive joint in an ultraviolet-light-emitting device, which is either the following adhesive (A) or the following adhesive (B) comprising a fluoropolymer having a fluorine-containing alicyclic structure; the adhesive (A): an adhesive in which the glass transition temperature of the fluoropolymer is from 30 to 100 C., and which does not contain an ultraviolet-shielding agent; and the adhesive (B): an adhesive comprising the fluoropolymer and an ultraviolet-shielding agent.

A composition of matter includes a mixture of styrene derivative monomers and methacrylate/acrylate derivative monomers, which have one or more urethane, carbamate, amide, and/or amine functional groups, and initiators, and the compositions are used to achieve composition control of the forming polymer, with the mole fraction of acrylate/methacrylate and styrene moieties in the forming polymer determined preferably by the chemistry and composition of the feeding monomers rather than the viscosity of the monomers.

A composition of matter includes a mixture of styrene derivative monomers and methacrylate/acrylate derivative monomers, which have one or more urethane, carbamate, amide, and/or amine functional groups, and initiators, and the compositions are used to achieve composition control of the forming polymer, with the mole fraction of acrylate/methacrylate and styrene moieties in the forming polymer determined preferably by the chemistry and composition of the feeding monomers rather than the viscosity of the monomers.