Provided is an adhesive as follows. The adhesive can bond/secure an adherend to a support with maintaining high adhesiveness during the existence of the need for securing of the adherend to the support, even in a high-temperature environment or in an environment with abrupt temperature change. The adhesive enables debonding of the adherend from the support without breakage of the adherend when the securing becomes unnecessary. The adhesive can be easily removed when remained on the adherend after debonding. The adhesive according to the present invention contains (A) a multivalent vinyl ether compound, (B) a compound including two or more of a constitutional unit represented by Formula (b), and (C) a thermoplastic resin. In the formula, X is selected from hydroxy and carboxy. ##STR00001##

Provided is an adhesive as follows. The adhesive can bond/secure an adherend to a support with maintaining high adhesiveness during the existence of the need for securing of the adherend to the support, even in a high-temperature environment or in an environment with abrupt temperature change. The adhesive enables debonding of the adherend from the support without breakage of the adherend when the securing becomes unnecessary. The adhesive can be easily removed when remained on the adherend after debonding. The adhesive according to the present invention contains (A) a multivalent vinyl ether compound, (B) a compound including two or more of a constitutional unit represented by Formula (b), and (C) a thermoplastic resin. In the formula, X is selected from hydroxy and carboxy. ##STR00001##

Provided herein is conductive adhesive composition comprising at least one epoxy resin, at least one polymer chosen from polyvinyl phenols and polyvinyl butyrals, at least one melamine resin, a plurality of eutectic metal alloy nanoparticles, and at least one solvent. Also provided herein is an electronic device comprising a substrate, conductive features disposed on the substrate, a conductive electrical component disposed over the conductive features, and a conductive adhesive composition disposed between the conductive features and the conductive electrical component. Further disclosed herein are methods of making a conductive adhesive composition.

Provided herein is conductive adhesive composition comprising at least one epoxy resin, at least one polymer chosen from polyvinyl phenols and polyvinyl butyrals, at least one melamine resin, a plurality of eutectic metal alloy nanoparticles, and at least one solvent. Also provided herein is an electronic device comprising a substrate, conductive features disposed on the substrate, a conductive electrical component disposed over the conductive features, and a conductive adhesive composition disposed between the conductive features and the conductive electrical component. Further disclosed herein are methods of making a conductive adhesive composition.

A method for dielectrically heating foamable composition to foam and set the composition is described. In particular, radio frequency (RF) heating is used to heat the foamable composition to provide insulation in the manufacture of an article.

A method for dielectrically heating foamable composition to foam and set the composition is described. In particular, radio frequency (RF) heating is used to heat the foamable composition to provide insulation in the manufacture of an article.

A solid adhesive is described that has an excellent finish, a light coating feeling, and is also capable of adhering to paper, wood, cloth, and the like. The solid adhesive contains water, an organic solvent, a gelation agent such as a dibenzalide of pentavalent to hexavalent sugar alcohol, and a polyvinyl formal resin. In some examples, the solid adhesive further includes a polyvinyl butyral resin and/or an adhesive resin such as a polyvinyl pyrrolidone resin. A feed type solid adhesive may be provided, including a feeding container that is filled with the solid adhesive described above.

The present invention aims to provide a polyvinyl acetal resin composition that is excellent in thermal stability and moldable by an extrusion method and can exhibit a high storage modulus even under high temperature, an adhesive sheet prepared from the polyvinyl acetal resin composition, an interlayer filling material for a touch panel prepared from the polyvinyl acetal resin composition, and a laminate produced using the interlayer filling material for a touch panel. The present invention relates to a polyvinyl acetal resin composition containing: a polyvinyl acetal; a photoradical polymerization initiator; and a monomer or oligomer having a radical polymerizable double bond.

The present invention aims to provide a polyvinyl acetal resin composition that is excellent in thermal stability and moldable by an extrusion method and can exhibit a high storage modulus even under high temperature, an adhesive sheet prepared from the polyvinyl acetal resin composition, an interlayer filling material for a touch panel prepared from the polyvinyl acetal resin composition, and a laminate produced using the interlayer filling material for a touch panel. The present invention relates to a polyvinyl acetal resin composition containing: a polyvinyl acetal; a photoradical polymerization initiator; and a monomer or oligomer having a radical polymerizable double bond.

The present invention aims to provide a polyvinyl acetal resin composition that is excellent in thermal stability and moldable by an extrusion method and can exhibit a high storage modulus even under high temperature, an adhesive sheet prepared from the polyvinyl acetal resin composition, an interlayer filling material for a touch panel prepared from the polyvinyl acetal resin composition, and a laminate produced using the interlayer filling material for a touch panel. The present invention relates to a polyvinyl acetal resin composition containing: a polyvinyl acetal; a photoradical polymerization initiator; and a monomer or oligomer having a radical polymerizable double bond.