C09J133/02

ADHESIVE TREATMENT LIQUID, AND METHOD FOR TREATING ADHESIVE

Provided are a pressure-sensitive adhesive treatment liquid, which can easily remove various kinds of pressure-sensitive adhesives, and a pressure-sensitive adhesive treatment method by which the various kinds of pressure-sensitive adhesives are easily removed. For example, when a pressure-sensitive adhesive tape including a base material and a pressure-sensitive adhesive is used as a treatment object, there are provided a pressure-sensitive adhesive treatment liquid, which can easily separate the base material and various kinds of pressure-sensitive adhesives from each other, and a pressure-sensitive adhesive treatment method by which the base material and the various kinds of pressure-sensitive adhesives are easily separated from each other. A pressure-sensitive adhesive treatment liquid according to an embodiment of the present invention is a treatment liquid for a pressure-sensitive adhesive, and includes a liquid having a Hansen solubility parameter value of 31 or less, and an alkaline compound. The concentration of the alkaline compound is from 0.001 wt % to 20 wt %.

ADHESIVE TREATMENT LIQUID, AND METHOD FOR TREATING ADHESIVE

Provided are a pressure-sensitive adhesive treatment liquid, which can easily remove various kinds of pressure-sensitive adhesives, and a pressure-sensitive adhesive treatment method by which the various kinds of pressure-sensitive adhesives are easily removed. For example, when a pressure-sensitive adhesive tape including a base material and a pressure-sensitive adhesive is used as a treatment object, there are provided a pressure-sensitive adhesive treatment liquid, which can easily separate the base material and various kinds of pressure-sensitive adhesives from each other, and a pressure-sensitive adhesive treatment method by which the base material and the various kinds of pressure-sensitive adhesives are easily separated from each other. A pressure-sensitive adhesive treatment liquid according to an embodiment of the present invention is a treatment liquid for a pressure-sensitive adhesive, and includes a liquid having a Hansen solubility parameter value of 31 or less, and an alkaline compound. The concentration of the alkaline compound is from 0.001 wt % to 20 wt %.

Buffered adhesive compositions for skin-adhering medical products

Provided are buffered adhesive compositions comprising a high molecular weight non-neutralized polymeric acid and a high molecular weight partially neutralized polymeric acid and products such as wound dressings and ostomy skin barriers incorporating the compositions.

Buffered adhesive compositions for skin-adhering medical products

Provided are buffered adhesive compositions comprising a high molecular weight non-neutralized polymeric acid and a high molecular weight partially neutralized polymeric acid and products such as wound dressings and ostomy skin barriers incorporating the compositions.

Polymer blends for use in multilayer structure and multilayer structures comprising the same

The present invention provides polymer blends that can be used in a multilayer structure and to multilayer structures comprising one or more layers formed from such blends. In one aspect, a polymer blend comprises an ionomer of a copolymer comprising ethylene and at least one of acrylic acid and methacrylic acid having a melt index (I.sub.2) of 1 to 60 g/10 minutes, wherein the total amount of ionomer comprises 50 to 99 weight percent of the blend based on the total weight of the blend, and a polyolefin having a density of 0.870 g/cm.sup.3 or more and having a melt index (I.sub.2) of 20 g/10 minutes or less, wherein the polyolefin comprises 1 to 50 weight percent of the blend based on the total weight of the blend, wherein the polymer blend meets the following equation: 3.5<2.76−60*I.sub.2(PO)+308*RVR+0.023*A<4.5 wherein I.sub.2(PO) is the melt index (I.sub.2) of the polyolefin, RVR is the relative viscosity ratio of the polyolefin to the ionomer (I.sub.2(PO)/I.sub.2(ionomer)), and A is the weight percent of ionomer in the polymer blend based on the total weight of the blend.

Polymer blends for use in multilayer structure and multilayer structures comprising the same

The present invention provides polymer blends that can be used in a multilayer structure and to multilayer structures comprising one or more layers formed from such blends. In one aspect, a polymer blend comprises an ionomer of a copolymer comprising ethylene and at least one of acrylic acid and methacrylic acid having a melt index (I.sub.2) of 1 to 60 g/10 minutes, wherein the total amount of ionomer comprises 50 to 99 weight percent of the blend based on the total weight of the blend, and a polyolefin having a density of 0.870 g/cm.sup.3 or more and having a melt index (I.sub.2) of 20 g/10 minutes or less, wherein the polyolefin comprises 1 to 50 weight percent of the blend based on the total weight of the blend, wherein the polymer blend meets the following equation: 3.5<2.76−60*I.sub.2(PO)+308*RVR+0.023*A<4.5 wherein I.sub.2(PO) is the melt index (I.sub.2) of the polyolefin, RVR is the relative viscosity ratio of the polyolefin to the ionomer (I.sub.2(PO)/I.sub.2(ionomer)), and A is the weight percent of ionomer in the polymer blend based on the total weight of the blend.

COMPOSITION

A composition for temporary bonding, including the following (A) to (C). An adhesive for temporary bonding for manufacturing an electronic device, including the composition for temporary bonding. (A) A (meth)acrylate comprising the following (A-1) and (A-2): (A-1) a monofunctional (meth)acrylate whose homopolymer has a Tg of −100° C. to 60° C., and (A-2) a polyfunctional (meth)acrylate; (B) a polyisobutene homopolymer; and (C) a photo radical polymerization initiator.

COMPOSITION

A composition for temporary bonding, including the following (A) to (C). An adhesive for temporary bonding for manufacturing an electronic device, including the composition for temporary bonding. (A) A (meth)acrylate comprising the following (A-1) and (A-2): (A-1) a monofunctional (meth)acrylate whose homopolymer has a Tg of −100° C. to 60° C., and (A-2) a polyfunctional (meth)acrylate; (B) a polyisobutene homopolymer; and (C) a photo radical polymerization initiator.

One-component pressure-sensitive adhesive composition having gel content based on reversible crosslinking via metal salts

A description is given of a one-component pressure-sensitive adhesive composition in the form of an aqueous polymer dispersion comprising at least one pressure-sensitive adhesive polymer which is formed by emulsion polymerization of soft (meth)acrylic ester monomers, methacrylic acid, and optionally further monomers, where the polymerization takes place in the presence of chain transfer agents or styrene. The pressure-sensitive adhesive polymer has a gel content which is based at least partly on a reversible crosslinking via metal salts. The one-component pressure-sensitive adhesive composition can be used for producing adhesive labels, adhesive tapes or adhesive foils.

One-component pressure-sensitive adhesive composition having gel content based on reversible crosslinking via metal salts

A description is given of a one-component pressure-sensitive adhesive composition in the form of an aqueous polymer dispersion comprising at least one pressure-sensitive adhesive polymer which is formed by emulsion polymerization of soft (meth)acrylic ester monomers, methacrylic acid, and optionally further monomers, where the polymerization takes place in the presence of chain transfer agents or styrene. The pressure-sensitive adhesive polymer has a gel content which is based at least partly on a reversible crosslinking via metal salts. The one-component pressure-sensitive adhesive composition can be used for producing adhesive labels, adhesive tapes or adhesive foils.