The present invention relates to an optical adhesive film which has excellent adhesive strength at room temperature and has improved efficiency in a rework process since peel strength is low at high temperatures. When attaching a touchscreen panel and an LCD by using the adhesive film of the present invention and separating the touchscreen panel and the LCD at high temperatures, the touchscreen panel and the LCD can be separated from each other without causing damage thereto. Additionally, the optical film of the present invention comprises two adhesive layers, wherein peeling occurs at the first adhesive layer having an adhesive composition such that a peeling surface can be controlled according to the convenience of a user.

The present invention relates to an optical adhesive film which has excellent adhesive strength at room temperature and has improved efficiency in a rework process since peel strength is low at high temperatures. When attaching a touchscreen panel and an LCD by using the adhesive film of the present invention and separating the touchscreen panel and the LCD at high temperatures, the touchscreen panel and the LCD can be separated from each other without causing damage thereto. Additionally, the optical film of the present invention comprises two adhesive layers, wherein peeling occurs at the first adhesive layer having an adhesive composition such that a peeling surface can be controlled according to the convenience of a user.

Acrylic syrup polymer composition are provided by partially polymerizing a (meth)acrylic monomer mixture in the presence of a thiol chain transfer agent to produce a first syrup polymer composition comprising a low molecular weight solute (meth)acrylic copolymer and solvent monomers, quenching the chain transfer agent, further polymerizing the first syrup polymer composition to produce a second syrup polymer composition comprising the low molecular weight solute acrylic copolymer, a high molecular weight solute acrylic copolymer and optionally unreacted solvent monomers, optionally adding a crosslinker and photoinitiator; and further photopolymerizing the syrup polymer composition to produce a pressure-sensitive adhesive.

An object of the present invention is to provide a pressure-sensitive adhesive sheet for a touch panel which is excellent for the operability of a capacitance-type touch panel, which is able to suppress the occurrence of malfunctions in a capacitance-type touch panel in a wide range of temperature environments from low temperatures to high temperatures, and which is also excellent in pressure-sensitive adhesion. In addition, another object of the present invention is to provide a laminate for a touch panel and a capacitance-type touch panel which include a pressure-sensitive adhesive sheet for a touch panel. In the pressure-sensitive adhesive sheet for a touch panel of the present invention, a relative dielectric constant obtained by impedance measurement at 1 MHz at 20° C. is 4.0 or more, a temperature dependency obtained from a temperature dependency evaluation test is 25% or less, and a 180 degree peel strength with respect to glass is 0.2 to 1.2 N/mm.

The purpose of the present invention is to obtain an organosilicon compound containing an isocyanate group by thiol-ene addition reaction from a corresponding organosilicon compound having a mercapto group and an isocyanate compound having a polymerizable group. Provided is a silane coupling agent which includes a specific linking structure in which a sulfur atom is indispensably contained in a linking chain which connects an isocyanate group to a hydrolyzable silyl group. Compared to silane coupling agents for use in existing technologies, this silane coupling agent has enhanced hydrophobicity and an increased organic-moiety proportion due to the sulfur-containing linking structure. Use of this silane coupling agent as an adhesive modifier hence makes it possible to obtain a pressure-sensitive adhesive in which the silane coupling agent has improved compatibility with the resin and is excellent in terms of strength of bonding to and interaction with the matrix resin having hydroxy groups and which is able to have initial reworkability and further have high adhesive force at high temperatures or under high-temperature high-humidity conditions.

The purpose of the present invention is to obtain an organosilicon compound containing an isocyanate group by thiol-ene addition reaction from a corresponding organosilicon compound having a mercapto group and an isocyanate compound having a polymerizable group. Provided is a silane coupling agent which includes a specific linking structure in which a sulfur atom is indispensably contained in a linking chain which connects an isocyanate group to a hydrolyzable silyl group. Compared to silane coupling agents for use in existing technologies, this silane coupling agent has enhanced hydrophobicity and an increased organic-moiety proportion due to the sulfur-containing linking structure. Use of this silane coupling agent as an adhesive modifier hence makes it possible to obtain a pressure-sensitive adhesive in which the silane coupling agent has improved compatibility with the resin and is excellent in terms of strength of bonding to and interaction with the matrix resin having hydroxy groups and which is able to have initial reworkability and further have high adhesive force at high temperatures or under high-temperature high-humidity conditions.

An adhesive including a copolymer that includes repeating units of a first monomer and a second monomer, wherein: the first monomer includes a (meth)acrylate-based monomer, a silicon-based monomer, or an urethane-based monomer, the second monomer includes a light absorbing group, and the light absorbing group is an azo-based dye.

A heat-shrink sleeve is provided for covering a pipe joint formed between two pipes that are coupled to one another to form a tube. The heat-shrink sleeve comprises a heat-shrinkable material that is configured to conform to the first and second pipes when heated to cover the pipe joint.

Adhesives comprising: a) 35-85 weight percent of a pressure sensitive adhesive comprising: i) a polymer selected from rubbers and polyacrylate polymers and ii) optionally one or more tackifiers; and dispersed therein b) 15-50 weight percent fire retardant (FR) particles comprising one or more phosphorus-containing compounds selected from organophosphine oxides and organophosphi-nates. In some embodiments, the phosphorus-containing compounds comprise 35-65 weight percent of an organophosphine oxide and 65-35 weight percent of an organophosphinate. The FR particles may have a D50 particle size of 1-120 micrometers, 40-120 micrometers, or 70-120 micrometers. Adhesive films comprising the adhesives described herein may be free-standing adhesive films or adhesive layers comprised in tapes.

Adhesives comprising: a) 35-85 weight percent of a pressure sensitive adhesive comprising: i) a polymer selected from rubbers and polyacrylate polymers and ii) optionally one or more tackifiers; and dispersed therein b) 15-50 weight percent fire retardant (FR) particles comprising one or more phosphorus-containing compounds selected from organophosphine oxides and organophosphi-nates. In some embodiments, the phosphorus-containing compounds comprise 35-65 weight percent of an organophosphine oxide and 65-35 weight percent of an organophosphinate. The FR particles may have a D50 particle size of 1-120 micrometers, 40-120 micrometers, or 70-120 micrometers. Adhesive films comprising the adhesives described herein may be free-standing adhesive films or adhesive layers comprised in tapes.