The present invention relates to an adhesive composition for a semiconductor and an adhesive film for a semiconductor including a cured product thereof, and in particular, to an adhesive composition for a semiconductor capable of removing voids occurring between an adherend and an adhesive and reducing bleed-out, and an adhesive film for a semiconductor including a cured product thereof.

The present invention relates to a composition suitable as (meth)acrylic adhesive composition comprising a multistage polymer in form of polymeric particles and a (meth)acrylic polymer, its process of preparation, and its use. In particular the present invention relates to a structural (meth)acrylic adhesive composition comprising a multistage polymer in form of polymeric particles made by a multistage process and a (meth)acrylic polymer, its process of preparation and its use. More particularly the present invention relates to structural (meth)acrylic adhesive composition made from a two part composition comprising a multistage polymer in form of polymeric particles made by a multistage process and a (meth)acrylic polymer, its process of preparation, and its use.

The present invention relates to a composition suitable as (meth)acrylic adhesive composition comprising a multistage polymer in form of polymeric particles and a (meth)acrylic polymer, its process of preparation, and its use. In particular the present invention relates to a structural (meth)acrylic adhesive composition comprising a multistage polymer in form of polymeric particles made by a multistage process and a (meth)acrylic polymer, its process of preparation and its use. More particularly the present invention relates to structural (meth)acrylic adhesive composition made from a two part composition comprising a multistage polymer in form of polymeric particles made by a multistage process and a (meth)acrylic polymer, its process of preparation, and its use.

As a first aspect, provided is a hybrid lens for which peeling and shifting of a glass and a resin lens do not easily occur, and for which floating of an adhesive layer and peeling between the glass and resin lens do not easily occur even when the hybrid lens is exposed to a high temperature environment. As a second aspect, provided is an easily produced hybrid lens in which a glass and a resin lens are laminated, and in which the resin lens and a light-shielding portion are laminated with good precision.

The hybrid lenses 11 and 12 each include a glass substrate 3, a resin lens 2, and an adhesive layer 4 provided between the glass substrate 3 and the resin lens 2. In the hybrid lens 11, the glass transition temperature of the resin lens 2 is higher than the glass transition temperature of the adhesive layer 4, and the difference between the glass transition temperature of the resin lens 2 and the glass transition temperature of the adhesive layer 4 is from 97 to 150° C. The hybrid lens 12 further includes a metal compound layer 52 provided between the glass substrate 3 and the resin lens 2.

As a first aspect, provided is a hybrid lens for which peeling and shifting of a glass and a resin lens do not easily occur, and for which floating of an adhesive layer and peeling between the glass and resin lens do not easily occur even when the hybrid lens is exposed to a high temperature environment. As a second aspect, provided is an easily produced hybrid lens in which a glass and a resin lens are laminated, and in which the resin lens and a light-shielding portion are laminated with good precision.

The hybrid lenses 11 and 12 each include a glass substrate 3, a resin lens 2, and an adhesive layer 4 provided between the glass substrate 3 and the resin lens 2. In the hybrid lens 11, the glass transition temperature of the resin lens 2 is higher than the glass transition temperature of the adhesive layer 4, and the difference between the glass transition temperature of the resin lens 2 and the glass transition temperature of the adhesive layer 4 is from 97 to 150° C. The hybrid lens 12 further includes a metal compound layer 52 provided between the glass substrate 3 and the resin lens 2.

The present invention aims to provide an adhesive composition which enables achievement of highly strong adhesion between a lightweight composite resin and a lightweight metal member, and which can maintain excellent adhesive strength even in cases where the ambient temperature largely changes or the adhesive composition is in contact with water or a snow-melting agent, and an adhesive sheet using it. The above object can be achieved with an adhesive composition containing at least an epoxy resin, an acrylic particle, and a curing agent, wherein the acrylic particle is a core-shell structure containing a butadiene-based rubber, and polymethacrylate or polyacrylate. The adhesive sheet is constituted such that an adhesive layer formed with the adhesive composition is present between a first release film and a second release film.

A flexible display apparatus includes at least two components that are stacked, and at least one optical adhesive layer. Each optical adhesive layer is disposed between two adjacent components of the at least two components, and includes at least two adhesive layers stacked in a stacking direction of the at least two components. The at least two adhesive layers include at least one first adhesive layer and at least one second adhesive layer. One of the at least one first adhesive layer is adhered to one of the two adjacent components, and a storage modulus of each second adhesive layer is less than a storage modulus of each first adhesive layer.

A thermosetting adhesive composition and thermosetting adhesive sheet capable of obtaining stable conductivity even in high-temperature environments or high-temperature/high-humidity environments are provided. The thermosetting adhesive sheet comprises an acrylic copolymer obtained by copolymerizing 55 to 80 wt % of alkyl (meth)acrylate, 15 to 30 wt % of acrylonitrile, and 5 to 15 wt % of glycidyl methacrylate; an epoxy resin; an epoxy resin curing agent; and a dendritic conductive filler having a tap density of 1.0 to 1.8 g/cm.sup.3. Thereby, thermal expansion after curing is suppressed, and electrical contacts of the conductive filler are increased, allowing stable conductivity to be obtained even in high-temperature environments or high-temperature/high-humidity environments.

A thermosetting adhesive composition and thermosetting adhesive sheet capable of obtaining stable conductivity even in high-temperature environments or high-temperature/high-humidity environments are provided. The thermosetting adhesive sheet comprises an acrylic copolymer obtained by copolymerizing 55 to 80 wt % of alkyl (meth)acrylate, 15 to 30 wt % of acrylonitrile, and 5 to 15 wt % of glycidyl methacrylate; an epoxy resin; an epoxy resin curing agent; and a dendritic conductive filler having a tap density of 1.0 to 1.8 g/cm.sup.3. Thereby, thermal expansion after curing is suppressed, and electrical contacts of the conductive filler are increased, allowing stable conductivity to be obtained even in high-temperature environments or high-temperature/high-humidity environments.

A resin composition for temporary fixing, the resin composition containing (A) a thermoplastic resin, (B) a thermosetting resin, and (C) a silicone compound, the resin composition having a shear viscosity of 4000 Pa.Math.s or less at 120° C. and a rate of change in the shear viscosity being within 30% as determined before and after the resin composition is left to stand for 7 days in an atmosphere of 25° C.