Provided are a window film for a display and a display device including the same, and the window film for a display comprises: a substrate layer; a coating layer formed on one side of the substrate layer; and an adhesive layer formed on the other side of the substrate layer, wherein the coating layer and/or the adhesive layer includes, relative to each layer, a UV absorbent of approximately 3 wt % to approximately 20 wt %, and the window film for a display has a transmittance of approximately 1% or less for a wavelength of 390 nm or less.

A heat spreader for high volume manufacturing of a heat source, having a heat spreader composition which comprises a heat spreader material, an adhesive thereon, and a release material. The adhesive and release material are selected to prevent delamination of the heat spreader material when the release material is removed during the high volume manufacturing process of heat sources.

A heat spreader for high volume manufacturing of a heat source, having a heat spreader composition which comprises a heat spreader material, an adhesive thereon, and a release material. The adhesive and release material are selected to prevent delamination of the heat spreader material when the release material is removed during the high volume manufacturing process of heat sources.

The present invention relates to a dicing film including: a substrate film; and a cohesive layer, wherein a storage modulus of the cohesive layer at 30° C. is 3*10.sup.5 to 4*10.sup.6 Pa, and the cohesive layer has a degree of cross-linking of 80% to 99%, a dicing die-bonding film including the dicing film, and a dicing method of a semiconductor wafer using the dicing die-bonding film.

The present invention relates to a dicing film including: a substrate film; and a cohesive layer, wherein a storage modulus of the cohesive layer at 30° C. is 3*10.sup.5 to 4*10.sup.6 Pa, and the cohesive layer has a degree of cross-linking of 80% to 99%, a dicing die-bonding film including the dicing film, and a dicing method of a semiconductor wafer using the dicing die-bonding film.

The present invention relates to a dicing film including: a substrate film; and a cohesive layer, wherein a storage modulus of the cohesive layer at 30° C. is 3*10.sup.5 to 4*10.sup.6 Pa, and the cohesive layer has a degree of cross-linking of 80% to 99%, a dicing die-bonding film including the dicing film, and a dicing method of a semiconductor wafer using the dicing die-bonding film.

An object of the present invention is to provide a pressure-sensitive adhesive having excellent adhesive property, facilitating secondary processing of an adhesive product and providing an adhesive product with excellent holding strength to a substrate and adhesion property to a curved surface. The present invention relates to a water-based composition comprising: (A) an aqueous resin emulsion comprising a polymer having a glass transition temperature of −65 to −40° C. and (B) an aqueous resin emulsion comprising a polymer having a glass transition temperature of 20° C. or more, wherein the aqueous resin emulsion has a minimum film-forming temperature of 40° C. or more.

An object of the present invention is to provide a pressure-sensitive adhesive having excellent adhesive property, facilitating secondary processing of an adhesive product and providing an adhesive product with excellent holding strength to a substrate and adhesion property to a curved surface. The present invention relates to a water-based composition comprising: (A) an aqueous resin emulsion comprising a polymer having a glass transition temperature of −65 to −40° C. and (B) an aqueous resin emulsion comprising a polymer having a glass transition temperature of 20° C. or more, wherein the aqueous resin emulsion has a minimum film-forming temperature of 40° C. or more.

Adhesive compositions that replace gaskets and liners in sealing applications for packages that are detachable with hand force are described. The adhesive compositions are particularly useful in preventing leaks and spillage during storage and transport of its packaged contents.

Adhesive compositions that replace gaskets and liners in sealing applications for packages that are detachable with hand force are described. The adhesive compositions are particularly useful in preventing leaks and spillage during storage and transport of its packaged contents.