An adhesive composition having excellent adhesiveness to a cycloolefin resin or the like. The adhesive composition of the present invention includes a polymer having a repeating unit derived from a polymerizable compound represented by formula (I): Y—N(Ar)(R) Formula (I), in which Ar represents an unsubstituted or substituted C6 to C14 aryl group or an unsubstituted or substituted C6 to C10 aryl C1 to C3 alkyl group; R represents an unsubstituted or substituted C1 to C6 alkyl group, an unsubstituted or substituted C3 to C6 cycloalkyl group, an unsubstituted or substituted C6 to C14 aryl group, or an unsubstituted or substituted C6 to C10 aryl C1 to C3 alkyl group; and Y represents a polymerizable functional group. In Formula (I), a substituent on Ar and a substituent on R can bond to form a divalent organic group.

Provided are adhesive compositions comprising copolymers having biomimetic cross-linkable monomers derived from mussel adhesive proteins. Also provided are methods of curing the adhesive compositions, methods of manufacturing the adhesive compositions, and devices comprising the adhesive compositions.

An adhesive sheet for temporary fixation which may have excellent heat resistance to exhibit a sufficient adhesive force even though it undergoes a high temperature process during a process of manufacturing a semiconductor device and may also exhibit a sufficient reduction of the adhesive force by photocuring during the step of peeling off, and a method of manufacturing a semiconductor device using the same, are provided.

An adhesive sheet for temporary fixation which may have excellent heat resistance to exhibit a sufficient adhesive force even though it undergoes a high temperature process during a process of manufacturing a semiconductor device and may also exhibit a sufficient reduction of the adhesive force by photocuring during the step of peeling off, and a method of manufacturing a semiconductor device using the same, are provided.

A solid thermal balancing composite material with lightweight is formed by a reinforced composite material pressured by a molding machine after going through a powder filling equipment. The reinforced composite material is a mixture of inorganic filler powders and polymer adhesives after granulation. The specific gravity of the solid thermal balancing composite material is no greater than 2.0. In addition, the present invention is adjustable in different shapes for various applications of heat dissipation.

A solid thermal balancing composite material with lightweight is formed by a reinforced composite material pressured by a molding machine after going through a powder filling equipment. The reinforced composite material is a mixture of inorganic filler powders and polymer adhesives after granulation. The specific gravity of the solid thermal balancing composite material is no greater than 2.0. In addition, the present invention is adjustable in different shapes for various applications of heat dissipation.

There is disclosed a method of forming a polymer coated sulphur cured rubber composition wherein the bond strength between the polymer coating and the sulphur cured rubber is surprisingly great. The method includes providing a sulphur curable rubber composition comprising a compound including at least one thiol group, and/or contacting a sulphur curable rubber composition with a compound including at least one thiol group, and contacting the sulphur curable composition with a second polymeric precursor including a diallylamide group. The compound including at least one thiol group and the second polymeric precursors are reacted together to form a polymeric layer; and the sulphur curable rubber composition is cured to form a polymer coated sulphur cured rubber composition.

An adhesive composition having excellent adhesiveness to a cycloolefin resin or the like. The adhesive composition of the present invention includes a polymer having a repeating unit derived from a polymerizable compound represented by formula (I): YN(Ar)(R) Formula (I), in which Ar represents an unsubstituted or substituted C6 to C14 aryl group or an unsubstituted or substituted C6 to C10 aryl C1 to C3 alkyl group; R represents an unsubstituted or substituted C1 to C6 alkyl group, an unsubstituted or substituted C3 to C6 cycloalkyl group, an unsubstituted or substituted C6 to C14 aryl group, or an unsubstituted or substituted C6 to C10 aryl C1 to C3 alkyl group; and Y represents a polymerizable functional group. In Formula (I), a substituent on Ar and a substituent on R can bond to form a divalent organic group.

An adhesive composition having excellent adhesiveness to a cycloolefin resin or the like. The adhesive composition of the present invention includes a polymer having a repeating unit derived from a polymerizable compound represented by formula (I): YN(Ar)(R) Formula (I), in which Ar represents an unsubstituted or substituted C6 to C14 aryl group or an unsubstituted or substituted C6 to C10 aryl C1 to C3 alkyl group; R represents an unsubstituted or substituted C1 to C6 alkyl group, an unsubstituted or substituted C3 to C6 cycloalkyl group, an unsubstituted or substituted C6 to C14 aryl group, or an unsubstituted or substituted C6 to C10 aryl C1 to C3 alkyl group; and Y represents a polymerizable functional group. In Formula (I), a substituent on Ar and a substituent on R can bond to form a divalent organic group.

The present invention relates to a pressure-sensitive adhesive composition containing a base polymer, in which the base polymer is a copolymer containing structures derived from a water-insoluble hydrophilic monomer (a) and a nitrogen-containing hydrophilic monomer (b), and a content ratio of the structure derived from the water-insoluble hydrophilic monomer (a) in the base polymer is 40 mass % or more.