A curable resin composition for forming an adhesive layer on at least one surface of a substrate (C), the curable resin composition comprising: a compound (A) represented by formula (1):

##STR00001##

wherein X represents a functional group containing a reactive group, and R.sup.1 and R.sup.2 each independently represent a hydrogen atom or an optionally substituted, aliphatic hydrocarbon, aryl, or heterocyclic group; and an adhesion aid compound (B), the curable resin composition satisfying formula (X): −10≦HSP (A)−HSP (B)≦10 and formula (Y): −10≦HSP (C)−HSP (B)≦10, wherein HSP (A) is an HSP value of the compound (A), HSP (B) is an HSP value of the adhesion aid compound (B), and HSP (C) is an HSP value of the substrate (C).

A curable resin composition for forming an adhesive layer on at least one surface of a substrate (C), the curable resin composition comprising: a compound (A) represented by formula (1):

##STR00001##

wherein X represents a functional group containing a reactive group, and R.sup.1 and R.sup.2 each independently represent a hydrogen atom or an optionally substituted, aliphatic hydrocarbon, aryl, or heterocyclic group; and an adhesion aid compound (B), the curable resin composition satisfying formula (X): −10≦HSP (A)−HSP (B)≦10 and formula (Y): −10≦HSP (C)−HSP (B)≦10, wherein HSP (A) is an HSP value of the compound (A), HSP (B) is an HSP value of the adhesion aid compound (B), and HSP (C) is an HSP value of the substrate (C).

The disclosure relates to compositions containing 1,1-disubstituted alkene compounds capable of preparing polymers having glass transition temperatures above room temperature. The present teaching also relates to polymers prepared 1,1-disubstituted alkene compounds which exhibit glass transition temperatures of 60° C. The disclosure also relate to methods for enhancing the glass transition temperatures of polymers prepared from 1,1-disubstituted alkene compounds.

The disclosure relates to compositions containing 1,1-disubstituted alkene compounds capable of preparing polymers having glass transition temperatures above room temperature. The present teaching also relates to polymers prepared 1,1-disubstituted alkene compounds which exhibit glass transition temperatures of 60° C. The disclosure also relate to methods for enhancing the glass transition temperatures of polymers prepared from 1,1-disubstituted alkene compounds.

The present invention provides a sealant composition for electronic device, in which the curing does not proceed when heated, which does not cause the problem of use in the mounting process of electronic device. The present invention relates to a sealant composition for electronic device comprising (a) a compound having two or more (meth)acryloyl groups and (c) a nitroxide compound and/or a thiocarbonylthio compound.

The present invention provides a sealant composition for electronic device, in which the curing does not proceed when heated, which does not cause the problem of use in the mounting process of electronic device. The present invention relates to a sealant composition for electronic device comprising (a) a compound having two or more (meth)acryloyl groups and (c) a nitroxide compound and/or a thiocarbonylthio compound.

The present invention discloses an optical assembly. The optical assembly comprises: a first optical film having a first surface; an adhesive disposed on the first surface of the first optical film, wherein the adhesive comprises a photo-curable portion and a thermally-curable portion; and a second optical film comprising a photo-curable material bonded to the photo-curable portion of the adhesive, wherein the photo-curable portion of the adhesive is being bonded to the photo-curable material of the second optical film when the photo-curable portion of the adhesive is being cured and the thermally-curable portion of the adhesive has been cured.

A process prepares a prepolymer containing a urethane group and a curable silicon-functional group, or a prepolymer of formula (IV),

##STR00001##

The prepolymer may be cured to a cross-linked polymer by ambient moisture and is therefore suitable for use as a component in a one-component sealant or adhesive composition.

A process prepares a prepolymer containing a urethane group and a curable silicon-functional group, or a prepolymer of formula (IV),

##STR00001##

The prepolymer may be cured to a cross-linked polymer by ambient moisture and is therefore suitable for use as a component in a one-component sealant or adhesive composition.

A resin composition includes (a) at least one 2-methylene-1,3-dicarbonyl compound, (b) an initiator comprising at least one basic substance, and (c) an anionic polymerization inhibitor including at least one borate ester compound.