A process prepares a cross-linked polymer containing urethane groups and silicon atoms. Starting materials of the process include a compound A) with a five-membered cyclic monothiocarbonate group, a compound B) with an amino group, selected from primary or secondary amino groups or blocked amino groups, and optionally, a compound C) with at least one functional group that reacts with a group —SH. One of the compounds contains a silicon-functional group. In one example of the process, compounds A) and B), and optionally C), are then reacted under exclusion of water to obtain a polymer with curable silicon-functional groups. The polymer is applied to a surface, gap, or a three-dimensional template. The silicon-functional groups are cured with ambient water. The polymer contains 0.001 to 0.3 mol of silicon per 100 g of the polymer.

The present invention relates to (meth)acrylate-functionalized waxes and curable compositions, such as anaerobic adhesive compositions, made therewith.

The present invention relates to (meth)acrylate-functionalized waxes and curable compositions, such as anaerobic adhesive compositions, made therewith.

An encapsulation material is used to fill a gap between a base member and a semiconductor chip to be bonded onto the base member. The encapsulation material has a reaction start temperature of 160° C. or less. A total content of components volatilized from the encapsulation material when the encapsulation material is heated to at least one temperature falling within a range from 100° C. to 170° C. is 0.5% by mass or less of the entire encapsulation material.

An encapsulation material is used to fill a gap between a base member and a semiconductor chip to be bonded onto the base member. The encapsulation material has a reaction start temperature of 160° C. or less. A total content of components volatilized from the encapsulation material when the encapsulation material is heated to at least one temperature falling within a range from 100° C. to 170° C. is 0.5% by mass or less of the entire encapsulation material.

A process prepares a cross-linked polymer containing urethane groups and silicon atoms. Starting materials of the process include a compound A) with a five-membered cyclic monothiocarbonate group, a compound B) with an amino group, selected from primary or secondary amino groups or blocked amino groups, and optionally, a compound C) with at least one functional group that reacts with a group —SH. One of the compounds contains a silicon-functional group. In one example of the process, compounds A) and B), and optionally C), are then reacted under exclusion of water to obtain a polymer with curable silicon-functional groups. The polymer is applied to a surface, gap, or a three-dimensional template. The silicon-functional groups are cured with ambient water. The polymer contains 0.001 to 0.3 mol of silicon per 100 g of the polymer.

Methods, compositions, and kits for adhering polymers and other materials to another material, and in particular to bone or bone-like structures or surfaces. A composition of matter includes a urethane dimethacrylate-methyl methacrylate copolymer with a plurality of first polymer regions based on urethane dimethacrylate and a plurality of second polymer regions based on methyl methacrylate. The method includes placing an orthopedic joint implant having an attachment surface in a joint space, applying a first non-urethane-containing precursor, a second urethane-containing precursor, and a initiator to the attachment surface; contacting the first and second precursors and the initiator with the joint surface; and copolymerizing the first and second precursors and forming an adhesive copolymer and attaching the implant to the joint.

Methods, compositions, and kits for adhering polymers and other materials to another material, and in particular to bone or bone-like structures or surfaces. A composition of matter includes a urethane dimethacrylate-methyl methacrylate copolymer with a plurality of first polymer regions based on urethane dimethacrylate and a plurality of second polymer regions based on methyl methacrylate. The method includes placing an orthopedic joint implant having an attachment surface in a joint space, applying a first non-urethane-containing precursor, a second urethane-containing precursor, and a initiator to the attachment surface; contacting the first and second precursors and the initiator with the joint surface; and copolymerizing the first and second precursors and forming an adhesive copolymer and attaching the implant to the joint.

Methods, compositions, and kits for adhering polymers and other materials to another material, and in particular to bone or bone-like structures or surfaces. A composition of matter includes a urethane dimethacrylate-methyl methacrylate copolymer with a plurality of first polymer regions based on urethane dimethacrylate and a plurality of second polymer regions based on methyl methacrylate. The method includes placing an orthopedic joint implant having an attachment surface in a joint space, applying a first non-urethane-containing precursor, a second urethane-containing precursor, and a initiator to the attachment surface; contacting the first and second precursors and the initiator with the joint surface; and copolymerizing the first and second precursors and forming an adhesive copolymer and attaching the implant to the joint.

The present invention provides a cell adhesion sheet in which the adhesion of platelets is suppressed and the adhesion of cells is excellent. The cell adhesion sheet according to the embodiment of the present invention is formed of a composition containing a compound represented by Formula (1).

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