An active-energy-ray-curable adhesive composition comprises at least radical polymerizable compounds. The radical polymerizable compounds comprise a component A having a log Pow of −2 to 2, and a component B having a log Pow more than 7, each of these log Pow values representing an octanol/water distribution coefficient. The component A preferably comprises at least one nitrogen-containing monomer selected from the group consisting of (meth)acrylamide derivatives, amino-group-containing monomers, and nitrogen-containing and heterocycle-containing vinyl monomers. The component B preferably comprises an alkyl (eth)acrylate having 18 to 20 carbon atoms.

An active-energy-ray-curable adhesive composition comprises at least radical polymerizable compounds. The radical polymerizable compounds comprise a component A having a log Pow of −2 to 2, and a component B having a log Pow more than 7, each of these log Pow values representing an octanol/water distribution coefficient. The component A preferably comprises at least one nitrogen-containing monomer selected from the group consisting of (meth)acrylamide derivatives, amino-group-containing monomers, and nitrogen-containing and heterocycle-containing vinyl monomers. The component B preferably comprises an alkyl (eth)acrylate having 18 to 20 carbon atoms.

Described are compositions comprising a defoamer mixture comprising mineral oil and hydrophobic particles such as for example wax particles; di- or monoalkyl sulfosuccinate having at least 9 carbon atoms in the alkyl group and certain ethylene oxide/propylene oxide block copolymers. Also described are aqueous dispersions of hydrophobic polymers comprising these compositions and the use of the aqueous polymer dispersions as an adhesive, for example for producing composite films from transparent polymer films.

A composite material comprises a reinforcing material carried in a polymer matrix material which is the polymerization product of a polymerizable composition comprising a di-activated vinyl compound, with the proviso that the di-activated vinyl compound is not a cyanoacrylate. The reinforcing materials may be a wide variety of substrates including thermally sensitive materials. Exemplary composites can be molded and cured at ambient temperatures. Also disclosed are laminate materials having layered materials adhered by curing a di-activated vinyl polymerizable composition.

A curable composition includes a polyamide composition that includes a first polyamide. The first polyamide includes a tertiary amide in the backbone thereof and is amine terminated. The curable composition further includes an amino functional compound comprising from 2 to 20 carbon atoms, a multifunctional (meth)acrylate, an epoxy resin, and an inorganic filler. The inorganic filler is present an amount of at least 25 wt. %, based on the total weight of the curable composition.

A curable composition includes a polyamide composition that includes a first polyamide. The first polyamide includes a tertiary amide in the backbone thereof and is amine terminated. The curable composition further includes an amino functional compound comprising from 2 to 20 carbon atoms, a multifunctional (meth)acrylate, an epoxy resin, and an inorganic filler. The inorganic filler is present an amount of at least 25 wt. %, based on the total weight of the curable composition.

A curable and hygroscopic resin composition for sealing electronic devices, comprising: a radically polymerizable compound (a); a hygroscopic compound (b) containing a structure represented by Formula (1); and a photo-radical polymerization initiator (c); a resin cured material formed by curing the composition, and an electronic device sealed by curing the composition. ##STR00001## wherein in Formula (1), R designates (i) an acyl group, (ii) a hydrocarbon group, or (iii) a group having at least one selected from the group consisting of O, S, CO, and NH, between a carbon-carbon bond of the above-described hydrocarbon group; M designates a boron or aluminum atom; n is an integer of 2 to 20; and *1 and *2 each designate a binding site to a terminal group or are bonded to each other.

A curable and hygroscopic resin composition for sealing electronic devices, comprising: a radically polymerizable compound (a); a hygroscopic compound (b) containing a structure represented by Formula (1); and a photo-radical polymerization initiator (c); a resin cured material formed by curing the composition, and an electronic device sealed by curing the composition. ##STR00001## wherein in Formula (1), R designates (i) an acyl group, (ii) a hydrocarbon group, or (iii) a group having at least one selected from the group consisting of O, S, CO, and NH, between a carbon-carbon bond of the above-described hydrocarbon group; M designates a boron or aluminum atom; n is an integer of 2 to 20; and *1 and *2 each designate a binding site to a terminal group or are bonded to each other.

Embodiments of an optical adhesive are provided. The optical adhesive includes about 20% to about 60% by volume of first monomers. The first monomers have at least two acrylate or methacrylate groups. The optical adhesive also includes about 40% to about 80% by volume of second monomers. The second monomers have at least one fluorine atom and at least one acrylate or methacrylate group. The optical adhesive has a refractive index of from about 1.40 to about 1.55, and in the temperature range of about 10 C. to about 85 C., the refractive index of the optical adhesive has a thermal drift dn/dT of less than about 410.sup.4/ C. Embodiments of a mechanical joint between two optical fiber segments using the optical adhesive and embodiments of a method for joining two optical fiber segments are also provided.

Embodiments of an optical adhesive are provided. The optical adhesive includes about 20% to about 60% by volume of first monomers. The first monomers have at least two acrylate or methacrylate groups. The optical adhesive also includes about 40% to about 80% by volume of second monomers. The second monomers have at least one fluorine atom and at least one acrylate or methacrylate group. The optical adhesive has a refractive index of from about 1.40 to about 1.55, and in the temperature range of about 10 C. to about 85 C., the refractive index of the optical adhesive has a thermal drift dn/dT of less than about 410.sup.4/ C. Embodiments of a mechanical joint between two optical fiber segments using the optical adhesive and embodiments of a method for joining two optical fiber segments are also provided.