C09J143/04

CURABLE SILICONE-ACRYLATE COMPOSITIONS, CONDUCTIVE MATERIALS PREPARED THEREWITH, AND RELATED METHODS

A curable composition is disclosed. The curable composition comprises (I) an epoxide-functional silicone-acrylate polymer, (II) an aminosiloxane, and (III) a conductive filler. The epoxide-functional silicone-acrylate polymer comprises acrylate-derived monomeric units comprising siloxane moieties, epoxide-functional moieties, and optionally, hydrocarbyl moieties, and the aminosiloxane comprises an average of at least two amine functional groups per molecule. Methods of preparing the curable composition, and a cured product thereof, are also disclosed. A method of forming a composite article comprising a conductive layer with the curable composition is disclosed is also disclosed. The method comprises disposing the curable composition on a substrate, and curing the curable composition to give a conductive layer on the substrate, thereby forming the composite article.

CURABLE SILICONE-ACRYLATE COMPOSITIONS, CONDUCTIVE MATERIALS PREPARED THEREWITH, AND RELATED METHODS

A curable composition is disclosed. The curable composition comprises (I) an epoxide-functional silicone-acrylate polymer, (II) an aminosiloxane, and (III) a conductive filler. The epoxide-functional silicone-acrylate polymer comprises acrylate-derived monomeric units comprising siloxane moieties, epoxide-functional moieties, and optionally, hydrocarbyl moieties, and the aminosiloxane comprises an average of at least two amine functional groups per molecule. Methods of preparing the curable composition, and a cured product thereof, are also disclosed. A method of forming a composite article comprising a conductive layer with the curable composition is disclosed is also disclosed. The method comprises disposing the curable composition on a substrate, and curing the curable composition to give a conductive layer on the substrate, thereby forming the composite article.

CURABLE SILICONE-ACRYLATE COMPOSITIONS, CONDUCTIVE MATERIALS PREPARED THEREWITH, AND RELATED METHODS

A curable composition is disclosed. The curable composition comprises (I) an epoxide-functional silicone-acrylate polymer, (II) an aminosiloxane, and (III) a conductive filler. The epoxide-functional silicone-acrylate polymer comprises acrylate-derived monomeric units comprising siloxane moieties, epoxide-functional moieties, and optionally, hydrocarbyl moieties, and the aminosiloxane comprises an average of at least two amine functional groups per molecule. Methods of preparing the curable composition, and a cured product thereof, are also disclosed. A method of forming a composite article comprising a conductive layer with the curable composition is disclosed is also disclosed. The method comprises disposing the curable composition on a substrate, and curing the curable composition to give a conductive layer on the substrate, thereby forming the composite article.

AQUEOUS DISPERSION OF POLYMER PARTICLES AND USES THEREOF AS AN ADHESIVE COMPOSITION
20220332866 · 2022-10-20 ·

The present invention relates to an aqueous dispersion of polymer particles and its preparation process, to an adhesive composition comprising the aqueous dispersion and to the use of the adhesive composition for adhering a label on a bottle.

AQUEOUS DISPERSION OF POLYMER PARTICLES AND USES THEREOF AS AN ADHESIVE COMPOSITION
20220332866 · 2022-10-20 ·

The present invention relates to an aqueous dispersion of polymer particles and its preparation process, to an adhesive composition comprising the aqueous dispersion and to the use of the adhesive composition for adhering a label on a bottle.

Adhesive composition

The present invention provides an adhesive composition that exhibits excellent adhesive force, and can be easily separated by photocuring during a peeling step, in which foaming and lifting are not generated even after a high temperature process.

Adhesive composition

The present invention provides an adhesive composition that exhibits excellent adhesive force, and can be easily separated by photocuring during a peeling step, in which foaming and lifting are not generated even after a high temperature process.

High temperature debondable adhesive

A debondable adhesive composition comprising (A) the hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H hydrogens, (B) a cross-linker for the hydrosilation reaction product, and (C) a metal catalyst and/or a radical initiator is provided.

High temperature debondable adhesive

A debondable adhesive composition comprising (A) the hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H hydrogens, (B) a cross-linker for the hydrosilation reaction product, and (C) a metal catalyst and/or a radical initiator is provided.

Polymer having reactive silicon-containing group and production method therefor

This polymer having a reactive silicon-containing group is represented by structural formula (1), and has good reactivity while having a monoalkoxysilyl group. ##STR00001##
(In the formula, X represents a monovalent to trivalent organic group including a main chain backbone including a predetermined polymer such as a polyurethane, a poly(meth)acrylate, or a polysiloxane, R.sup.1 and R.sup.2 each independently represent an alkyl group or the like having 1-10 carbon atoms, Y represents O, S, or the like, A.sup.1 and A.sup.2 each represent a single bond, or a divalent linking group such as a divalent hydrocarbon group having 1-20 carbon atoms, and n represents a number of 1-3.)