Provided is an epoxy resin composition having excellent adhesion and low dielectric characteristics. Specifically, provided is an epoxy resin composition comprising an acid-modified polyolefin resin and an epoxy resin having a specific structure.

In order to be able to set the bending stiffness of a composite material having at least two plies connected by a laminating agent, it is provided that a mixture of a first, curing adhesive and a second, non-curing adhesive is used as laminating agent, wherein the bending stiffness of the composite material is set by the mixing ratio of the two adhesives.

The present invention provides a hot melt adhesive which is excellent in environmental friendliness, thermal stability, adhesion to a polyolefin substrate and a polyester substrate, and heat resistance. The present invention relates to a hot melt adhesive comprising (A) a polar functional group-modified conjugated diene-based polymer, (B) an aliphatic polyester-based resin, (C) an amorphous olefin-based polymer, (D) a crystalline polypropylene resin, and (E) a tackifier resin.

The present invention provides a hot melt adhesive which is excellent in environmental friendliness, thermal stability, adhesion to a polyolefin substrate and a polyester substrate, and heat resistance. The present invention relates to a hot melt adhesive comprising (A) a polar functional group-modified conjugated diene-based polymer, (B) an aliphatic polyester-based resin, (C) an amorphous olefin-based polymer, (D) a crystalline polypropylene resin, and (E) a tackifier resin.

The aim of the invention is to effectively protect a flat adhesive compound from permeates originating from the surroundings as well as from permeates trapped during lamination, winding, stacking or other processing steps. For this purpose, the adhesive tape comprises at least the following layers in the indicated order: a first outer adhesive compound layer A, a layer B, which contains at least one inorganic getter material, and a second outer adhesive compound layer C. The invention also relates to the use of said adhesive tape as an encapsulation material.

A block copolymer, a method for preparing a block copolymer, a resin composition, and a film are provided. The block copolymer can be useful in inhibiting complete separation of the hard segment even under a severe high-temperature condition by increasing the chemical cross-linking density around the hard segment without causing an increase in glass transition temperature of the hard segment, thereby maintaining high-temperature durability.

Methods of forming acrylate polymers using emulsion polymerization techniques are described. The resulting acrylate polymers exhibit characteristics enabling their use in adhesives and replacing acrylic polymers formed by solvent-based polymerization methods. Various polymers and adhesives utilizing such polymers are also described.

An easily dismantlable adhesive composition containing: an acrylic block polymer having a poly(meth)acrylate chain (A) formed of a carboxyl precursor group-containing (meth)acrylate monomer (a) and a poly(meth)acrylate chain (B) that contains, as monomer components, a (meth)acrylate (b) having an alkyl group having 1 to 14 carbon atoms and a polar group-containing monomer (c); and either an acid catalyst or an acid generator, makes it possible to achieve favorable adhesiveness and dismantlability and suppress stick-slip at the time of dismantlement.

Methods of forming acrylate polymers using emulsion polymerization techniques are described. The resulting acrylate polymers exhibit characteristics enabling their use in adhesives and replacing acrylic polymers formed by solvent-based polymerization methods. Various polymers and adhesives utilizing such polymers are also described.

Polymers having ordered architectures and one or more reactive functional groups incorporated in select blocks or regions of the polymer in particular proportions relative to other regions in the polymer, are described. The polymers are well suited for use in adhesive compositions, and particularly for pressure sensitive adhesive compositions. In addition, various methods for forming the noted polymers and adhesive compositions utilizing the ordered polymers are disclosed.