The present invention relates to a foamed pressure-sensitive adhesive compound on the basis of aromatic polyvinyl-polydiene block copolymers, in particular for double-sided self-adhesive strips, containing a) 39.8 wt. % to 51.8 wt. % of an elastomer component, b) 35.0 wt. % to 58.0 wt % of an adhesive resin component, c) 2.0 wt. % to 15.0 wt. % of a plasticizer component, d) 0.0 wt. % to 18.0 wt. % of further additives and e) microballoons, the microballoons being at least partly expanded.

The present invention relates to a foamed pressure-sensitive adhesive compound on the basis of aromatic polyvinyl-polydiene block copolymers, in particular for double-sided self-adhesive strips, containing a) 39.8 wt. % to 51.8 wt. % of an elastomer component, b) 35.0 wt. % to 58.0 wt % of an adhesive resin component, c) 2.0 wt. % to 15.0 wt. % of a plasticizer component, d) 0.0 wt. % to 18.0 wt. % of further additives and e) microballoons, the microballoons being at least partly expanded.

The HMPSA compositions of this invention include from 10% by weight to 35% by weight of a styrenic block copolymer, from 10% by weight to 60% by weight of a near white rosin ester tackifying agent having a neat Molten Garner Color of no greater than 2, and from 28% by weight to 45% by weight of a plasticizer. The HMPSA compositions are especially useful as positioning adhesives adhering well to both cotton and microfiber.

The HMPSA compositions of this invention include from 10% by weight to 35% by weight of a styrenic block copolymer, from 10% by weight to 60% by weight of a near white rosin ester tackifying agent having a neat Molten Garner Color of no greater than 2, and from 28% by weight to 45% by weight of a plasticizer. The HMPSA compositions are especially useful as positioning adhesives adhering well to both cotton and microfiber.

The HMPSA compositions of this invention include from 10% by weight to 35% by weight of a styrenic block copolymer, from 10% by weight to 60% by weight of a near white rosin ester tackifying agent having a neat Molten Garner Color of no greater than 2, and from 28% by weight to 45% by weight of a plasticizer. The HMPSA compositions are especially useful as positioning adhesives adhering well to both cotton and microfiber.

The invention relates to a foamed adhesive mass layer comprising a) 41.7 to 62.0 wt. % of an elastomer component, b) 37.7 to 58.0 wt. % of an adhesive resin component, c) 0 to 15 wt. % of a soft resin component, d) 0 to 18 wt. % further additives, and e) microballoons with a proportion of preferably 0.3 to 2.5 wt. %, preferably 0.5 to 2.0 wt. % and particularly preferably 0.7 to 1.7 wt. %, wherein the microballoons are at least partially expanded, wherein the elastomer component (a) consists of up to at least 90 wt. % polyvinyl aromatic compound polydine block copolymer, wherein the adhesive resin component (b) contains up to 4 to 100 wt. % of at least one type K1 if a rosin oligomer with a softening temperature (Ring & Ball, Test VI) of at least 90° C., and wherein the density (Text IX) of the foamed adhesive mass layer is at least 600 kg/m.sup.3 and max. 920 kg/m.sup.3.

The invention relates to a foamed adhesive mass layer comprising a) 41.7 to 62.0 wt. % of an elastomer component, b) 37.7 to 58.0 wt. % of an adhesive resin component, c) 0 to 15 wt. % of a soft resin component, d) 0 to 18 wt. % further additives, and e) microballoons with a proportion of preferably 0.3 to 2.5 wt. %, preferably 0.5 to 2.0 wt. % and particularly preferably 0.7 to 1.7 wt. %, wherein the microballoons are at least partially expanded, wherein the elastomer component (a) consists of up to at least 90 wt. % polyvinyl aromatic compound polydine block copolymer, wherein the adhesive resin component (b) contains up to 4 to 100 wt. % of at least one type K1 if a rosin oligomer with a softening temperature (Ring & Ball, Test VI) of at least 90° C., and wherein the density (Text IX) of the foamed adhesive mass layer is at least 600 kg/m.sup.3 and max. 920 kg/m.sup.3.

An adhesive tape with high repeelability from the state that a portion of the adhesive tape has already been peeled from an adherend is provided. The adhesive tape includes a substrate layer and an adhesive layer. The substrate layer has a breaking stress in a range of 1 to 90 MPa and an elongation at break in a range of 400% to 3000%. The adhesive tape satisfies the following relational expression (i): [Math. 1] P.sub.400/P.sub.0≤0.9 (i). P.sub.0 denotes an initial cleavage strength N/cm.sup.2 of the adhesive tape, and P.sub.400 denotes a cleavage strength N/cm.sup.2 when the adhesive tape is stretched by 400%.

An adhesive tape with high repeelability from the state that a portion of the adhesive tape has already been peeled from an adherend is provided. The adhesive tape includes a substrate layer and an adhesive layer. The substrate layer has a breaking stress in a range of 1 to 90 MPa and an elongation at break in a range of 400% to 3000%. The adhesive tape satisfies the following relational expression (i): [Math. 1] P.sub.400/P.sub.0≤0.9 (i). P.sub.0 denotes an initial cleavage strength N/cm.sup.2 of the adhesive tape, and P.sub.400 denotes a cleavage strength N/cm.sup.2 when the adhesive tape is stretched by 400%.

A protective film 10 of the present invention includes a base material layer and a pressure sensitive adhesive layer, and is used by being attached to a resin substrate 21 at the time of performing heat bending on the resin substrate 21. The pressure sensitive adhesive layer contains a polyolefin having a melting point of lower than 125° C. The base material layer has a first layer which contains a polyolefin having a melting point of 150° C. or higher, and a second layer which contains an adhesive resin. In a case of heating the protective film 100 having such a configuration, in a state of being interposed between two attaching substrates which are formed of polycarbonate, at 145° C. for 30 minutes, peeling off one attaching substrate on the side of the pressure sensitive adhesive layer at 25° C., and then viewing a surface of the one attaching substrate in a plan view, a residual ratio of an area where the pressure sensitive adhesive layer remains is 5% or less.