The invention relates to thermoplastic moulding materials comprising styrene block copolymers and propylene-based copolymers, wherein the SBC polymers comprise a styrene content of 5 to 40% by weight and the backbone of the propylene copolymers has a weight-average molecular weight M.sub.w<10 000 g/mol. The thermoplastic moulding materials are suitable for affixing granules due to their melt viscosity and their mechanical properties.

The present invention aims to provide an adhesive sheet excellent in both shear strength and slurry resistance at high temperature and excellent in removability that enables removal without adhesive residue. The present invention also aims to provide a polishing pad with an adhesive sheet including the adhesive sheet. Provided is an adhesive sheet including at least one adhesive layer, the adhesive layer containing a base polymer, a tackifier resin (T1) having a hydroxy value of less than 20 mgKOH/g, and a tackifier resin (T2) having a hydroxy value of 20 mgKOH/g or more and 120 mgKOH/g or less, the base polymer being a block copolymer of a monovinyl-substituted aromatic compound and a conjugated diene compound, and the adhesive layer containing the tackifier resin (T1) in an amount of 10 parts by weight or more and 60 parts by weight or less relative to 100 parts by weight of the base polymer, and the tackifier resin (T2) in an amount of 1 part by weight or more and 40 parts by weight or less relative to 100 parts by weight of the base polymer.

The invention relates to a hot-melt pressure sensitive adhesive composition comprising at least one styrenic block copolymer, at least one tackifying resin, at least one mineral oil and from 4 to 15% by weight of at least one wax selected from the group consisting of paraffin waxes, Fischer-Tropsch waxes, ethylene-vinyl acetate waxes and any mixture thereof, based on the total weight of the hot-melt pressure sensitive adhesive composition. The invention also relates to an article comprising a surface coated with such a hot-melt pressure sensitive adhesive composition, to a use of such a hot-melt pressure sensitive adhesive composition and to a process for preparing such a hot-melt pressure sensitive adhesive composition.

The invention relates to a hot-melt pressure sensitive adhesive composition comprising at least one styrenic block copolymer, at least one tackifying resin, at least one mineral oil and from 4 to 15% by weight of at least one wax selected from the group consisting of paraffin waxes, Fischer-Tropsch waxes, ethylene-vinyl acetate waxes and any mixture thereof, based on the total weight of the hot-melt pressure sensitive adhesive composition. The invention also relates to an article comprising a surface coated with such a hot-melt pressure sensitive adhesive composition, to a use of such a hot-melt pressure sensitive adhesive composition and to a process for preparing such a hot-melt pressure sensitive adhesive composition.

This invention relates to a hot melt adhesive composition. The hot melt adhesive composition according to the present invention comprises at least one hydrogenated thermoplastic block copolymer with a melt index greater than or equal to 30 grams per 10 minutes at 190° C./2.16 kg; and at least one polyolefin with a melt viscosity less than or equal to 2000 cPs at 190° C. The hot melt adhesive composition according to the present invention can be applied at low temperature, has excellent T peel strength and low odor after being applied in the disposable products.

A tackifier composition comprising at least one thermoplastic hydrocarbon resin and an antioxidant composition is provided; wherein a portion of the volatile organic compounds in the thermoplastic hydrocarbon resin has been removed; wherein the antioxidant composition comprises at least one primary antioxidant and at least one secondary antioxidant; and wherein the levels of individual volatile organic compound monitored in the tackifier composition are less than about 0.5 ppm as measured by GC/MS headspace analysis. Processes for producing the tackifier composition are also provided as well as adhesives comprising the tackifier compositions.

A tackifier composition comprising at least one thermoplastic hydrocarbon resin and an antioxidant composition is provided; wherein a portion of the volatile organic compounds in the thermoplastic hydrocarbon resin has been removed; wherein the antioxidant composition comprises at least one primary antioxidant and at least one secondary antioxidant; and wherein the levels of individual volatile organic compound monitored in the tackifier composition are less than about 0.5 ppm as measured by GC/MS headspace analysis. Processes for producing the tackifier composition are also provided as well as adhesives comprising the tackifier compositions.

A block-copolymer pellet having 100 parts by weight of a pellet-shaped article of a block copolymer (A) and 0.01 to 5 parts by weight of a hydrocarbon-based dusting agent (B) is provided, wherein the block copolymer (A) has at least one aromatic vinyl polymer block and at least one conjugated diene polymer block, the hydrocarbon-based dusting agent (B) has a BET specific surface area of 0.50 to 3.00 m.sup.2/g, a volume average particle size of 2.0 to 20 μm, a bulk density of 0.10 to 0.34 g/cm.sup.3, and a melting point of 75° C. or higher, and the block-copolymer pellet has a Shore A hardness of 10 to 80, and a BET specific surface area of 0.001 to 0.05 m.sup.2/g measured by a Kr adsorption method.

A high-frequency dielectric heating adhesive contains a thermoplastic resin, in which the thermoplastic resin contains a styrene copolymer resin, an amount of the styrene copolymer resin contained in the thermoplastic resin is 40% or more by volume and 100% or less by volume, the styrene copolymer resin has a styrene monomer unit content of 10% or more by mass and 90% or less by mass, the high-frequency dielectric heating adhesive has a tensile modulus of 20 MPa or more, and the high-frequency dielectric heating adhesive has a dielectric property (tan δ/ε'r) of 0.005 or more, where tan δ is a dielectric loss tangent at 23° C. and a frequency of 40.68 MHz, and ε'r is a relative dielectric constant at 23° C. and a frequency of 40.68 MHz.

A high-frequency dielectric heating adhesive contains a thermoplastic resin, in which the thermoplastic resin contains a styrene copolymer resin, an amount of the styrene copolymer resin contained in the thermoplastic resin is 40% or more by volume and 100% or less by volume, the styrene copolymer resin has a styrene monomer unit content of 10% or more by mass and 90% or less by mass, the high-frequency dielectric heating adhesive has a tensile modulus of 20 MPa or more, and the high-frequency dielectric heating adhesive has a dielectric property (tan δ/ε'r) of 0.005 or more, where tan δ is a dielectric loss tangent at 23° C. and a frequency of 40.68 MHz, and ε'r is a relative dielectric constant at 23° C. and a frequency of 40.68 MHz.