Patent classifications
C09J161/34
Benzoxazine low temperature curable composition
The present disclosure provides an organic sulfur acid-free composition containing a benzoxazine, phenolic compound and nitrogen-containing heterocyclic compound. The organic sulfur acid-free composition, upon curing at temperatures as low as 130-140 C., renders void free cured articles having well balanced thermal, chemical and mechanical properties. The organic sulfur acid-free composition may be used in a variety of applications, such as in coatings, structural and non-structural composites and encapsulating systems for electronic and electrical components.
Workpiece treating method, temporary fixing composition, semiconductor device, and process for manufacturing the same
In a method in which a workpiece, while being temporarily fixed on a support via a temporary fixing material, is processed and/or transported and thereafter the support and the workpiece are separated from each other by an irradiation separation method, a technique is shown which prevents the photo-degradation of the workpiece. A workpiece treating method includes a step of forming a stack including a support, a temporary fixing material and a workpiece wherein the temporary fixing material includes a layer (I) that contains a polymer (A) including a structural unit (A1); a step of processing the workpiece and/or transporting the stack; a step of applying light to the layer (I) through the support; and a step of separating the support and the workpiece from each other. ##STR00001##
Workpiece treating method, temporary fixing composition, semiconductor device, and process for manufacturing the same
In a method in which a workpiece, while being temporarily fixed on a support via a temporary fixing material, is processed and/or transported and thereafter the support and the workpiece are separated from each other by an irradiation separation method, a technique is shown which prevents the photo-degradation of the workpiece. A workpiece treating method includes a step of forming a stack including a support, a temporary fixing material and a workpiece wherein the temporary fixing material includes a layer (I) that contains a polymer (A) including a structural unit (A1); a step of processing the workpiece and/or transporting the stack; a step of applying light to the layer (I) through the support; and a step of separating the support and the workpiece from each other. ##STR00001##
COMPOSITE PRODUCTS
A method of manufacturing a composite product, comprising: applying a binder composition, notably in the form of an aqueous solution, to non or loosely assembled matter to provide resinated matter, wherein the binder composition consists of a binder composition prepared by combining reactants comprising at least 50% by dry weight reducing sugar reactant(s) and at least 5% by dry weight nitrogen-containing reactant(s); and arranging the resinated matter to provide loosely arranged resinated matter; and subjecting the loosely arranged resinated matter to heat and/or pressure to cure the binder composition and to form the composite product; wherein the nitrogen-containing reactant(s) comprise TPTA triprimary triamine(s), notably wherein the nitrogen-containing reactant(s) comprise at least 5% by dry weight of TPTA triprimary triamine(s).
COMPOSITE PRODUCTS
A method of manufacturing a composite product, comprising: applying a binder composition, notably in the form of an aqueous solution, to non or loosely assembled matter to provide resinated matter, wherein the binder composition consists of a binder composition prepared by combining reactants comprising at least 50% by dry weight reducing sugar reactant(s) and at least 5% by dry weight nitrogen-containing reactant(s); and arranging the resinated matter to provide loosely arranged resinated matter; and subjecting the loosely arranged resinated matter to heat and/or pressure to cure the binder composition and to form the composite product; wherein the nitrogen-containing reactant(s) comprise TPTA triprimary triamine(s), notably wherein the nitrogen-containing reactant(s) comprise at least 5% by dry weight of TPTA triprimary triamine(s).
ADHESIVE COMPOSITION, LAMINATE, METHOD OF MANUFACTURING LAMINATE, AND METHOD OF MANUFACTURING PROCESSED SUBSTRATE
An adhesive composition, wherein the adhesive composition is applied to obtain an adhesive coating layer having a complex viscosity of 10 Pa.Math.s or more and 10,000 Pa.Math.s or less at 25? C. or more and 100? C. or less, and the adhesive coating layer has a viscosity reduction rate of 80% or less determined by the following formula (1):
Viscosity reduction rate (%)=((V.sub.25?V.sub.100)/V.sub.25)?100Formula (1) wherein V.sub.25: Complex viscosity at 25? C., and V.sub.100: Complex viscosity at 100? C.
ADHESIVE COMPOSITION, LAMINATE, METHOD OF MANUFACTURING LAMINATE, AND METHOD OF MANUFACTURING PROCESSED SUBSTRATE
An adhesive composition, wherein the adhesive composition is applied to obtain an adhesive coating layer having a complex viscosity of 10 Pa.Math.s or more and 10,000 Pa.Math.s or less at 25? C. or more and 100? C. or less, and the adhesive coating layer has a viscosity reduction rate of 80% or less determined by the following formula (1):
Viscosity reduction rate (%)=((V.sub.25?V.sub.100)/V.sub.25)?100Formula (1) wherein V.sub.25: Complex viscosity at 25? C., and V.sub.100: Complex viscosity at 100? C.
WORKPIECE TREATING METHOD, TEMPORARY FIXING COMPOSITION, SEMICONDUCTOR DEVICE, AND PROCESS FOR MANUFACTURING THE SAME
In a method in which a workpiece, while being temporarily fixed on a support via a temporary fixing material, is processed and/or transported and thereafter the support and the workpiece are separated from each other by an irradiation separation method, a technique is shown which prevents the photo-degradation of the workpiece.
A workpiece treating method includes a step of forming a stack including a support, a temporary fixing material and a workpiece wherein the temporary fixing material includes a layer (I) that contains a polymer (A) including a structural unit (A1); a step of processing the workpiece and/or transporting the stack; a step of applying light to the layer (I) through the support; and a step of separating the support and the workpiece from each other.
##STR00001##
WORKPIECE TREATING METHOD, TEMPORARY FIXING COMPOSITION, SEMICONDUCTOR DEVICE, AND PROCESS FOR MANUFACTURING THE SAME
In a method in which a workpiece, while being temporarily fixed on a support via a temporary fixing material, is processed and/or transported and thereafter the support and the workpiece are separated from each other by an irradiation separation method, a technique is shown which prevents the photo-degradation of the workpiece.
A workpiece treating method includes a step of forming a stack including a support, a temporary fixing material and a workpiece wherein the temporary fixing material includes a layer (I) that contains a polymer (A) including a structural unit (A1); a step of processing the workpiece and/or transporting the stack; a step of applying light to the layer (I) through the support; and a step of separating the support and the workpiece from each other.
##STR00001##
Cyanic acid ester compound and method for producing same, resin composition, and cured product
The present invention provides a cyanic acid ester compound having a structure represented by the following general formula (1): ##STR00001##
wherein n represents an integer of 1 or larger.