Patent classifications
C09J163/04
Adhesive for endoscope, cured product, endoscope, and method for producing endoscope
Provided are an adhesive for an endoscope, a cured product thereof, an endoscope produced using the adhesive for an endoscope, and a method for producing the endoscope. The adhesive for an endoscope is a two-component adhesive for an endoscope. The two-component adhesive has a base and a curing agent. The base includes at least one epoxy resin (A) selected from the group consisting of bisphenol A epoxy resins, bisphenol F epoxy resins, and phenol novolac epoxy resins. The curing agent includes at least one specific polyamine compound (B). The adhesive for an endoscope is used to fix at least one of a metal member or a glass member constituting the endoscope.
ADHESIVE COMPOSITION
Provided is an adhesive composition that is capable of forming an adhesive layer having excellent electrical properties (low relative permittivity and low dielectric loss tangent) and excellent adhesiveness (adhesion properties) after heat curing, can improve adhesiveness (adhesion properties) in a laminating step, can prevent the peeling and lifting of layers during temporary fixing and roll-to-roll work, also has a high crosslink density, and does not cause heat resistance, solvent resistance and the like to deteriorate. The adhesive composition contains a bismaleimide resin and a styrene-based elastomer.
ADHESIVE COMPOSITION
Provided is an adhesive composition that is capable of forming an adhesive layer having excellent electrical properties (low relative permittivity and low dielectric loss tangent) and excellent adhesiveness (adhesion properties) after heat curing, can improve adhesiveness (adhesion properties) in a laminating step, can prevent the peeling and lifting of layers during temporary fixing and roll-to-roll work, also has a high crosslink density, and does not cause heat resistance, solvent resistance and the like to deteriorate. The adhesive composition contains a bismaleimide resin and a styrene-based elastomer.
LATENT EPOXY-AMINE COMPOSITION FOR CIPP APPLICATION
A two-component epoxy resin composition, made of: a resin component including: at least one epoxy resin that contains on average more than one epoxy group per molecule; up to 25 wt.-% of at least one epoxy-functional reactive diluent having one or two epoxy groups per molecule; and a hardener component including: between 40 and 80 wt.-% of at least one amino-functional hardener of formula (I),
##STR00001##
wherein n is an integer with a value of 2 or 3, R.sup.1 is a linear, cyclic or branched alkyl residue that optionally contains ether oxygen atoms and R.sup.2 is a methyl or ethyl group; between 10 and 30 wt.-% of at least one Lewis base having at least one tertiary amino group, amidine group, or guanidine group; and between 10 and 30 wt.-% of at least one carboxylic acid.
LATENT EPOXY-AMINE COMPOSITION FOR CIPP APPLICATION
A two-component epoxy resin composition, made of: a resin component including: at least one epoxy resin that contains on average more than one epoxy group per molecule; up to 25 wt.-% of at least one epoxy-functional reactive diluent having one or two epoxy groups per molecule; and a hardener component including: between 40 and 80 wt.-% of at least one amino-functional hardener of formula (I),
##STR00001##
wherein n is an integer with a value of 2 or 3, R.sup.1 is a linear, cyclic or branched alkyl residue that optionally contains ether oxygen atoms and R.sup.2 is a methyl or ethyl group; between 10 and 30 wt.-% of at least one Lewis base having at least one tertiary amino group, amidine group, or guanidine group; and between 10 and 30 wt.-% of at least one carboxylic acid.
Adhesive composition, and coverlay film, bonding sheet, copper-clad laminate and electromagnetic shielding material, each using said adhesive composition
An adhesive composition containing (A) a modified polyolefin resin and (B) an epoxy compound, wherein the modified polyolefin resin (A) is a polyolefin resin graft modified with a modifying agent that contains an α,β-unsaturated carboxylic acid or a derivative thereof. The content of the epoxy compound (B) is 1-20 parts by mass relative to 100 parts by mass of the modified polyolefin resin (A); and the epoxy compound is composed of two or more types of epoxy compounds.
Adhesive composition, and coverlay film, bonding sheet, copper-clad laminate and electromagnetic shielding material, each using said adhesive composition
An adhesive composition containing (A) a modified polyolefin resin and (B) an epoxy compound, wherein the modified polyolefin resin (A) is a polyolefin resin graft modified with a modifying agent that contains an α,β-unsaturated carboxylic acid or a derivative thereof. The content of the epoxy compound (B) is 1-20 parts by mass relative to 100 parts by mass of the modified polyolefin resin (A); and the epoxy compound is composed of two or more types of epoxy compounds.
ADHESIVE FOR ENDOSCOPE, CURED PRODUCT THEREOF, ENDOSCOPE, AND METHOD FOR PRODUCING THE SAME
An adhesive for an endoscope, the adhesive including (A) an epoxy resin including at least one epoxy resin of a bisphenol A epoxy resin, a bisphenol F epoxy resin, or a phenol novolac epoxy resin, (B) a curing component including at least one of a phosphorus-containing compound, a polythiol compound, a dicyandiamide compound, a phenol compound, or a polyether-polyamine compound, and (C) an inorganic amphoteric ion exchanger; and a cured product of the adhesive. An endoscope including the cured product fixed, and a method for producing the endoscope.
ADHESIVE FOR ENDOSCOPE, CURED PRODUCT THEREOF, ENDOSCOPE, AND METHOD FOR PRODUCING THE SAME
An adhesive for an endoscope, the adhesive including (A) an epoxy resin including at least one epoxy resin of a bisphenol A epoxy resin, a bisphenol F epoxy resin, or a phenol novolac epoxy resin, (B) a curing component including at least one of a phosphorus-containing compound, a polythiol compound, a dicyandiamide compound, a phenol compound, or a polyether-polyamine compound, and (C) an inorganic amphoteric ion exchanger; and a cured product of the adhesive. An endoscope including the cured product fixed, and a method for producing the endoscope.
ADHESIVE FOR ENDOSCOPE AND CURED PRODUCT THEREOF, AND ENDOSCOPE AND METHOD FOR PRODUCING THE SAME
An object of the present invention to provide an adhesive for an endoscope and a cured product of the adhesive, and an endoscope and a method for producing the endoscope. The adhesive is able to maintain sufficient adhesive strength even when exposed to high temperature for a long time in a state of being used for fixation of a member or subjected to powerful sterilization treatment with ozone water or the like and is suitable for use in fixing a member constituting the endoscope. The adhesive for an endoscope includes an epoxy resin, an epoxy resin curing component, and a radical scavenger.