A method for manufacturing a semiconductor device and an underfill film which can achieve voidless mounting and excellent solder bonding properties even in the case of collectively bonding a plurality of semiconductor chips are provided. The method includes a mounting step of mounting a plurality of semiconductor chips having a solder-tipped electrode onto an electronic component having a counter electrode opposing the solder-tipped electrode via an underfill film; and a compression bonding step of collectively bonding the plurality of semiconductor chips to the electronic component via the underfill film. The underfill film contains an epoxy resin, an acid anhydride, an acrylic resin, and an organic peroxide and has a minimum melt viscosity of 1,000 to 2,000 Pa*s and a melt viscosity gradient of 900 to 3,100 Pa*s/ C. from a temperature 10 C. higher than a minimum melt viscosity attainment temperature to a temperature 10 C. higher than the temperature.

A reinforcing sheet including one or more layers of a reinforcing material, and a thermosetting adhesive associated with the reinforcing material, wherein the thermosetting adhesive includes a curing agent, and an epoxy-modified dimerized fatty acid combined with an epoxy terminated polyurethane interpenetrating network.

A reinforcing sheet including one or more layers of a reinforcing material, and a thermosetting adhesive associated with the reinforcing material, wherein the thermosetting adhesive includes a curing agent, and an epoxy-modified dimerized fatty acid combined with an epoxy terminated polyurethane interpenetrating network.

There is provided a photocurable and thermosetting resin composition which suppresses decrease of adhesive strength in a moisture resistance test of the cured resin composition, and has a sufficiently long pot life. The resin composition includes (A) an acrylic resin, (B) a multifunctional nitrogen-containing heterocyclic compound represented by a specific chemical formula, (C) a latent curing agent, (D) a radical polymerization inhibitor, and (E) an anionic polymerization retarder. The resin composition preferably further includes (F) a compound having a glycidyl group, other than the acrylic resin.

There is provided a photocurable and thermosetting resin composition which suppresses decrease of adhesive strength in a moisture resistance test of the cured resin composition, and has a sufficiently long pot life. The resin composition includes (A) an acrylic resin, (B) a multifunctional nitrogen-containing heterocyclic compound represented by a specific chemical formula, (C) a latent curing agent, (D) a radical polymerization inhibitor, and (E) an anionic polymerization retarder. The resin composition preferably further includes (F) a compound having a glycidyl group, other than the acrylic resin.

With respect to a laminate of a film formed of a thermoplastic resin or thermoplastic elastomer composition and a layer formed of a rubber composition in which an epoxidized natural rubber is blended, the adhesion between the film and the layer of the rubber composition is improved without using a large amount of the epoxidized natural rubber. A laminate of a film formed of a thermoplastic resin or thermoplastic elastomer composition and a layer formed of a rubber composition, said laminate being characterized in that: 5-60% by mass of a rubber component contained in the rubber composition is composed of an epoxidized natural rubber and 20-50% by mass of the rubber component is composed of a butadiene rubber; and the rubber composition contains an unsubstituted or substituted aromatic carboxylic acid having a pKa of 1.5-4.0 in an amount of 0.5-5 parts by mass per 100 parts by mass of the rubber component.

With respect to a laminate of a film formed of a thermoplastic resin or thermoplastic elastomer composition and a layer formed of a rubber composition in which an epoxidized natural rubber is blended, the adhesion between the film and the layer of the rubber composition is improved without using a large amount of the epoxidized natural rubber. A laminate of a film formed of a thermoplastic resin or thermoplastic elastomer composition and a layer formed of a rubber composition, said laminate being characterized in that: 5-60% by mass of a rubber component contained in the rubber composition is composed of an epoxidized natural rubber and 20-50% by mass of the rubber component is composed of a butadiene rubber; and the rubber composition contains an unsubstituted or substituted aromatic carboxylic acid having a pKa of 1.5-4.0 in an amount of 0.5-5 parts by mass per 100 parts by mass of the rubber component.

An adhesive composition containing: an epoxy resin (A) having a fused ring structure; an epoxy resin curing agent (B); a polyrotaxane compound (C); and a polymer component (D), wherein the polyrotaxane compound (C) is contained in a content of 5 to 15 parts by mass based on total 100 parts by mass of contents of the epoxy resin (A) and the polymer component (D); a film adhesive using the adhesive composition; and a semiconductor package and a producing method thereof.

An adhesive composition containing: an epoxy resin (A) having a fused ring structure; an epoxy resin curing agent (B); a polyrotaxane compound (C); and a polymer component (D), wherein the polyrotaxane compound (C) is contained in a content of 5 to 15 parts by mass based on total 100 parts by mass of contents of the epoxy resin (A) and the polymer component (D); a film adhesive using the adhesive composition; and a semiconductor package and a producing method thereof.

Embodiments of this invention are directed to bio-based epoxy compositions. and method of their preparation and use. Other embodiments are directed to cured bio-based epoxies, and manufactured articles having bio-based epoxy coatings, adhesives. or composites.