A modified epoxy acrylic resin conductive adhesive is disclosed, based on 100 parts by total mass, including the following components: 49-75 parts of conductive particles, 24-45 parts of modified epoxy propylene resin, 0.5-2.5 parts of silane coupling agent, and 0.5-3.0 parts of initiator. The conductive particles include at least 5% conductive particles with a three-dimensional dendritic microstructure among all the conductive particles. A preparation method and application of the modified epoxy acrylic resin conductive adhesive are disclosed. The modified epoxy acrylic resin conductive adhesive of the present disclosure has advantages in good electrical conductivity, short curing time, strong adhesion, and capability being used for a long-time room temperature operation.

A modified epoxy acrylic resin conductive adhesive is disclosed, based on 100 parts by total mass, including the following components: 49-75 parts of conductive particles, 24-45 parts of modified epoxy propylene resin, 0.5-2.5 parts of silane coupling agent, and 0.5-3.0 parts of initiator. The conductive particles include at least 5% conductive particles with a three-dimensional dendritic microstructure among all the conductive particles. A preparation method and application of the modified epoxy acrylic resin conductive adhesive are disclosed. The modified epoxy acrylic resin conductive adhesive of the present disclosure has advantages in good electrical conductivity, short curing time, strong adhesion, and capability being used for a long-time room temperature operation.

A modified epoxy acrylic resin conductive adhesive is disclosed, based on 100 parts by total mass, including the following components: 49-75 parts of conductive particles, 24-45 parts of modified epoxy propylene resin, 0.5-2.5 parts of silane coupling agent, and 0.5-3.0 parts of initiator. The conductive particles include at least 5% conductive particles with a three-dimensional dendritic microstructure among all the conductive particles. A preparation method and application of the modified epoxy acrylic resin conductive adhesive are disclosed. The modified epoxy acrylic resin conductive adhesive of the present disclosure has advantages in good electrical conductivity, short curing time, strong adhesion, and capability being used for a long-time room temperature operation.

An adhesive composition may include, but is not limited to: at least one of an alkyl acrylate monomer and a methacrylate monomer; and at least one of a polyester alkyd polymer and a vinyl ester alkyd polymer.

An adhesive composition may include, but is not limited to: at least one of an alkyl acrylate monomer and a methacrylate monomer; and at least one of a polyester alkyd polymer and a vinyl ester alkyd polymer.

The present application is directed at the reaction product of an azide compound having two or more azide groups attached thereto and an alkyne compound having two or more alkyne groups attached thereto, wherein the azide and alkyne groups react in a 1,3-dipolar cyclo addition to form 1,4-disubstituted triazols and wherein the azide or alkyne compound or both include —O—(C═O)—NR— functional groups. The reaction products can be used as coatings, such as for flat roofs, sealants, adhesives and in elastomer applications. Methods for producing the reaction products as well as substrates including a coating of the reaction product are also disclosed.

The present application is directed at the reaction product of an azide compound having two or more azide groups attached thereto and an alkyne compound having two or more alkyne groups attached thereto, wherein the azide and alkyne groups react in a 1,3-dipolar cyclo addition to form 1,4-disubstituted triazols and wherein the azide or alkyne compound or both include —O—(C═O)—NR— functional groups. The reaction products can be used as coatings, such as for flat roofs, sealants, adhesives and in elastomer applications. Methods for producing the reaction products as well as substrates including a coating of the reaction product are also disclosed.

Curable polymeric compositions with improved barrier property to oxygen suitable to be used on flexible substrates containing a bisphenol F epoxy resin, at least an epoxy acrylate component and at least a rubber modified bisphenol and further comprising EVOH capsules or beads dispersed therein. The polymeric compositions are applicable either by a melt or liquid coating technique and undergo curing upon exposure to heat, showing viscoelastic properties and suitable to provide a cured product having high durability.

Curable polymeric compositions with improved barrier property to oxygen suitable to be used on flexible substrates containing a bisphenol F epoxy resin, at least an epoxy acrylate component and at least a rubber modified bisphenol and further comprising EVOH capsules or beads dispersed therein. The polymeric compositions are applicable either by a melt or liquid coating technique and undergo curing upon exposure to heat, showing viscoelastic properties and suitable to provide a cured product having high durability.

A conductive adhesive is provided useful for providing electrically conductive joints in joins between panels, particularly conductive carbon composite panels in a WESP, is prepared from a corrosion resistant resin and particulate carbon black which is uniformly dispersed in the resin.