Curable polymeric compositions with improved barrier property to oxygen suitable to be used on flexible substrates containing a bisphenol F epoxy resin, at least an epoxy acrylate component and at least a rubber modified bisphenol and further comprising EVOH capsules or beads dispersed therein. The polymeric compositions are applicable either by a melt or liquid coating technique and undergo curing upon exposure to heat, showing viscoelastic properties and suitable to provide a cured product having high durability.

The disclosure discloses a sealant and a method for fabricating the same, and a display device. The sealant includes a thermal-curing agent and an epoxy resin, wherein the thermal-curing agent includes a diphenyl ketone alcohol compound capable of emitting a fluorescent light and a phosphorescent light simultaneously.

The disclosure discloses a sealant and a method for fabricating the same, and a display device. The sealant includes a thermal-curing agent and an epoxy resin, wherein the thermal-curing agent includes a diphenyl ketone alcohol compound capable of emitting a fluorescent light and a phosphorescent light simultaneously.

An object of the present invention is to provide a radical-polymerizable adhesive composition for laminating and bonding steel plates, capable of obtaining an adhesive laminate that contributes to simplification of a process in an adhesive lamination method, and high performance and high reliability of a rotor or a stator of a motor.

A radical-polymerizable adhesive composition for laminating and bonding steel plates, exhibiting a value of 8.0 MPa or more in a tensile shear adhesive strength test to an electromagnetic steel plate, and containing: component (A): a radical-polymerizable compound; component (B): a radical-polymerization initiator; and component (C): a phosphate compound having a group represented by the following general formula (1) or (2).

An object of the present invention is to provide a radical-polymerizable adhesive composition for laminating and bonding steel plates, capable of obtaining an adhesive laminate that contributes to simplification of a process in an adhesive lamination method, and high performance and high reliability of a rotor or a stator of a motor.

A radical-polymerizable adhesive composition for laminating and bonding steel plates, exhibiting a value of 8.0 MPa or more in a tensile shear adhesive strength test to an electromagnetic steel plate, and containing: component (A): a radical-polymerizable compound; component (B): a radical-polymerization initiator; and component (C): a phosphate compound having a group represented by the following general formula (1) or (2).

This invention relates to a two-part epoxy based composition, comprising a first part comprising at least one epoxy resin; a second part comprising at least one epoxy resin curing agent, and at least one acrylamide compound containing a hydrogen atom bound to the nitrogen atom in the acrylamide structure. The two-part epoxy based composition according to the present invention exhibits excellent adhesion strength to low surface tension substrates, such as stainless steel and PVC.

Adhesion-promoting compositions and the use of the adhesion-promoting compositions to provide adhesion-promoting interlayers to enhance adhesion between adjoining layers of sulfur-containing sealants are disclosed. In repair applications, the adhesion-promoting compositions can enhance the adhesion of an overlying radiation-curable sulfur-containing sealant to a damaged or aged sulfur-containing sealant.

The present invention relates to an adhesive film having a thixotropic index at 110° C. of 1.5 to 7.5, which is used for fixing a first semiconductor device and a second semiconductor device, a ratio of an area of said first semiconductor device to an area of said second semiconductor device being 0.65 or less, a method for preparing a semiconductor device using the adhesive film, and a semiconductor device.

The present invention relates to an adhesive film having a thixotropic index at 110° C. of 1.5 to 7.5, which is used for fixing a first semiconductor device and a second semiconductor device, a ratio of an area of said first semiconductor device to an area of said second semiconductor device being 0.65 or less, a method for preparing a semiconductor device using the adhesive film, and a semiconductor device.

Conventionally, when an adherend is nickel or the like, it has been difficult to realize an electroconductive adhesive that lowers connection resistance in various kinds of thermocurable curing resins. However, it is possible to provide an electroconductive adhesive, in the case where the adherend is nickel or the like, which reduces connection resistance in various kinds of thermocurable curing resins while simultaneously maintaining storage stability to have good handleability. The present description provides a thermocurable electroconductive adhesive including the following components (A) to (D): Component (A): a curable resin, Component (B): a thermal curing agent that cures Component (A), Component (C): an organometallic complex, and Component (D): electroconductive particles.