Conventionally, when an adherend is nickel or the like, it has been difficult to realize an electroconductive adhesive that lowers connection resistance in various kinds of thermocurable curing resins. However, it is possible to provide an electroconductive adhesive, in the case where the adherend is nickel or the like, which reduces connection resistance in various kinds of thermocurable curing resins while simultaneously maintaining storage stability to have good handleability. The present description provides a thermocurable electroconductive adhesive including the following components (A) to (D): Component (A): a curable resin, Component (B): a thermal curing agent that cures Component (A), Component (C): an organometallic complex, and Component (D): electroconductive particles.

The present invention discloses modified epoxy acrylates and the solder resist containing the epoxy modified acrylates, belonging to the synthetic resin field. In this invention, modified epoxy acrylates are prepared by introducing long fatty hydrocarbon chain as the branched chain into the carboxylated epoxy acrylates. The as-prepared solder resist containing this modified epoxy acrylates maintains the excellent property of photosensitive solder resist such as good adhesion, hardness, solvent resistance and weather resistance which facilities sensitivity and alkaline development during exposure simultaneously. This has led to good water resistance, electrical insulation of the cured products. Furthermore, the cured product also shows good flexibility which improves its application in photosensitive imaging ink materials.

The present invention discloses modified epoxy acrylates and the solder resist containing the epoxy modified acrylates, belonging to the synthetic resin field. In this invention, modified epoxy acrylates are prepared by introducing long fatty hydrocarbon chain as the branched chain into the carboxylated epoxy acrylates. The as-prepared solder resist containing this modified epoxy acrylates maintains the excellent property of photosensitive solder resist such as good adhesion, hardness, solvent resistance and weather resistance which facilities sensitivity and alkaline development during exposure simultaneously. This has led to good water resistance, electrical insulation of the cured products. Furthermore, the cured product also shows good flexibility which improves its application in photosensitive imaging ink materials.

The present invention discloses modified epoxy acrylates and the solder resist containing the epoxy modified acrylates, belonging to the synthetic resin field. In this invention, modified epoxy acrylates are prepared by introducing long fatty hydrocarbon chain as the branched chain into the carboxylated epoxy acrylates. The as-prepared solder resist containing this modified epoxy acrylates maintains the excellent property of photosensitive solder resist such as good adhesion, hardness, solvent resistance and weather resistance which facilities sensitivity and alkaline development during exposure simultaneously. This has led to good water resistance, electrical insulation of the cured products. Furthermore, the cured product also shows good flexibility which improves its application in photosensitive imaging ink materials.

The present invention discloses modified epoxy acrylates and the solder resist containing the epoxy modified acrylates, belonging to the synthetic resin field. In this invention, modified epoxy acrylates are prepared by introducing long fatty hydrocarbon chain as the branched chain into the carboxylated epoxy acrylates. The as-prepared solder resist containing this modified epoxy acrylates maintains the excellent property of photosensitive solder resist such as good adhesion, hardness, solvent resistance and weather resistance which facilities sensitivity and alkaline development during exposure simultaneously. This has led to good water resistance, electrical insulation of the cured products. Furthermore, the cured product also shows good flexibility which improves its application in photosensitive imaging ink materials.

An object is to provide a resin composition which is excellent in resistance to impact when dropped after curing and which is also excellent in solvent resistance, a cured product thereof, an adhesive agent for electronic components including this resin composition, a semiconductor device and an electronic component including the cured product of this resin composition. This resin composition includes (A) a hydrogenated bisphenol A-type epoxy resin, (B) a multifunctional thiol resin, and (C) a curing catalyst. The cured product of the resin composition has an elastic modulus of 0.5 GPa or more at 50 C. The resin co sition preferably includes a glycoluril compound as the component (B).

An object is to provide a resin composition which is excellent in resistance to impact when dropped after curing and which is also excellent in solvent resistance, a cured product thereof, an adhesive agent for electronic components including this resin composition, a semiconductor device and an electronic component including the cured product of this resin composition. This resin composition includes (A) a hydrogenated bisphenol A-type epoxy resin, (B) a multifunctional thiol resin, and (C) a curing catalyst. The cured product of the resin composition has an elastic modulus of 0.5 GPa or more at 50 C. The resin co sition preferably includes a glycoluril compound as the component (B).

A novel photosensitive adhesive composition including the following components (A), (B), (C), and (D): Component (A): a polymer having a structural unit of the following formula (1) and a structure of the following formula (2) at a terminal, Component (B): a polymer having the structural unit of formula (1), and a carboxy group or hydroxy group at a terminal, Component (C): a radical photopolymerization initiator, and Component (D): a solvent, wherein the content by mass of the component (B) is larger than that of the component (A), ##STR00001##
(wherein X is a C.sub.1-6 alkyl group, a vinyl group, an allyl group, or a glycidyl group, m and n are each independently 0 or 1, Q is a divalent C.sub.1-16 hydrocarbon group, Z is a divalent C.sub.1-4 linking group, the divalent linking group being bonded to an O group in formula (1), and R.sup.1 is a hydrogen atom or a methyl group.)

A novel photosensitive adhesive composition including the following components (A), (B), (C), and (D): Component (A): a polymer having a structural unit of the following formula (1) and a structure of the following formula (2) at a terminal, Component (B): a polymer having the structural unit of formula (1), and a carboxy group or hydroxy group at a terminal, Component (C): a radical photopolymerization initiator, and Component (D): a solvent, wherein the content by mass of the component (B) is larger than that of the component (A), ##STR00001##
(wherein X is a C.sub.1-6 alkyl group, a vinyl group, an allyl group, or a glycidyl group, m and n are each independently 0 or 1, Q is a divalent C.sub.1-16 hydrocarbon group, Z is a divalent C.sub.1-4 linking group, the divalent linking group being bonded to an O group in formula (1), and R.sup.1 is a hydrogen atom or a methyl group.)

The present invention relates to a kneadable adhesive sealant composition comprising a first outer portion of a first material comprising an uncured reactive polymer or resin composition and a second inner portion of a second material comprising a curing agent capable of curing the uncured reactive polymer or resin composition, wherein the first portion substantially surrounds the second portion and a process for making the same.