A curable aqueous resin emulsion composition containing: 100 parts by mass of a (meth)acrylate epoxy resin (a); from 1 to 200 parts by mass of a polymerizable unsaturated monomer (b); from 0.1 to 10 parts by mass of a curing accelerator (c); from 1 to 50 parts by mass of a reactive surfactant (d); from 10 to 2,000 parts by mass of water (e); a radical polymerization initiator (f); and at least one of a component (g) and a component (h) below: (g) at least one selected from inorganic particles and organic particles, and (h) at least one compound selected from an alkoxysilane compound, a metal alkoxy compound, a metal chelate compound, an epoxy compound, an isocyanate compound, and a triazine compound.

A curable aqueous resin emulsion composition containing: 100 parts by mass of a (meth)acrylate epoxy resin (a); from 1 to 200 parts by mass of a polymerizable unsaturated monomer (b); from 0.1 to 10 parts by mass of a curing accelerator (c); from 1 to 50 parts by mass of a reactive surfactant (d); from 10 to 2,000 parts by mass of water (e); a radical polymerization initiator (f); and at least one of a component (g) and a component (h) below: (g) at least one selected from inorganic particles and organic particles, and (h) at least one compound selected from an alkoxysilane compound, a metal alkoxy compound, a metal chelate compound, an epoxy compound, an isocyanate compound, and a triazine compound.

Provided is a visible-laser-curable or infrared-laser-curable resin composition that cures in a shorter time and with less energy. A visible-laser-curable or infrared-laser-curable cationically polymerizable epoxy resin composition comprising (A) an epoxy resin and (B) an acid generator.

Provided is a visible-laser-curable or infrared-laser-curable resin composition that cures in a shorter time and with less energy. A visible-laser-curable or infrared-laser-curable cationically polymerizable epoxy resin composition comprising (A) an epoxy resin and (B) an acid generator.

Raw materials constituting a protective colloid includes: UV epoxy-modified acrylate polymer, heat-expandable particles, plasticizer, active monomer and cationic photoinitiator. A weight percent of the UV epoxy-modified acrylate polymer is 40-65%; a weight percentage of the heat-expandable particles is 2-10%; a weight percentage of the plasticizer is 10-15%; a weight percentage of the active monomer is 10-30%; and a weight percent of the cationic photoinitiator is 1-3%. Besides, a method for using the protective colloid is also disclosed.

Raw materials constituting a protective colloid includes: UV epoxy-modified acrylate polymer, heat-expandable particles, plasticizer, active monomer and cationic photoinitiator. A weight percent of the UV epoxy-modified acrylate polymer is 40-65%; a weight percentage of the heat-expandable particles is 2-10%; a weight percentage of the plasticizer is 10-15%; a weight percentage of the active monomer is 10-30%; and a weight percent of the cationic photoinitiator is 1-3%. Besides, a method for using the protective colloid is also disclosed.

A binder composition includes an epoxidized vegetable oil or a derivative thereof having an epoxy group content of 1 to 12 weight percent, based on the total weight of the epoxidized vegetable oil; a carboxyl-functionalized resin; and a liquid reactive diluent. A combined acid value of the carboxyl-functionalized resin and the liquid reactive diluent is 50 to 500. Uses of the binder composition, for example in composites, coatings, elastomer formulations, and adhesives are also disclosed.

A binder composition includes an epoxidized vegetable oil or a derivative thereof having an epoxy group content of 1 to 12 weight percent, based on the total weight of the epoxidized vegetable oil; a carboxyl-functionalized resin; and a liquid reactive diluent. A combined acid value of the carboxyl-functionalized resin and the liquid reactive diluent is 50 to 500. Uses of the binder composition, for example in composites, coatings, elastomer formulations, and adhesives are also disclosed.

An adhesive composition, including: a reaction product (A) among a bifunctional epoxy resin represented by the formula (2), a tri- or more functional epoxy resin represented by the formula (3), and a saturated acid anhydride represented by the following general formula (4); a UV-sensitive reaction initiator (B); and a dilution solvent (C), wherein the component (A) is a compound represented by the formula (1), a ratio of a total mole of epoxy groups in the multi-functional epoxy resin to a mole of the saturated acid anhydride is 1.30 to 3.00, and a mole of the bifunctional epoxy resin relative to a total mole of the multi-functional epoxy resin is 0.001 to 0.15. This provides a highly reliable epoxy-resin-based adhesive composition and film-shaped sealing material having a low viscosity, curability at low temperature, and high adhesiveness, and retaining power generation performance of a perovskite solar cell before and after sealing.

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An adhesive composition, including: a reaction product (A) among a bifunctional epoxy resin represented by the formula (2), a tri- or more functional epoxy resin represented by the formula (3), and a saturated acid anhydride represented by the following general formula (4); a UV-sensitive reaction initiator (B); and a dilution solvent (C), wherein the component (A) is a compound represented by the formula (1), a ratio of a total mole of epoxy groups in the multi-functional epoxy resin to a mole of the saturated acid anhydride is 1.30 to 3.00, and a mole of the bifunctional epoxy resin relative to a total mole of the multi-functional epoxy resin is 0.001 to 0.15. This provides a highly reliable epoxy-resin-based adhesive composition and film-shaped sealing material having a low viscosity, curability at low temperature, and high adhesiveness, and retaining power generation performance of a perovskite solar cell before and after sealing.

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