Provided is a technique suitable for multilayering thin semiconductor elements via adhesive bonding while avoiding wafer damage in a method of manufacturing a semiconductor device, the method in which semiconductor elements are multilayered through laminating wafers in which the semiconductor elements are fabricated. The method of the present invention includes bonding and removing. In the bonding step, a back surface 1b side of a thinned wafer 1T in a reinforced wafer 1R having a laminated structure including a supporting substrate S, a temporary adhesive layer 2, and the thinned wafer 1T is bonded via an adhesive to an element forming surface 3a of a wafer 3. A temporary adhesive for forming the temporary adhesive layer 2 contains a polyvalent vinyl ether compound, a compound having two or more hydroxy groups or carboxy groups and thus capable of forming a polymer with the polyvalent vinyl ether compound, and a thermoplastic resin. The adhesive contains a polymerizable group-containing polyorganosilsesquioxane. In the removing step, a temporary adhesion by the temporary adhesive layer 2 between the supporting substrate S and the thinned wafer 1T is released to remove the supporting substrate S.

Provided is a technique suitable for multilayering thin semiconductor elements via adhesive bonding while avoiding wafer damage in a method of manufacturing a semiconductor device, the method in which semiconductor elements are multilayered through laminating wafers in which the semiconductor elements are fabricated. The method of the present invention includes bonding and removing. In the bonding step, a back surface 1b side of a thinned wafer 1T in a reinforced wafer 1R having a laminated structure including a supporting substrate S, a temporary adhesive layer 2, and the thinned wafer 1T is bonded via an adhesive to an element forming surface 3a of a wafer 3. A temporary adhesive for forming the temporary adhesive layer 2 contains a polyvalent vinyl ether compound, a compound having two or more hydroxy groups or carboxy groups and thus capable of forming a polymer with the polyvalent vinyl ether compound, and a thermoplastic resin. The adhesive contains a polymerizable group-containing polyorganosilsesquioxane. In the removing step, a temporary adhesion by the temporary adhesive layer 2 between the supporting substrate S and the thinned wafer 1T is released to remove the supporting substrate S.

The aim of the invention is to provide polyester/primer/metallic coating composite films having good adherence of the metallic coating in dry and humid conditions. Said films also form a good gas barrier: oxygen permeability less than or equal to 0.8 cc/m2/d; water vapour permeability less than or equal to 0.3 g/m2/d. To this end, the invention concerns a composite film comprising a polyester substrate, at least one coating adhering on at least one of the faces of the substrate and at least one layer of primer for cross-linked adhesion between the substrate and the coating. Said primer comprises at least one acrylic and/or methacrylic polymer P1, at least one acrylic and/or methacrylic polymer P2 different from P1, at least one cross-linking agent, and, preferably, at least one polyester that is soluble or dispersible in water: —P1 having a gel content TG1>70% by dry weight with respect to P1; —P2 having a gel content TG2≤TG1 and ≤20% by dry weight, with respect to P2; —P1 having a surface-grafted free weak acid content≥0.8 in meq/g of polymer; —[P2]≤60% by weight on dry by weight in respect to P1+P2. The method for producing said film, the adhering primer, and the articles obtained using said film, also form part of the present invention.

The aim of the invention is to provide polyester/primer/metallic coating composite films having good adherence of the metallic coating in dry and humid conditions. Said films also form a good gas barrier: oxygen permeability less than or equal to 0.8 cc/m2/d; water vapour permeability less than or equal to 0.3 g/m2/d. To this end, the invention concerns a composite film comprising a polyester substrate, at least one coating adhering on at least one of the faces of the substrate and at least one layer of primer for cross-linked adhesion between the substrate and the coating. Said primer comprises at least one acrylic and/or methacrylic polymer P1, at least one acrylic and/or methacrylic polymer P2 different from P1, at least one cross-linking agent, and, preferably, at least one polyester that is soluble or dispersible in water: —P1 having a gel content TG1>70% by dry weight with respect to P1; —P2 having a gel content TG2≤TG1 and ≤20% by dry weight, with respect to P2; —P1 having a surface-grafted free weak acid content≥0.8 in meq/g of polymer; —[P2]≤60% by weight on dry by weight in respect to P1+P2. The method for producing said film, the adhering primer, and the articles obtained using said film, also form part of the present invention.

An adhesive tape with a backing layer is longitudinally folded upon itself, creating an approximately 180-degree angle at each of two ends of the tape, and a first longitudinal section of multiple layers of the adhesive tape and a second longitudinal section of multiple layers of the adhesive tape such that the first section is positioned above and parallel to the second section. The folding does not crease the tape at either end of the tape. The first longitudinal section and second longitudinal section are maintained in contact or close proximity via a piece of tape, clip, rubber band, or other means, such that the adhesive tape is maintained in a flat profile. The adhesive tape in its flat profile can then be easily inserted into a United States first class letter-sized mailing envelope.

Provided is a polyester composite film, comprising a first thermoplastic polyether ester elastomer (TPEE) film and a second TPEE film. The melting point of a second TPEE resin of the second TPEE film is higher than that of a first TPEE resin of the first TPEE film, and the absolute difference in enthalpy of fusion between the first and second TPEE films is 5 J/g to 15 J/g. By adopting the first and second TPEE films having specific absolute difference of the enthalpy of fusion and controlling the melting points of the first and second TPEE resins, the polyester composite film can be well attached onto the fabric by hot pressing to obtain sufficient peel strength, and thereby the attached fabric can have excellent waterproof performance. Besides, a hot melt adhesive laminate comprising the polyester composite film also exhibits the above beneficial effects when attached to the fabric.

A semicrystalline copolyester resin composition formed by twin screw extrusion of various ingredients includes copolyester resins, antiblock, slip and antifog additives. This semicrystalline copolyester resin can be extruded on to PET film or coextruded with PET resin to form clear PET films with antifog properties. These films with antifog properties are produced in a single step without the use of solvent and does not involve any secondary step for coating a separate antifog layer. This minimizes the cost and time required by a converter to make such clear antifog films. These films containing the heat seal copolyester resin can be heat sealed to clear APET trays. Contents within the trays, such as food, can be seen without fogging on the inside of the film that is used to seal the tray. The seals are strong and the peels are smooth giving a very good packaging performance.

A semicrystalline copolyester resin composition formed by twin screw extrusion of various ingredients includes copolyester resins, antiblock, slip and antifog additives. This semicrystalline copolyester resin can be extruded on to PET film or coextruded with PET resin to form clear PET films with antifog properties. These films with antifog properties are produced in a single step without the use of solvent and does not involve any secondary step for coating a separate antifog layer. This minimizes the cost and time required by a converter to make such clear antifog films. These films containing the heat seal copolyester resin can be heat sealed to clear APET trays. Contents within the trays, such as food, can be seen without fogging on the inside of the film that is used to seal the tray. The seals are strong and the peels are smooth giving a very good packaging performance.

Described herein is a thermosetting resin composition, obtained from the reaction of at least: a polycarbodiimide (i), where the number of carbodiimide groups per molecule is in the range of from 1 to 10; a mixture of crystalline and amorphous polyols (ii), where the molar ratio of carbodiimide groups in the polycarbodiimide according to (i) to hydroxyl groups in the mixture according to (ii) is in the range of from 1:2 to 2:1 and where at least 25 weight-% of the mixture according to (ii) consists of at least one crystalline polyesterol, based on the overall weight of the mixture being 100 weight-%. Also described herein is a method of using the thermosetting resin composition as an adhesive, as well as processes for preparation of adhesives, an element including an adhesive layer on at least one substrate, and an adhesive film, obtained from one of the processes.

This invention pertains to a curable composition comprising a first component having β-ketoester and/or malonate functionalities and a second component having two or more aldehyde functionalities. The compositions can be cured at room temperature or low temperatures to yield crosslinked networks that are capable of providing desirable properties for coating and adhesive applications. The reactive functionalities of β-ketoester, malonate, and aldehyde can be either on polymers as the main binders or on small molecules as the crosslinkers. The curable compositions desirably are either solventless or organic solvent based.