Provided is a technique suitable for multilayering thin semiconductor elements via adhesive bonding while avoiding wafer damage in a method of manufacturing a semiconductor device, the method in which semiconductor elements are multilayered through laminating wafers in which the semiconductor elements are fabricated. The method of the present invention includes bonding and removing. In the bonding step, a back surface 1b side of a thinned wafer 1T in a reinforced wafer 1R having a laminated structure including a supporting substrate S, a temporary adhesive layer 2, and the thinned wafer 1T is bonded via an adhesive to an element forming surface 3a of a wafer 3. A temporary adhesive for forming the temporary adhesive layer 2 contains a polyvalent vinyl ether compound, a compound having two or more hydroxy groups or carboxy groups and thus capable of forming a polymer with the polyvalent vinyl ether compound, and a thermoplastic resin. The adhesive contains a polymerizable group-containing polyorganosilsesquioxane. In the removing step, a temporary adhesion by the temporary adhesive layer 2 between the supporting substrate S and the thinned wafer 1T is released to remove the supporting substrate S.

Disclosed is an eco-friendly adhesive coating agent composition having high adhesion properties and fast-curing properties by using a thiol-modified epoxy intermediate. The composition includes: a main material including 25 to 40 parts by weight of polyoxypropyleneamine, 20 to 30 parts by weight of a cross-linking agent, 10 to 30 parts by weight of the thiol-modified epoxy intermediate, 10 to 20 parts by weight of an inorganic filler, 5 to 10 parts by weight of a pigment, and 2 to 5 parts by weight of an additive; and a curing agent including 60 to 80 parts by weight of a rubber-modified epoxy resin, 20 to 40 parts by weight of a polyol, 10 to 30 parts by weight of the thiol-modified epoxy intermediate, and 4 to 10 parts by weight of an additive, with respect to 100 parts by weight of an isocyanate mixture.

Disclosed is an eco-friendly adhesive coating agent composition having high adhesion properties and fast-curing properties by using a thiol-modified epoxy intermediate. The composition includes: a main material including 25 to 40 parts by weight of polyoxypropyleneamine, 20 to 30 parts by weight of a cross-linking agent, 10 to 30 parts by weight of the thiol-modified epoxy intermediate, 10 to 20 parts by weight of an inorganic filler, 5 to 10 parts by weight of a pigment, and 2 to 5 parts by weight of an additive; and a curing agent including 60 to 80 parts by weight of a rubber-modified epoxy resin, 20 to 40 parts by weight of a polyol, 10 to 30 parts by weight of the thiol-modified epoxy intermediate, and 4 to 10 parts by weight of an additive, with respect to 100 parts by weight of an isocyanate mixture.

The present disclosure relates to a process of manufacturing curable precursor of a structural adhesive composition. According to another aspect, the present disclosure is directed to method of bonding two parts.

The present disclosure relates to a process of manufacturing curable precursor of a structural adhesive composition. According to another aspect, the present disclosure is directed to method of bonding two parts.

An object of the present invention is to provide an adhesive composition that causes less warpage when dissimilar materials are bonded together, and has excellent adhesive strength. The present invention relates to an adhesive composition comprising a component (A) that is a monofunctional epoxy resin, a component (B) that is a polyfunctional radically polymerizable compound, a component (C) that is a curing agent, and a component (D) that is a thermal radical initiator, the component (C) being one or more selected from the group consisting of a component (c-1) that is an epoxy adduct-type latent curing agent, a component (c-2) that is a hydrazide compound, a component (c-3) that is a cyclic amidine salt, and a component (c-4) that is a thermal cationic polymerization initiator.

An object of the present invention is to provide an adhesive composition that causes less warpage when dissimilar materials are bonded together, and has excellent adhesive strength. The present invention relates to an adhesive composition comprising a component (A) that is a monofunctional epoxy resin, a component (B) that is a polyfunctional radically polymerizable compound, a component (C) that is a curing agent, and a component (D) that is a thermal radical initiator, the component (C) being one or more selected from the group consisting of a component (c-1) that is an epoxy adduct-type latent curing agent, a component (c-2) that is a hydrazide compound, a component (c-3) that is a cyclic amidine salt, and a component (c-4) that is a thermal cationic polymerization initiator.

Adhesives for use on user-to-mask interfaces of a respiratory mask and methods of preparing the same are provided. The adhesive includes greater than or equal to about 1 wt. % to less than or equal to about 15 wt. % of one or more glycerides; greater than or equal to about 0.50 wt. % to less than or equal to about 5 wt. % of one or more polyacrylates; greater than or equal to about 1 wt. % to less than or equal to about 10 wt. % of one or more polyethers; greater than or equal to about 25 wt. % to less than or equal to about 45 wt. % of one or more N-vinylpyrrolidone polymers; and a balance of water. The method includes forming a first aqueous mixture, forming a second aqueous mixture, and admixing the first aqueous mixture and the second aqueous mixture to form a substantially homogeneous mixture that defines the adhesive.

A method of producing an electrically conductive material includes hardening, at a temperature in a range of 120° C. to 300° C., an electrically conductive adhesive that constitutes: (A) a polyether polymer having a backbone of a repeating unit of the formula —R.sup.1—O—, wherein R.sup.1 is a hydrocarbon group having 1 to 10 carbon atoms and an end group which is a hydrolyzable silyl group; and (B) silver particles.

A method of producing an electrically conductive material includes hardening, at a temperature in a range of 120° C. to 300° C., an electrically conductive adhesive that constitutes: (A) a polyether polymer having a backbone of a repeating unit of the formula —R.sup.1—O—, wherein R.sup.1 is a hydrocarbon group having 1 to 10 carbon atoms and an end group which is a hydrolyzable silyl group; and (B) silver particles.