Described herein are poly(aryl ether) (PAE) adhesive compositions including at least one PAE chelating agent. The PAE chelating agent is a PAE polymer. In some embodiments, the PAE adhesive composition can optionally include one or more poly(aryl ether ketone) polymers distinct from the PAE chelating agent. The PAE adhesive composition can be incorporated into polymer-metal junctions to improve the strength thereof. In some such embodiments, the adhesive composition can be disposed between a portion of the plastic component and a portion of the metal component of the polymer-metal junction. In some embodiments, the PAE adhesive compositions can be used in conjunction with one or more adhesion promoters distinct from the PAE adhesive composition. In some embodiments, polymer-metal junctions including the PAE chelating agent can be desirably incorporated in mobile electronic device components.

The present technology provides a rubber composition comprising: from 1.0 part by mass to 15 parts by mass of water, and from 0.5 parts by mass to 10 parts by mass of water absorbing resin as a water retaining agent, or from 0.5 parts by mass to 20 parts by mass of inorganic water retaining agent as a water retaining agent, per 100 parts by mass of diene polymer that can be sulfur-vulcanized.

The present technology provides a rubber composition comprising: from 1.0 part by mass to 15 parts by mass of water, and from 0.5 parts by mass to 10 parts by mass of water absorbing resin as a water retaining agent, or from 0.5 parts by mass to 20 parts by mass of inorganic water retaining agent as a water retaining agent, per 100 parts by mass of diene polymer that can be sulfur-vulcanized.

A method of making a fiber optic connector sub-assembly involves: initially disposing a bonding agent in a ferrule bore of a ferrule; heating at least a portion of the ferrule above a melting temperature of the bonding agent so that some of the bonding agent melts; and solidifying the bonding agent that has melted to form the fiber optic connector sub-assembly, all without an optical fiber being disposed within the ferrule bore.

A method of making a fiber optic connector sub-assembly involves: initially disposing a bonding agent in a ferrule bore of a ferrule; heating at least a portion of the ferrule above a melting temperature of the bonding agent so that some of the bonding agent melts; and solidifying the bonding agent that has melted to form the fiber optic connector sub-assembly, all without an optical fiber being disposed within the ferrule bore.

A method of making a fiber optic connector sub-assembly involves: initially disposing a bonding agent in a ferrule bore of a ferrule; heating at least a portion of the ferrule above a melting temperature of the bonding agent so that some of the bonding agent melts; and solidifying the bonding agent that has melted to form the fiber optic connector sub-assembly, all without an optical fiber being disposed within the ferrule bore.

A method of making a fiber optic connector sub-assembly involves: initially disposing a bonding agent in a ferrule bore of a ferrule; heating at least a portion of the ferrule above a melting temperature of the bonding agent so that some of the bonding agent melts; and solidifying the bonding agent that has melted to form the fiber optic connector sub-assembly, all without an optical fiber being disposed within the ferrule bore.

A curable composition that contains a hydrolyzable silyl group-containing polymer and that exhibits improved adhesion to polyolefinic materials is provided. The curable composition contains (A) a hydrolyzable silyl group-containing (meth)acrylic ester polymer, (B) a chlorinated polyolefin resin, and (C) a nitrogen-containing dialkoxysilane compound. The curable composition may further contain a guanidino group-containing compound (D) or a hydrolyzable silyl group-containing polyoxyalkylene polymer (E).

A curable composition that contains a hydrolyzable silyl group-containing polymer and that exhibits improved adhesion to polyolefinic materials is provided. The curable composition contains (A) a hydrolyzable silyl group-containing (meth)acrylic ester polymer, (B) a chlorinated polyolefin resin, and (C) a nitrogen-containing dialkoxysilane compound. The curable composition may further contain a guanidino group-containing compound (D) or a hydrolyzable silyl group-containing polyoxyalkylene polymer (E).

A solid, dry to the touch at ambient temperature, heat curable, generally non-foaming structural adhesive that exhibits shape memory characteristics. The adhesive can be cured at an elevated temperature and contains a high molecular weight polymeric constituent that can be oriented such that at an elevated temperature below the curing temperature the material will shrink in one plane while increasing its thickness at a temperature in the range of from above the elevated temperature to below the curing temperature.