Patent classifications
C09J175/02
Sulphur-comprising polyaromatic polyamine that can be used in the synthesis of polyurea
A sulphur-comprising polyaromatic polyamine compound can be used as a monomer or prepolymer, when n is different from zero, in the synthesis of polyurea. The compound corresponds to the formula (I):
H.sub.2NAr.sub.1NHCH.sub.2CH(OH)(CH.sub.2).sub.mOZ.sub.1O(CH.sub.2).sub.mCH(OH)CH.sub.2[X].sub.nHNAr.sub.2NH.sub.2
in which X represents the string:
HNAr.sub.3NH(CH.sub.2)CH(OH)(CH.sub.2).sub.mOZ.sub.2O(CH.sub.2).sub.mCH(OH)(CH.sub.2)
and in which n represents an integer equal to zero or different from zero; m, which are identical or different, represent an integer within a range from 1 to 10; Z.sub.1 and Z.sub.2, which are identical or different, represent a divalent bonding group comprising from 1 to 30 carbon atoms; and Ar.sub.1, Ar.sub.2 and Ar.sub.3, which are identical or different, each represent a phenylene group, at least one of these phenylene groups bearing one, two, three or four groups of formula S.sub.xR in which x is an integer from 1 to 8 and R represents hydrogen or a hydrocarbon group which can comprise a heteroatom and which comprises from 1 to 10 carbon atoms.
Sulphur-comprising polyaromatic polyamine that can be used in the synthesis of polyurea
A sulphur-comprising polyaromatic polyamine compound can be used as a monomer or prepolymer, when n is different from zero, in the synthesis of polyurea. The compound corresponds to the formula (I):
H.sub.2NAr.sub.1NHCH.sub.2CH(OH)(CH.sub.2).sub.mOZ.sub.1O(CH.sub.2).sub.mCH(OH)CH.sub.2[X].sub.nHNAr.sub.2NH.sub.2
in which X represents the string:
HNAr.sub.3NH(CH.sub.2)CH(OH)(CH.sub.2).sub.mOZ.sub.2O(CH.sub.2).sub.mCH(OH)(CH.sub.2)
and in which n represents an integer equal to zero or different from zero; m, which are identical or different, represent an integer within a range from 1 to 10; Z.sub.1 and Z.sub.2, which are identical or different, represent a divalent bonding group comprising from 1 to 30 carbon atoms; and Ar.sub.1, Ar.sub.2 and Ar.sub.3, which are identical or different, each represent a phenylene group, at least one of these phenylene groups bearing one, two, three or four groups of formula S.sub.xR in which x is an integer from 1 to 8 and R represents hydrogen or a hydrocarbon group which can comprise a heteroatom and which comprises from 1 to 10 carbon atoms.
CURING AGENT FOR USE IN PRODUCTION OF POLYUREA RESIN, AND POLYUREA RESIN PRODUCTION METHOD USING SAME
To provide a curing agent for producing a polyurea resin, which is capable of thermal compression molding, which will not cause odor and toxicity or environmental problems at the time of molding or of products, which has favorable adhesive strength, and which hardly causes pollution of other materials, and a method for producing a polyurea resin using it.
A curing agent for producing a polyurea resin, which comprises at least one diamine compound selected from the group consisting of compounds each represented by the following formula (1):
##STR00001##
wherein n is 0 or 1, and R is a hydroxy group or hydroxyalkyl group having 0 to 2 carbon atoms, and at least one amine compound selected from the group consisting of N,N-dimethylaminoethanol, N,N-dimethylaminoisopropanol and N,N-dimethyl-N,N-di(2-hydroxypropyl)propylenediamine.
CURING AGENT FOR USE IN PRODUCTION OF POLYUREA RESIN, AND POLYUREA RESIN PRODUCTION METHOD USING SAME
To provide a curing agent for producing a polyurea resin, which is capable of thermal compression molding, which will not cause odor and toxicity or environmental problems at the time of molding or of products, which has favorable adhesive strength, and which hardly causes pollution of other materials, and a method for producing a polyurea resin using it.
A curing agent for producing a polyurea resin, which comprises at least one diamine compound selected from the group consisting of compounds each represented by the following formula (1):
##STR00001##
wherein n is 0 or 1, and R is a hydroxy group or hydroxyalkyl group having 0 to 2 carbon atoms, and at least one amine compound selected from the group consisting of N,N-dimethylaminoethanol, N,N-dimethylaminoisopropanol and N,N-dimethyl-N,N-di(2-hydroxypropyl)propylenediamine.
Solvent-borne polyurethane adhesives with high molecular weight, high OH content and low solution viscosity
An adhesive composition includes a polyurethane polymer, a solvent and a co-solvent. The polyurethane polymer is an internally and/or externally hydrophilized thermoplastic polyurethane having an Mw of 50000 g/mol. The solvent is a polar-aprotic solvent. The co-solvent is selected from water, a primary alcohol having 10 carbon atoms, a vicinal diol or a mixture of at least two of the aforementioned compounds. The solvent and the co-solvent are present in such amounts that they form a homogenous mixture without the formation of a second phase when combined together at 20 C. The hydroxyl group content is 1 weight-%, based on the total weight of the composition. The polyurethane polymer content is 10 weight-%, based on the total weight of the composition and the composition forms a single continuous liquid phase. Examples for solvent/co-solvent combinations are methylethyl ketone (MEK) and water or MEK and ethanol.
Solvent-borne polyurethane adhesives with high molecular weight, high OH content and low solution viscosity
An adhesive composition includes a polyurethane polymer, a solvent and a co-solvent. The polyurethane polymer is an internally and/or externally hydrophilized thermoplastic polyurethane having an Mw of 50000 g/mol. The solvent is a polar-aprotic solvent. The co-solvent is selected from water, a primary alcohol having 10 carbon atoms, a vicinal diol or a mixture of at least two of the aforementioned compounds. The solvent and the co-solvent are present in such amounts that they form a homogenous mixture without the formation of a second phase when combined together at 20 C. The hydroxyl group content is 1 weight-%, based on the total weight of the composition. The polyurethane polymer content is 10 weight-%, based on the total weight of the composition and the composition forms a single continuous liquid phase. Examples for solvent/co-solvent combinations are methylethyl ketone (MEK) and water or MEK and ethanol.
Process for modifying the surface polarity of rubber substrates
The present invention relates to a process for modifying the surface polarity of elastomeric rubber substrates to facilitate their cold bonding to other rubber substrates or non-elastomeric substrates of a different material, preferably metal, by chlorinating the elastomeric rubber substrate surface by treatment with a chloride-containing composition and a peroxymonosulfate-containing composition. Further aspects relate to the thus-obtained surface-modified rubber substrates, processes of bonding them to other substrates by use of an adhesive, as well as the thus-obtained bonded substrates.
Process for modifying the surface polarity of rubber substrates
The present invention relates to a process for modifying the surface polarity of elastomeric rubber substrates to facilitate their cold bonding to other rubber substrates or non-elastomeric substrates of a different material, preferably metal, by chlorinating the elastomeric rubber substrate surface by treatment with a chloride-containing composition and a peroxymonosulfate-containing composition. Further aspects relate to the thus-obtained surface-modified rubber substrates, processes of bonding them to other substrates by use of an adhesive, as well as the thus-obtained bonded substrates.
SURFACE TOLERANT ADHESIVE
The present disclosure provides a composition including a curable resin, a curing agent and surface modifying agent such as a reactive siloxane, a reactive fluoro compound or a mixture thereof. The composition is tolerant to various contaminants typically found on surfaces of substrates, such as silicone, and is therefore able to attach to substrate having such contaminants on its surface and provide improved adhesion performance.
SURFACE TOLERANT ADHESIVE
The present disclosure provides a composition including a curable resin, a curing agent and surface modifying agent such as a reactive siloxane, a reactive fluoro compound or a mixture thereof. The composition is tolerant to various contaminants typically found on surfaces of substrates, such as silicone, and is therefore able to attach to substrate having such contaminants on its surface and provide improved adhesion performance.