Patent classifications
C09J175/04
WINDOW AND DISPLAY DEVICE INCLUDING THE SAME
Provided is a window including a base layer, a hard coating layer disposed above the base layer, and a bonding layer disposed between the base layer and the hard coating layer. The bonding layer includes polysiloxane.
THERMALLY-CONDUCTIVE STRUCTURAL ADHESIVE FOR NEW ENERGY POWER BATTERY AND METHOD OF PREPARING SAME
A thermally-conductive structural adhesive for new energy power batteries, including: composition A including 3.3-14 wt. % of a block polymerized telechelic carboxyl compound and/or a block polymerized telechelic amino compound; 0.1-1.0 wt. % of a coupling agent and/or a modifier; 0-1.6 wt. % of curing accelerator; 84-92 wt. % of a thermally-conductive powder; and 0.3-3.0 wt. % of a flame retardant agent; and composition B including 3.3-14 wt. % of a block polymerized telechelic isocyanate compound and/or a block polymerized telechelic epoxy compound; 0-1.0 wt. % of a coupling agent and/or a modifier; 0-1.6 wt. % of a curing accelerator; 84-92 wt. % of a thermally-conductive powder; and 0.3-3 wt. % of a flame retardant agent. The composition A and the composition B are mixed evenly in a weight or volume ratio of 1:(0.25-2) and cured to obtain the thermally-conductive structural adhesive. A preparation of the thermally-conductive structural adhesive is also provided.
THERMALLY-CONDUCTIVE STRUCTURAL ADHESIVE FOR NEW ENERGY POWER BATTERY AND METHOD OF PREPARING SAME
A thermally-conductive structural adhesive for new energy power batteries, including: composition A including 3.3-14 wt. % of a block polymerized telechelic carboxyl compound and/or a block polymerized telechelic amino compound; 0.1-1.0 wt. % of a coupling agent and/or a modifier; 0-1.6 wt. % of curing accelerator; 84-92 wt. % of a thermally-conductive powder; and 0.3-3.0 wt. % of a flame retardant agent; and composition B including 3.3-14 wt. % of a block polymerized telechelic isocyanate compound and/or a block polymerized telechelic epoxy compound; 0-1.0 wt. % of a coupling agent and/or a modifier; 0-1.6 wt. % of a curing accelerator; 84-92 wt. % of a thermally-conductive powder; and 0.3-3 wt. % of a flame retardant agent. The composition A and the composition B are mixed evenly in a weight or volume ratio of 1:(0.25-2) and cured to obtain the thermally-conductive structural adhesive. A preparation of the thermally-conductive structural adhesive is also provided.
Solvent-based primer having a long open time and improved adhesion
Adhesion promoter compositions, containing: a) between 40 and 80 parts by weight of a binder composition, including i) 20-40 wt % of at least one silane-terminated polyurethane polymer STP, which can be obtained from at least one polyol P, aliphatic polyisocyanate I and organosilane OS1, ii) 4-20 wt % of at least one organosilane OS2 and/or organotitanate OT, iii) 0-3 wt % of at least one desiccant, iv) 40-80 wt % of solvent L1; b) between 0-30 parts by weight of industrial carbon black; c) between 0-1 parts by weight of UV marker; d) so much of solvent L2 that sum of a)-d) is 100 parts by weight; OS1 having secondary amino, mercapto or hydroxyl group on organic moiety and the at least one STP having been produced in absence of OS2, and the at least one P having an average OH functionality of at least 2 and equivalent weight of at most 500.
Solvent-based primer having a long open time and improved adhesion
Adhesion promoter compositions, containing: a) between 40 and 80 parts by weight of a binder composition, including i) 20-40 wt % of at least one silane-terminated polyurethane polymer STP, which can be obtained from at least one polyol P, aliphatic polyisocyanate I and organosilane OS1, ii) 4-20 wt % of at least one organosilane OS2 and/or organotitanate OT, iii) 0-3 wt % of at least one desiccant, iv) 40-80 wt % of solvent L1; b) between 0-30 parts by weight of industrial carbon black; c) between 0-1 parts by weight of UV marker; d) so much of solvent L2 that sum of a)-d) is 100 parts by weight; OS1 having secondary amino, mercapto or hydroxyl group on organic moiety and the at least one STP having been produced in absence of OS2, and the at least one P having an average OH functionality of at least 2 and equivalent weight of at most 500.
Bio-electrode composition, bio-electrode, and method for manufacturing a bio-electrode
The present invention provides a bio-electrode composition including a silsesquioxane bonded to an N-carbonyl sulfonamide salt, wherein the N-carbonyl sulfonamide salt is shown by the following general formula (1): ##STR00001##
wherein R.sup.1 represents a linear, branched, or cyclic alkylene group having 1 to 20 carbon atoms that may have an aromatic group, an ether group, or an ester group, or an arylene group having 6 to 10 carbon atoms; Rf represents a linear, branched, or cyclic alkyl group having 1 to 4 carbon atoms containing at least one fluorine atom; M.sup.+ is an ion selected from a lithium ion, a sodium ion, a potassium ion, and a silver ion. This can form a living body contact layer for a bio-electrode that is excellent in electric conductivity and biocompatibility, light-weight, manufacturable at low cost, and free from large lowering of the electric conductivity even though it is wetted with water or dried.
Bio-electrode composition, bio-electrode, and method for manufacturing a bio-electrode
The present invention provides a bio-electrode composition including a silsesquioxane bonded to an N-carbonyl sulfonamide salt, wherein the N-carbonyl sulfonamide salt is shown by the following general formula (1): ##STR00001##
wherein R.sup.1 represents a linear, branched, or cyclic alkylene group having 1 to 20 carbon atoms that may have an aromatic group, an ether group, or an ester group, or an arylene group having 6 to 10 carbon atoms; Rf represents a linear, branched, or cyclic alkyl group having 1 to 4 carbon atoms containing at least one fluorine atom; M.sup.+ is an ion selected from a lithium ion, a sodium ion, a potassium ion, and a silver ion. This can form a living body contact layer for a bio-electrode that is excellent in electric conductivity and biocompatibility, light-weight, manufacturable at low cost, and free from large lowering of the electric conductivity even though it is wetted with water or dried.
STRONG AND STRETCHABLE SEAM TAPE
The present invention relates to a seam tape comprising at least one layer of unidirectionally aligned fibers whereby the fibers are oriented substantially perpendicular to the length of the tape and the strength of the tape in the perpendicular direction is at least 200 N/ 2.54 cm [inch]. The fibers are selected from the group of UHMWPE, polyamide, polyester, glass or carbon fibers. Preferably the fibers are UHMWPE fibers. The seam tape may further comprise a hot melt adhesive. The hot melt adhesive preferably has a melting point which is at least 25° C. to 70° C. lower than the melting point of the fibers. The hot melt adhesive is chosen from the group consisting of thermoplastic polymers such as polyamides, co-polyamides, polyamino-amides, polyesters, polyacrylates, polymethacrylates, polyolefins, ethylene/vinyl acetate copolymers or mixtures thereof. The present invention further relates to the use of the seam tape in backpacks, packs, bags, medical gear, outdoor products, sail cloths, tents, tarps, shelters, clothing, ponchos, foul weather gear, mats, outerwear, jackets, sleeping bags, lift bags, parachutes, large kites, inflatable structures, beams, balloons, packraft, inflatable gear, liferaft, inflatable sculptures, airship (HAA: High Altitude Airships), space applications, flexible circuits and footwear, inflatables, radomes, tensioned structures, or umbrellas.
STRONG AND STRETCHABLE SEAM TAPE
The present invention relates to a seam tape comprising at least one layer of unidirectionally aligned fibers whereby the fibers are oriented substantially perpendicular to the length of the tape and the strength of the tape in the perpendicular direction is at least 200 N/ 2.54 cm [inch]. The fibers are selected from the group of UHMWPE, polyamide, polyester, glass or carbon fibers. Preferably the fibers are UHMWPE fibers. The seam tape may further comprise a hot melt adhesive. The hot melt adhesive preferably has a melting point which is at least 25° C. to 70° C. lower than the melting point of the fibers. The hot melt adhesive is chosen from the group consisting of thermoplastic polymers such as polyamides, co-polyamides, polyamino-amides, polyesters, polyacrylates, polymethacrylates, polyolefins, ethylene/vinyl acetate copolymers or mixtures thereof. The present invention further relates to the use of the seam tape in backpacks, packs, bags, medical gear, outdoor products, sail cloths, tents, tarps, shelters, clothing, ponchos, foul weather gear, mats, outerwear, jackets, sleeping bags, lift bags, parachutes, large kites, inflatable structures, beams, balloons, packraft, inflatable gear, liferaft, inflatable sculptures, airship (HAA: High Altitude Airships), space applications, flexible circuits and footwear, inflatables, radomes, tensioned structures, or umbrellas.
POLYCARBODIIMIDE COMPOUND, AQUEOUS RESIN COMPOSITION AND FOOD PACKAGING CONTAINER
Provided are a polycarbodiimide compound that enables an aqueous resin composition capable of forming a coating (layer) having water resistance and adhesion that can withstand use for food packaging to be obtained, an aqueous resin composition containing the polycarbodiimide compound, and a food packaging having a layer formed of the aqueous resin composition. A polycarbodiimide compound (A) represented by formula (1) below,
##STR00001##
wherein R.sup.1 represents a residue obtained by removing a functional group capable of reacting with isocyanate from a hydrophilic compound having the functional group capable of reacting with isocyanate, R.sup.2 represents a divalent residue obtained by removing an isocyanate group from an aliphatic diisocyanate compound, and R.sup.3 represents a divalent residue obtained by removing a hydroxyl group from a glycol compound having 2 or 3 carbon atoms; X represents a group that is formed by reaction between the hydrophilic compound and the aliphatic diisocyanate compound; n1 represents a number of 1 to 10, n2 represents a number of 1 to 10, and p represents a number of 2 to 4; and a plurality of R.sup.1 and R.sup.2 each may be the same or different.