Provided is a joined body comprising a first joined member, a second joined member, and a joining layer that joins the first joined member and the second joined member, wherein the first joined member and the second joined member are each independently one selected from the group consisting of a metal member, a polyamide resin member, and a polyolefin resin member, the joining layer is a layer formed of a resin composition having a co-continuous phase including a continuous phase A formed of the polyamide resin and a continuous phase B formed of the polyolefin resin and has a dispersed domain a distributed in the continuous phase A, a finely dispersed subdomain a distributed in the dispersed domain a, a dispersed domain b distributed in the continuous phase B, and a finely dispersed subdomain b distributed in the dispersed domain b.

Provided is a joined body comprising a first joined member, a second joined member, and a joining layer that joins the first joined member and the second joined member, wherein the first joined member and the second joined member are each independently one selected from the group consisting of a metal member, a polyamide resin member, and a polyolefin resin member, the joining layer is a layer formed of a resin composition having a co-continuous phase including a continuous phase A formed of the polyamide resin and a continuous phase B formed of the polyolefin resin and has a dispersed domain a distributed in the continuous phase A, a finely dispersed subdomain a distributed in the dispersed domain a, a dispersed domain b distributed in the continuous phase B, and a finely dispersed subdomain b distributed in the dispersed domain b.

The present invention provides a bio-inspired polymer compound, and a bio-adhesive having the same, and more particularly, to a bio-inspired polymer compound having biocompatibility and high adhesion ability, and a bio-adhesive comprising the same, wherein as the bio-inspired polymer compound absorbs water, the bio-inspired polymer compound becomes viscous in a swollen state, wherein the bio-inspired polymer compound has repeating units, a unit expressed by Chemical Formula 1 and a unit represented by Chemical Formula 2.

The present invention provides a bio-inspired polymer compound, and a bio-adhesive having the same, and more particularly, to a bio-inspired polymer compound having biocompatibility and high adhesion ability, and a bio-adhesive comprising the same, wherein as the bio-inspired polymer compound absorbs water, the bio-inspired polymer compound becomes viscous in a swollen state, wherein the bio-inspired polymer compound has repeating units, a unit expressed by Chemical Formula 1 and a unit represented by Chemical Formula 2.

The invention provides an adhesion promoter composition comprising at least one polymer A selected from at least one epoxy resin-phenol resin precondensate, a mixture of at least one epoxy resin-phenol resin precondensate and epoxy resins, a mixture of epoxy resins and phenol resins, polyamide resins and mixtures thereof, and at least one copolyamide-based hotmelt adhesive. Additionally described is a primer composition comprising at least one polymer B selected from saturated polyester resins, epoxy-phenol resin precondensates, mixtures of epoxy resins and phenol resins, and mixtures thereof, at least one crosslinker resin selected from the group consisting of melamine resins, blocked isocyanate resins and mixtures thereof, at least one catalyst, and at least one copolyamide-based hotmelt adhesive.

The invention provides an adhesion promoter composition comprising at least one polymer A selected from at least one epoxy resin-phenol resin precondensate, a mixture of at least one epoxy resin-phenol resin precondensate and epoxy resins, a mixture of epoxy resins and phenol resins, polyamide resins and mixtures thereof, and at least one copolyamide-based hotmelt adhesive. Additionally described is a primer composition comprising at least one polymer B selected from saturated polyester resins, epoxy-phenol resin precondensates, mixtures of epoxy resins and phenol resins, and mixtures thereof, at least one crosslinker resin selected from the group consisting of melamine resins, blocked isocyanate resins and mixtures thereof, at least one catalyst, and at least one copolyamide-based hotmelt adhesive.

The invention provides an adhesion promoter composition comprising at least one polymer A selected from at least one epoxy resin-phenol resin precondensate, a mixture of at least one epoxy resin-phenol resin precondensate and epoxy resins, a mixture of epoxy resins and phenol resins, polyamide resins and mixtures thereof, and at least one copolyamide-based hotmelt adhesive. Additionally described is a primer composition comprising at least one polymer B selected from saturated polyester resins, epoxy-phenol resin precondensates, mixtures of epoxy resins and phenol resins, and mixtures thereof, at least one crosslinker resin selected from the group consisting of melamine resins, blocked isocyanate resins and mixtures thereof, at least one catalyst, and at least one copolyamide-based hotmelt adhesive.

The aim of the invention is to effectively protect a flat adhesive compound from permeates originating from the surroundings as well as from permeates trapped during lamination, winding, stacking or other processing steps. For this purpose, the adhesive tape comprises at least the following layers in the indicated order: a first outer adhesive compound layer A, a layer B, which contains at least one inorganic getter material, and a second outer adhesive compound layer C. The invention also relates to the use of said adhesive tape as an encapsulation material.

The aim of the invention is to effectively protect a flat adhesive compound from permeates originating from the surroundings as well as from permeates trapped during lamination, winding, stacking or other processing steps. For this purpose, the adhesive tape comprises at least the following layers in the indicated order: a first outer adhesive compound layer A, a layer B, which contains at least one inorganic getter material, and a second outer adhesive compound layer C. The invention also relates to the use of said adhesive tape as an encapsulation material.

Provided are a curable resin composition having high durability and adherence to a base material such as a metal, a molded composite member formed by coating the base material with the curable resin composition and performing resin molding, and a production method for the same. The curable resin composition contains a polyamide-based resin, a blocked polyisocyanate, and an epoxy compound, and the polyamide-based resin has an amino group concentration from 20 to 300 mmol/kg, and has a water absorption of 1 mass % or less determined by a water absorption test specified by ASTM D570. The polyamide-based resin has a C.sub.8-18 alkylene chain and has a melting point from 160 to 250? C. Per 1 mol of amino groups of the polyamide-based resin, a proportion of isocyanate groups of the blocked polyisocyanate is from 1.5 to 5 mol, and a proportion of epoxy groups of the epoxy compound is from 0.1 to 0.8 mol.