The present invention provides a bio-inspired polymer compound, and a bio-adhesive having the same, and more particularly, to a bio-inspired polymer compound having biocompatibility and high adhesion ability, and a bio-adhesive comprising the same, wherein as the bio-inspired polymer compound absorbs water, the bio-inspired polymer compound becomes viscous in a swollen state, wherein the bio-inspired polymer compound has repeating units, a unit expressed by Chemical Formula 1 and a unit represented by Chemical Formula 2.

The present invention provides a bio-inspired polymer compound, and a bio-adhesive having the same, and more particularly, to a bio-inspired polymer compound having biocompatibility and high adhesion ability, and a bio-adhesive comprising the same, wherein as the bio-inspired polymer compound absorbs water, the bio-inspired polymer compound becomes viscous in a swollen state, wherein the bio-inspired polymer compound has repeating units, a unit expressed by Chemical Formula 1 and a unit represented by Chemical Formula 2.

Composition comprising, on a weight basis, the total being equal to 100%: from 98% to 100% of at least one copolyamide bearing amide units and polyether units, having a melting point (T.sub.m) from about 90 to about 150 C., in particular from about 100 C. to about 125 C., and having a flexural modulus of less than 100 MPa, as determined according to standard ISO 178 (2010); from 0 to 2% of at least one additive chosen from stabilizers and dyes, or a mixture thereof,
for the manufacture of a heat-sensitive adhesive, in particular a veil, a film, granules, a filament, a grate, a powder or a suspension.

Composition comprising, on a weight basis, the total being equal to 100%: from 98% to 100% of at least one copolyamide bearing amide units and polyether units, having a melting point (T.sub.m) from about 90 to about 150 C., in particular from about 100 C. to about 125 C., and having a flexural modulus of less than 100 MPa, as determined according to standard ISO 178 (2010); from 0 to 2% of at least one additive chosen from stabilizers and dyes, or a mixture thereof,
for the manufacture of a heat-sensitive adhesive, in particular a veil, a film, granules, a filament, a grate, a powder or a suspension.

A resin composition, preferably an adhesive composition, comprising a polyether polyamide elastomer capable of being strongly bended with a polyimide resin, preferably strongly bended through an easy process to form an interface between the polyimide resin and the composition, and a bonded composite having the resin composition and a polyimide resin which together form an interface to be bonded with each other. A resin composition for forming an interface together with a polyimide resin for bonding, wherein the resin composition comprises a polyether polyamide elastomer (component R) obtained by subjecting a specific aminocarboxylic acid compound A1 and/or lactam compound A2, polyether compound B, and dicarboxylic acid compound C to polymerization, wherein the content of the component R in the resin composition is 80 to 100% by weight.

A resin composition, preferably an adhesive composition, comprising a polyether polyamide elastomer capable of being strongly bended with a polyimide resin, preferably strongly bended through an easy process to form an interface between the polyimide resin and the composition, and a bonded composite having the resin composition and a polyimide resin which together form an interface to be bonded with each other. A resin composition for forming an interface together with a polyimide resin for bonding, wherein the resin composition comprises a polyether polyamide elastomer (component R) obtained by subjecting a specific aminocarboxylic acid compound A1 and/or lactam compound A2, polyether compound B, and dicarboxylic acid compound C to polymerization, wherein the content of the component R in the resin composition is 80 to 100% by weight.

A multi-phasic polymer blend for energy activated edge banding adhesion to a substrate is described. While the blend may be used for adhering edge banding to straight substrates, the blend is preferred for adhering edge banding to contoured substrates. The outer, hard, structural layer of the edge banding is formed from a polypropylene component. The polypropylene component at least includes polypropylene and an optional energy adsorber. The inner adhesion layer of the edge banding is formed from a multi-phasic polymer blend that bonds the outer layer of the edge banding to the substrate. The multi-phasic polymer blend at least includes a polyamide component, a polyolefin component, and a modified polypropylene component. Both the outer and inner layers forming the edge banding may be tinted to conform or contrast with the color of the finished substrate.

A multi-phasic polymer blend for energy activated edge banding adhesion to a substrate is described. While the blend may be used for adhering edge banding to straight substrates, the blend is preferred for adhering edge banding to contoured substrates. The outer, hard, structural layer of the edge banding is formed from a polypropylene component. The polypropylene component at least includes polypropylene and an optional energy adsorber. The inner adhesion layer of the edge banding is formed from a multi-phasic polymer blend that bonds the outer layer of the edge banding to the substrate. The multi-phasic polymer blend at least includes a polyamide component, a polyolefin component, and a modified polypropylene component. Both the outer and inner layers forming the edge banding may be tinted to conform or contrast with the color of the finished substrate.

A polyamide adhesive and an insulating composite layer, and preparation methods and uses thereof are provided. The polyamide adhesive includes the following raw materials in parts by weight: 70-90 parts of polyamide resin, 10-30 parts of bisphenol epoxy resin, 0.01-0.5 parts of an imidazole curing agent and 0.1-2 parts of a silane coupling agent. The preparation method includes: (1) weighing each raw material; (2) adding polyamide resin into an organic solvent, and stirring for dissolution; (3) adding bisphenol epoxy resin, imidazole curing agent and silane coupling agent, and stirring for reaction to obtain the product.

A polyamide adhesive and an insulating composite layer, and preparation methods and uses thereof are provided. The polyamide adhesive includes the following raw materials in parts by weight: 70-90 parts of polyamide resin, 10-30 parts of bisphenol epoxy resin, 0.01-0.5 parts of an imidazole curing agent and 0.1-2 parts of a silane coupling agent. The preparation method includes: (1) weighing each raw material; (2) adding polyamide resin into an organic solvent, and stirring for dissolution; (3) adding bisphenol epoxy resin, imidazole curing agent and silane coupling agent, and stirring for reaction to obtain the product.