A medical tissue adhesive and a preparation method thereof. The medical tissue adhesive includes: a functional component, an assistant crosslinker and a dispersing agent. The functional component is a polymer chain modified by tissue adhesive group or a micro nano particle modified by tissue-adhering functional groups. The tissue-adhering functional groups includes: o-nitrobenzyl photoplate group, active ester group or carbonyl group. The medical tissue adhesive not only uses the dispersing agent to expel the tissue fluid/blood on the tissue surface, so that the adhesive molecular segment quickly forms a chemical bond with the amino group on the tissue surface to form a strong tissue adhesive force. But the medical tissue adhesive can also trigger the adhesive molecular segment to react with the amino group on the assistant crosslinker, so that the medical tissue adhesive can quickly gel and solidify. Therefore, it has good bleeding performance, hemostatic performance and tissue adhesion performance.

A medical tissue adhesive and a preparation method thereof. The medical tissue adhesive includes: a functional component, an assistant crosslinker and a dispersing agent. The functional component is a polymer chain modified by tissue adhesive group or a micro nano particle modified by tissue-adhering functional groups. The tissue-adhering functional groups includes: o-nitrobenzyl photoplate group, active ester group or carbonyl group. The medical tissue adhesive not only uses the dispersing agent to expel the tissue fluid/blood on the tissue surface, so that the adhesive molecular segment quickly forms a chemical bond with the amino group on the tissue surface to form a strong tissue adhesive force. But the medical tissue adhesive can also trigger the adhesive molecular segment to react with the amino group on the assistant crosslinker, so that the medical tissue adhesive can quickly gel and solidify. Therefore, it has good bleeding performance, hemostatic performance and tissue adhesion performance.

Provided is a joined body comprising a first joined member, a second joined member, and a joining layer that joins the first joined member and the second joined member, wherein the first joined member and the second joined member are each independently one selected from the group consisting of a metal member, a polyamide resin member, and a polyolefin resin member, the joining layer is a layer formed of a resin composition having a co-continuous phase including a continuous phase A formed of the polyamide resin and a continuous phase B formed of the polyolefin resin and has a dispersed domain a distributed in the continuous phase A, a finely dispersed subdomain a distributed in the dispersed domain a, a dispersed domain b distributed in the continuous phase B, and a finely dispersed subdomain b distributed in the dispersed domain b.

Provided is a joined body comprising a first joined member, a second joined member, and a joining layer that joins the first joined member and the second joined member, wherein the first joined member and the second joined member are each independently one selected from the group consisting of a metal member, a polyamide resin member, and a polyolefin resin member, the joining layer is a layer formed of a resin composition having a co-continuous phase including a continuous phase A formed of the polyamide resin and a continuous phase B formed of the polyolefin resin and has a dispersed domain a distributed in the continuous phase A, a finely dispersed subdomain a distributed in the dispersed domain a, a dispersed domain b distributed in the continuous phase B, and a finely dispersed subdomain b distributed in the dispersed domain b.

The present invention relates to a binder composition comprising component A comprising polymer(s) A1 and optionally component B comprising component B1 which is selected from the group consisting of a mono-saccharide s, disaccharides, hydroxyacetone, glycolaldehyde and mixtures thereof, wherein polymer(s) A1 comprises at least 70 wt.-% poly(amino acid)s based on the total weight of the polymers) A1 and has (have) a total weight average molecular weight M.sub.w,total of 800 g/mol to 10.000 g/mol, wherein the binder composition comprises 60 to 100 wt.-% polymer(s) A1, and 0 to 40 wt.-% component B1, based on the total weight of the sum of polymer(s) A1 and component B1, wherein the weight amounts of the polymer(s) A1 and component B1 are selected such that the total weight of the sum of polymer(s) A1 and component B1 is 100 wt.-%.

The present invention relates to a binder composition comprising component A comprising polymer(s) A1 and optionally component B comprising component B1 which is selected from the group consisting of a mono-saccharide s, disaccharides, hydroxyacetone, glycolaldehyde and mixtures thereof, wherein polymer(s) A1 comprises at least 70 wt.-% poly(amino acid)s based on the total weight of the polymers) A1 and has (have) a total weight average molecular weight M.sub.w,total of 800 g/mol to 10.000 g/mol, wherein the binder composition comprises 60 to 100 wt.-% polymer(s) A1, and 0 to 40 wt.-% component B1, based on the total weight of the sum of polymer(s) A1 and component B1, wherein the weight amounts of the polymer(s) A1 and component B1 are selected such that the total weight of the sum of polymer(s) A1 and component B1 is 100 wt.-%.

A semiconductor package includes a semiconductor die, a substrate for supporting the semiconductor die, an encapsulant covering the semiconductor die and at least part of the substrate, and a die attach material attaching the semiconductor die to the substrate. The die attach material includes molecules having a first functional group with at least one free electron pair and a second functional group chemically reacted or reactable with the encapsulant in a way that promotes adhesion with the encapsulant. A corresponding method of manufacturing the semiconductor package is also described.

A semiconductor package includes a semiconductor die, a substrate for supporting the semiconductor die, an encapsulant covering the semiconductor die and at least part of the substrate, and a die attach material attaching the semiconductor die to the substrate. The die attach material includes molecules having a first functional group with at least one free electron pair and a second functional group chemically reacted or reactable with the encapsulant in a way that promotes adhesion with the encapsulant. A corresponding method of manufacturing the semiconductor package is also described.

A semiconductor package includes a semiconductor die, a substrate for supporting the semiconductor die, an encapsulant covering the semiconductor die and at least part of the substrate, and a die attach material attaching the semiconductor die to the substrate. The die attach material includes molecules having a first functional group with at least one free electron pair and a second functional group chemically reacted or reactable with the encapsulant in a way that promotes adhesion with the encapsulant. A corresponding method of manufacturing the semiconductor package is also described.

A tissue adhesive membrane and a preparation method thereof are provided. The tissue adhesive membrane includes a supramolecular polymer and an enhancer; the supramolecular polymer is prepared by copolymerization of lipoic acid and a biocompatible stabilizer; and the enhancer includes at least one selected from the group consisting of a cationic compound, a cationic polymer, and a metal particle. The tissue adhesive membrane of the present invention can achieve rapid adhesion, seal wounds continuously and effectively, and maintain long-lasting mechanical strength. The components of the tissue adhesive membrane come from natural components of animals and plants, have good biocompatibility, and possess the functions of antibacterial and inhibiting inflammation. The tissue adhesive membrane of the present invention is a hydrophobic adhesive membrane where hydrogen bonding and high surface energy can provide strong adhesion energy and no adverse active groups that may cause irritation or discomfort are contained.