A reactive PSA film that includes: (a) a polymeric film former matrix; (b) one or more reactive components; and (c) a reagent selected from an initiator, a curing agent and an activator. The component (b) is present at a mass fraction of 30%, as based on the sum of (a), (b) and (c). Further, ≥50 wt % of the polymer film former matrix is a crystallizable polymer which: (i) exhibits a crystallization enthalpy of <1 J/g in a DSC measurement on cooling at 10 K/min from at least 30K above a peak temperature of the melting peak of the matrix and ≥100° C.; and (ii) exhibits a crystallite fusion enthalpy of ≥15 mJ/mg in its pure state in a first heating curve of a DSC measurement at 10 K/min and after storage for ≥ one month from 15 to 25° C. and relative humidity from 30 to 70%.

Thermoplastic polyamide moulding composition consisting of: (A) 30-99.9 percent by weight of at least one polyamide selected from the group consisting of: at least one aliphatic or semiaromatic polyamide, in each case with C:N ratio at least 8; at least one aliphatic or semiaromatic polyamide composed of at least one dicarboxylic acid and of at least one diamine and also optionally a proportion below 50 mol percent based on the entirety of dicarboxylic acids and diamine as 100 mol percent, of lactams and/or aminocarboxylic acids; and mixtures thereof; (B) 0.1-5.0 percent by weight of polyethyleneimine (PEI) or copolymers or derivatives thereof; (C) 0-60 percent by weight of fillers and/or reinforcing materials; (D) 0-5.0 percent by weight of additives;
where the entirety of (A)-(D) provides 100% of the thermoplastic polyamide moulding composition, and also uses of such moulding compositions in particular in the context of components bonded to mineral glass.

Thermoplastic polyamide moulding composition consisting of: (A) 30-99.9 percent by weight of at least one polyamide selected from the group consisting of: at least one aliphatic or semiaromatic polyamide, in each case with C:N ratio at least 8; at least one aliphatic or semiaromatic polyamide composed of at least one dicarboxylic acid and of at least one diamine and also optionally a proportion below 50 mol percent based on the entirety of dicarboxylic acids and diamine as 100 mol percent, of lactams and/or aminocarboxylic acids; and mixtures thereof; (B) 0.1-5.0 percent by weight of polyethyleneimine (PEI) or copolymers or derivatives thereof; (C) 0-60 percent by weight of fillers and/or reinforcing materials; (D) 0-5.0 percent by weight of additives;
where the entirety of (A)-(D) provides 100% of the thermoplastic polyamide moulding composition, and also uses of such moulding compositions in particular in the context of components bonded to mineral glass.

The present invention relates to a polyamide, to a composition comprising same, and to the use thereof, and also to a molded article deriving therefrom and to a process for producing same. The polyamide is particularly suitable as hot-melt adhesive for the low-pressure and low-temperature overmolding of a heat-sensitive battery, for example a lithium-polymer battery.

The present invention relates to a polyamide, to a composition comprising same, and to the use thereof, and also to a molded article deriving therefrom and to a process for producing same. The polyamide is particularly suitable as hot-melt adhesive for the low-pressure and low-temperature overmolding of a heat-sensitive battery, for example a lithium-polymer battery.

It is provided that a biaxially stretched polyamide film that has excellent resistance to pinhole formation due to bending, has excellent resistance to pinhole formation due to repeated contact, has excellent piercing resistance, and further can suppress generation of foreign matter during film formation. A biaxially stretched polyimide film comprising a functional layer (layer B) laminated on at least one surface of a base layer (layer A), wherein the base layer (layer A) contains at least (a) 70 to 99% by mass of a polyamide 6 resin, and (b) 1 to 20% by mass of an aliphatic or aromatic-aliphatic polyester resin, and the functional layer (layer B) contains at least 70% by mass or more of a polyamide 6 resin.

It is provided that a biaxially stretched polyamide film that has excellent resistance to pinhole formation due to bending, has excellent resistance to pinhole formation due to repeated contact, has excellent piercing resistance, and further can suppress generation of foreign matter during film formation. A biaxially stretched polyimide film comprising a functional layer (layer B) laminated on at least one surface of a base layer (layer A), wherein the base layer (layer A) contains at least (a) 70 to 99% by mass of a polyamide 6 resin, and (b) 1 to 20% by mass of an aliphatic or aromatic-aliphatic polyester resin, and the functional layer (layer B) contains at least 70% by mass or more of a polyamide 6 resin.

The invention concerns a removable composition formed by at least: a polyamide or a copolyamide or a mixture of polyamides or a mixture of copolyamides or a mixture of at least one polyamide and at least one copolyamide, the polyamide(s) and copolyamide(s) being soluble in alcohol, and an expansion agent, the maximum expansion temperature of which is greater than the melting point of the polyamide or the copolyamide or of the mixture. The invention also relates to assemblies comprising such a composition, the use thereof and a method for detaching the composition.

The invention concerns a removable composition formed by at least: a polyamide or a copolyamide or a mixture of polyamides or a mixture of copolyamides or a mixture of at least one polyamide and at least one copolyamide, the polyamide(s) and copolyamide(s) being soluble in alcohol, and an expansion agent, the maximum expansion temperature of which is greater than the melting point of the polyamide or the copolyamide or of the mixture. The invention also relates to assemblies comprising such a composition, the use thereof and a method for detaching the composition.

The invention concerns a removable composition formed by at least: a polyamide or a copolyamide or a mixture of polyamides or a mixture of copolyamides or a mixture of at least one polyamide and at least one copolyamide, the polyamide(s) and copolyamide(s) being soluble in alcohol, and an expansion agent, the maximum expansion temperature of which is greater than the melting point of the polyamide or the copolyamide or of the mixture. The invention also relates to assemblies comprising such a composition, the use thereof and a method for detaching the composition.