Thermoplastic polyamide moulding composition consisting of: (A) 30-99.9 percent by weight of at least one polyamide selected from the group consisting of: at least one aliphatic or semiaromatic polyamide, in each case with C:N ratio at least 8; at least one aliphatic or semiaromatic polyamide composed of at least one dicarboxylic acid and of at least one diamine and also optionally a proportion below 50 mol percent based on the entirety of dicarboxylic acids and diamine as 100 mol percent, of lactams and/or aminocarboxylic acids; and mixtures thereof; (B) 0.1-5.0 percent by weight of polyethyleneimine (PEI) or copolymers or derivatives thereof; (C) 0-60 percent by weight of fillers and/or reinforcing materials; (D) 0-5.0 percent by weight of additives;
where the entirety of (A)-(D) provides 100% of the thermoplastic polyamide moulding composition, and also uses of such moulding compositions in particular in the context of components bonded to mineral glass.

A specific polyamide polymer which is obtainable by two specific processes according to the invention. The invention further relates to the use of this polyamide polymer as a functional additive and to detergent compositions, cosmetic compositions, cleaning compositions and adhesive compositions including this polyamide polymer.

Semicrystalline polyamide comprising at least one monomer resulting from the condensation of a diacid and a diamine of formula AP.Y, said semicrystalline polyamide having the following general formula (I):

AP.Y/(A).sub.m/(Pip.Y).sub.n/(B.Y).sub.q (1)

and said semicrystalline polyamide having a Tm.sub.1 less than or equal to about 150 C., notably less than or equal to about 130 C., in particular less than or equal to about 120 C. and/or a Tg less than or equal to about 60 C., in particular less than Or equal to about 50 C., notably less than or equal to about 40 C., as determined by DSC according to standard ISO 11357-3 (2013) and ISO 11357-2 (2013), respectively.

Semicrystalline polyamide comprising at least one monomer resulting from the condensation of a diacid and a diamine of formula AP.Y, said semicrystalline polyamide having the following general formula (I):

AP.Y/(A).sub.m/(Pip.Y).sub.n/(B.Y).sub.q (1)

and said semicrystalline polyamide having a Tm.sub.1 less than or equal to about 150 C., notably less than or equal to about 130 C., in particular less than or equal to about 120 C. and/or a Tg less than or equal to about 60 C., in particular less than Or equal to about 50 C., notably less than or equal to about 40 C., as determined by DSC according to standard ISO 11357-3 (2013) and ISO 11357-2 (2013), respectively.

A composition and a solution for temporary bonding are provided. The composition includes a dianhydride monomer, a light-absorbing monomer, and a light-absorbing material. The light-absorbing monomer includes at least one of N,N,N,N-(p-aminophenyl)-p-phenylenediamine (TPDA) and N,N-(p-aminophenyl)-p-phenylenediamine (DPDA). The light-absorbing material includes carbon black and silicon dioxide.

A composition and a solution for temporary bonding are provided. The composition includes a dianhydride monomer, a light-absorbing monomer, and a light-absorbing material. The light-absorbing monomer includes at least one of N,N,N,N-(p-aminophenyl)-p-phenylenediamine (TPDA) and N,N-(p-aminophenyl)-p-phenylenediamine (DPDA). The light-absorbing material includes carbon black and silicon dioxide.

The invention provides a process for producing a hybrid component comprising metal and plastic. The process comprises the steps of a) pretreating the metal surface by applying at least one conversion layer, b) applying at least one layer of an adhesion promoter composition and c) bonding the metal to the plastic. The adhesion promoter composition comprises at least one copolyamide-based hotmelt adhesive.

The invention provides a process for producing a hybrid component comprising metal and plastic. The process comprises the steps of a) pretreating the metal surface by applying at least one conversion layer, b) applying at least one layer of an adhesion promoter composition and c) bonding the metal to the plastic. The adhesion promoter composition comprises at least one copolyamide-based hotmelt adhesive.

The invention provides a process for producing a hybrid component comprising metal and plastic. The process comprises the steps of a) pretreating the metal surface by applying at least one conversion layer, b) applying at least one layer of an adhesion promoter composition and c) bonding the metal to the plastic. The adhesion promoter composition comprises at least one copolyamide-based hotmelt adhesive.

Thermoplastic polyamide moulding composition consisting of: (A) 30-99.9 percent by weight of at least one polyamide selected from the group consisting of: at least one aliphatic or semiaromatic polyamide, in each case with C:N ratio at least 8; at least one aliphatic or semiaromatic polyamide composed of at least one dicarboxylic acid and of at least one diamine and also optionally a proportion below 50 mol percent based on the entirety of dicarboxylic acids and diamine as 100 mol percent, of lactams and/or aminocarboxylic acids; and mixtures thereof; (B) 0.1-5.0 percent by weight of polyethyleneimine (PEI) or copolymers or derivatives thereof; (C) 0-60 percent by weight of fillers and/or reinforcing materials; (D) 0-5.0 percent by weight of additives; where the entirety of (A)-(D) provides 100% of the thermoplastic polyamide moulding composition, and also uses of such moulding compositions in particular in the context of components bonded to mineral glass.