Thermoplastic polyamide moulding composition consisting of: (A) 30-99.9 percent by weight of at least one polyamide selected from the group consisting of: at least one aliphatic or semiaromatic polyamide, in each case with C:N ratio at least 8; at least one aliphatic or semiaromatic polyamide composed of at least one dicarboxylic acid and of at least one diamine and also optionally a proportion below 50 mol percent based on the entirety of dicarboxylic acids and diamine as 100 mol percent, of lactams and/or aminocarboxylic acids; and mixtures thereof; (B) 0.1-5.0 percent by weight of polyethyleneimine (PEI) or copolymers or derivatives thereof; (C) 0-60 percent by weight of fillers and/or reinforcing materials; (D) 0-5.0 percent by weight of additives; where the entirety of (A)-(D) provides 100% of the thermoplastic polyamide moulding composition, and also uses of such moulding compositions in particular in the context of components bonded to mineral glass.

A semi-crystalline polyamide including at least one monomer resulting from the condensation of a diacid and of a diamine of formula AP.Y, the semi-crystalline polyamide having the following general formula (I): AP.Y/(A)m/(Pip.Y)n/(B.Y)q and the semi-crystalline polyamide having an Mp1 less than or equal to approximately 150 C., in particular less than or equal to approximately 130 C., in particular less than or equal to approximately 120 C. and/or a Tg less than or equal to approximately 60 C., in particular less than or equal to approximately 50 C., in particular less than or equal to approximately 40 C., as determined respectively by DSC according to standard ISO 11357-3 (2013) and ISO 11357-2 (2013).

A semi-crystalline polyamide including at least one monomer resulting from the condensation of a diacid and of a diamine of formula AP.Y, the semi-crystalline polyamide having the following general formula (I): AP.Y/(A)m/(Pip.Y)n/(B.Y)q and the semi-crystalline polyamide having an Mp1 less than or equal to approximately 150 C., in particular less than or equal to approximately 130 C., in particular less than or equal to approximately 120 C. and/or a Tg less than or equal to approximately 60 C., in particular less than or equal to approximately 50 C., in particular less than or equal to approximately 40 C., as determined respectively by DSC according to standard ISO 11357-3 (2013) and ISO 11357-2 (2013).

A reactive PSA film that includes: (a) a polymeric film former matrix; (b) one or more reactive components; and (c) a reagent selected from an initiator, a curing agent and an activator. The component (b) is present at a mass fraction of 30%, as based on the sum of (a), (b) and (c). Further, 50 wt % of the film former matrix is a crystallizable polymer which: (i) exhibits a crystallization enthalpy of <1 J/g in a DSC measurement on cooling at 10K/min from at least 30K above a peak temperature of the melting peak of the polymer or 100 C., whichever is greater; and (ii) exhibits a crystallite fusion enthalpy of 15 mJ/mg in its pure state in a first heating curve of a DSC measurement at 10K/min and after storage for one month from 15 to 25 C. and relative humidity from 30 to 70%.

A reactive PSA film that includes: (a) a polymeric film former matrix; (b) one or more reactive components; and (c) a reagent selected from an initiator, a curing agent and an activator. The component (b) is present at a mass fraction of 30%, as based on the sum of (a), (b) and (c). Further, 50 wt % of the film former matrix is a crystallizable polymer which: (i) exhibits a crystallization enthalpy of <1 J/g in a DSC measurement on cooling at 10K/min from at least 30K above a peak temperature of the melting peak of the polymer or 100 C., whichever is greater; and (ii) exhibits a crystallite fusion enthalpy of 15 mJ/mg in its pure state in a first heating curve of a DSC measurement at 10K/min and after storage for one month from 15 to 25 C. and relative humidity from 30 to 70%.

The present invention relates to a binder composition comprising a) component A comprising polymer(s) A1 having primary and/or secondary amino groups, wherein polymer(s) A1 has(have) a primary and secondary amine group nitrogen content of at least 1 wt.-% and b) component B comprising component B1 which is 1,3-dihydroxyacetone, glycolaldehyde, glyceraldehyde or any mixture thereof, wherein the polymer(s) A1 has(have) a total weight average molecular weight M.sub.w,total of at least 800 g/mol.

The present invention relates to a binder composition comprising a) component A comprising polymer(s) A1 having primary and/or secondary amino groups, wherein polymer(s) A1 has(have) a primary and secondary amine group nitrogen content of at least 1 wt.-% and b) component B comprising component B1 which is 1,3-dihydroxyacetone, glycolaldehyde, glyceraldehyde or any mixture thereof, wherein the polymer(s) A1 has(have) a total weight average molecular weight M.sub.w,total of at least 800 g/mol.

A two-part curable composition is provided that includes a first part that includes an oxamido-containing compound and a second part that includes an epoxy resin. The oxamido-containing compound includes at least one first segment derived from a first polyamine and at least one second segment derived from a second polyamine that is different than the first polyamine. The oxamido-containing compound has at least two amino (NH.sub.2) groups that can react with the epoxy resin in the second part of the curable composition. Each part of the curable composition is flowable, often at room temperature or slightly above room temperature, and can be mixed to form a cured composition having structural bonding performance.

A two-part curable composition is provided that includes a first part that includes an oxamido-containing compound and a second part that includes an epoxy resin. The oxamido-containing compound includes at least one first segment derived from a first polyamine and at least one second segment derived from a second polyamine that is different than the first polyamine. The oxamido-containing compound has at least two amino (NH.sub.2) groups that can react with the epoxy resin in the second part of the curable composition. Each part of the curable composition is flowable, often at room temperature or slightly above room temperature, and can be mixed to form a cured composition having structural bonding performance.

A composition and a solution for temporary bonding are provided. The composition includes a dianhydride monomer, a light-absorbing monomer, and a light-absorbing material. The light-absorbing monomer includes at least one of N,N,N,N-(p-aminophenyl)-p-phenylenediamine (DPDA) and N,N-(p-aminophenyl)-p-phenylenediamine (TPDA). The light-absorbing material includes carbon black and silicon dioxide.