A composition and a solution for temporary bonding are provided. The composition includes a dianhydride monomer, a light-absorbing monomer, and a light-absorbing material. The light-absorbing monomer includes at least one of N,N,N,N-(p-aminophenyl)-p-phenylenediamine (DPDA) and N,N-(p-aminophenyl)-p-phenylenediamine (TPDA). The light-absorbing material includes carbon black and silicon dioxide.

This invention relates to polyetheramines based on 1,3-dialcohols, in particular to an etheramine mixture comprising at least 90% by weight, based on the total weight of the etheramine mixture, of an amine of Formula (I) and/or (II), ##STR00001##
wherein R.sub.1-R.sub.12 are independently selected from H, alkyl, cycloalkyl, aryl, alkylaryl, or arylalkyl, wherein at least one of R.sub.1-R.sub.6 and at least one of R.sub.7-R.sub.12 is different from H, wherein A.sub.1-A.sub.9 are independently selected from linear or branched alkylenes having 2 to 18 carbon atoms, wherein Z.sub.1-Z.sub.4 are independently selected OH, CH.sub.2CH.sub.2CH.sub.2NH.sub.2, NH.sub.2, NHR or NRR, wherein the degree of amination is <50%, wherein R and R are independently selected from alkylenes having 2-6 carbon atoms, and wherein the sum of x+y is in the range of from 2 to 200, wherein x1 and y1; and x.sub.1+y.sub.1 is in the range of from 2 to 200.

This invention relates to polyetheramines based on 1,3-dialcohols, in particular to an etheramine mixture comprising at least 90% by weight, based on the total weight of the etheramine mixture, of an amine of Formula (I) and/or (II), ##STR00001##
wherein R.sub.1-R.sub.12 are independently selected from H, alkyl, cycloalkyl, aryl, alkylaryl, or arylalkyl, wherein at least one of R.sub.1-R.sub.6 and at least one of R.sub.7-R.sub.12 is different from H, wherein A.sub.1-A.sub.9 are independently selected from linear or branched alkylenes having 2 to 18 carbon atoms, wherein Z.sub.1-Z.sub.4 are independently selected OH, CH.sub.2CH.sub.2CH.sub.2NH.sub.2, NH.sub.2, NHR or NRR, wherein the degree of amination is <50%, wherein R and R are independently selected from alkylenes having 2-6 carbon atoms, and wherein the sum of x+y is in the range of from 2 to 200, wherein x1 and y1; and x.sub.1+y.sub.1 is in the range of from 2 to 200.

An adhesive composition including predominantly one or two polyamide(s) having units chosen from: at least one unit denoted A with a mean number of carbon atoms per nitrogen atom, denoted CA, ranging from 4 to 8.5, advantageously from 4 to 7; at least one unit denoted B with a mean number of carbon atoms per nitrogen atom, denoted CB, ranging from 7 to 10, advantageously from 7.5 to 9.5; at least one unit denoted C with a mean number of carbon atoms per nitrogen atom, denoted CC, ranging from 9 to 18, advantageously from 10 to 18, and to the use thereof.

An adhesive composition including predominantly one or two polyamide(s) having units chosen from: at least one unit denoted A with a mean number of carbon atoms per nitrogen atom, denoted CA, ranging from 4 to 8.5, advantageously from 4 to 7; at least one unit denoted B with a mean number of carbon atoms per nitrogen atom, denoted CB, ranging from 7 to 10, advantageously from 7.5 to 9.5; at least one unit denoted C with a mean number of carbon atoms per nitrogen atom, denoted CC, ranging from 9 to 18, advantageously from 10 to 18, and to the use thereof.

An adhesive composition is provided which exhibits not only adhesiveness to a polyimide film or copper foil, but also high adhesiveness to gold-plated copper foil, and is also superior in heat resistance such as soldering heat resistance.

The adhesive composition comprises a solvent-soluble polyamide resin (A) which is solid at 25 C., an epoxy resin (B), and an imidazole compound (C) having an alkoxysilyl group, wherein the mass ratio (A)/(B) of the component (A) to the component (B) is 99/1-50/50, and the content of the component (C) is 0.3-5 parts by mass with respect to 100 parts by mass of the total of the component (A) and the component (B).

An adhesive composition is provided which exhibits not only adhesiveness to a polyimide film or copper foil, but also high adhesiveness to gold-plated copper foil, and is also superior in heat resistance such as soldering heat resistance.

The adhesive composition comprises a solvent-soluble polyamide resin (A) which is solid at 25 C., an epoxy resin (B), and an imidazole compound (C) having an alkoxysilyl group, wherein the mass ratio (A)/(B) of the component (A) to the component (B) is 99/1-50/50, and the content of the component (C) is 0.3-5 parts by mass with respect to 100 parts by mass of the total of the component (A) and the component (B).

An adhesive agent comprising a condensation resin having a structural unit obtained by polycondensing a polymerizable monomer containing a monomer (A) having 2 or more carboxyl groups and a monomer (B) having 2 or more amino groups, and meeting at least one of the following (1) and (2), and the following (3): (1) at least one selected from the group consisting of the monomer (A), an anhydride of the monomer (A), and the monomer (B) is liquid at 25 C.; (2) the condensation resin has a polyoxyalkanediyl group; and (3) the condensation resin has a cyclohexane ring.

An adhesive agent comprising a condensation resin having a structural unit obtained by polycondensing a polymerizable monomer containing a monomer (A) having 2 or more carboxyl groups and a monomer (B) having 2 or more amino groups, and meeting at least one of the following (1) and (2), and the following (3): (1) at least one selected from the group consisting of the monomer (A), an anhydride of the monomer (A), and the monomer (B) is liquid at 25 C.; (2) the condensation resin has a polyoxyalkanediyl group; and (3) the condensation resin has a cyclohexane ring.

The invention provides an adhesion promoter composition comprising at least one polymer A selected from at least one epoxy resin-phenol resin precondensate, a mixture of at least one epoxy resin-phenol resin precondensate and epoxy resins, a mixture of epoxy resins and phenol resins, polyamide resins and mixtures thereof, and at least one copolyamide-based hotmelt adhesive. Additionally described is a primer composition comprising at least one polymer B selected from saturated polyester resins, epoxy-phenol resin precondensates, mixtures of epoxy resins and phenol resins, and mixtures thereof, at least one crosslinker resin selected from the group consisting of melamine resins, blocked isocyanate resins and mixtures thereof, at least one catalyst, and at least one copolyamide-based hotmelt adhesive.